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Surface mounted electronic componentSurface mounted electronic component description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20080070429, Surface mounted electronic component. Brief Patent Description - Full Patent Description - Patent Application Claims
TECHNICAL FIELD [0001]The present invention generally relates to electronic components, and more particularly relates to a surface mounted electronic component. BACKGROUND [0002]Tombstoning`, also known as Drawbridge effect or Manhattan Skyline effect, is considered a common defect in surface mounting technology. `Tombstoning`, i.e., a phenomenon where electronic components erect like tombstones, is due to unbalanced surface tension of two soldered end portions of an electronic component. Particularly, when a low mass chip-type electronic component is soldered on a substrate such as a printed circuit board, the unbalanced surface tension may easily occur and draw one soldered end portion to the substrate and the other soldered end portion free, thus causing `tombstoning`. [0003]Generally, the unbalanced surface tension of two soldered end portions occurs due to poor soldering pad design, non-uniform heating of soldering surfaces, low reactivity of solder, non-uniform application of solder and so on. [0004]With the current trend toward miniaturization of electronic devices there is a concomitant trend toward reducing the size of the electronic components themselves. The reduction in size and mass of electronic components has been a significant aid in the miniaturization process but has created problems such as `tombstoning`. Referring to FIG. 9 and FIG. 10, such a typical electronic component 10 is prone to tombstoning on a printed circuit board 12 due to unbalanced surface tension of two soldered end portions. `Tombstoning` can cause electric connections between the electronic component and circuits to be broken, resulting in the electronic component losing its functions and causing a mounting failure. [0005]What is needed, therefore, is a surface mounted electronic component having ability of avoiding `tombstoning`. SUMMARY [0006]One preferred embodiment provides a surface mounted electronic component. The surface mounted electronic component has a block body. The block body includes a bottom soldering surface, a top surface opposite to the bottom soldering surface and a peripheral wall. The bottom soldering surface defines a first soldering area and a second soldering area. The peripheral wall includes a first peripheral wall portion and a second peripheral wall portion. The first peripheral wall portion adjoins the first soldering area of the bottom soldering surface and has a first cutout defined between the first peripheral wall portion and the first soldering area of the bottom soldering surface. The second peripheral wall portion adjoins the second soldering area of the bottom soldering surface and has a second cutout defined between the second peripheral wall portion and the second soldering area of the bottom soldering surface. BRIEF DESCRIPTION OF THE DRAWINGS [0007]Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views. [0008]FIG. 1 is a schematic view of a surface mounted electronic component according to a first embodiment; [0009]FIG. 2 is a bottom view of the surface mounted electronic component according to the first embodiment; [0010]FIG. 3 is a schematic view of a surface mounted electronic component according to a second embodiment; [0011]FIG. 4 is a bottom view of the surface mounted electronic component according to the second embodiment; [0012]FIG. 5 is a schematic view of a surface mounted electronic component according to a third embodiment; [0013]FIG. 6 is a bottom view of the surface mounted electronic component according to the third embodiment; [0014]FIG. 7 is a schematic view of a surface mounted electronic component according to a fourth embodiment; [0015]FIG. 8 is a bottom view of the surface mounted electronic component according to the fourth embodiment; [0016]FIG. 9 is a schematic view of a typical surface mounted electronic component; and [0017]FIG. 10 is a schematic view of `tombstoning` on a typical surface mounted electronic component. DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS [0018]Embodiments will now be described in detail below and with reference to the drawings. [0019]Referring to FIG. 1 and FIG. 2, a surface mounted electronic component 20 according to a first exemplary embodiment is shown. Continue reading about Surface mounted electronic component... Full patent description for Surface mounted electronic component Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Surface mounted electronic component patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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