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Substrate and method of forming substrate for fluid ejection deviceSubstrate and method of forming substrate for fluid ejection device description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20080084452, Substrate and method of forming substrate for fluid ejection device. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND [0001] In some fluid ejection devices, such as printheads, a drop ejecting element is formed on a front side of a substrate and fluid is routed to an ejection chamber of the drop ejecting element through an opening or slot in the substrate. Often, the substrate is a silicon wafer and the slot is formed in the wafer by chemical etching. Existing methods of forming the slot through the substrate include etching into the substrate from the backside of the substrate to the front side of the substrate, where the backside of the substrate is defined as a side of the substrate opposite of which the drop ejecting elements are formed. Unfortunately, etching into the substrate from the backside all the way to the front side may result in misalignment of the slot at the front side and/or varying width of the slot at the front side. BRIEF DESCRIPTION OF THE DRAWINGS [0002] FIG. 1 is a block diagram illustrating one embodiment of an inkjet printing system. [0003] FIG. 2 is a schematic cross-sectional view illustrating one embodiment of a portion of a fluid ejection device. [0004] FIG. 3 is a schematic cross-sectional view illustrating one embodiment of a portion of a fluid ejection device formed on one embodiment of a substrate. [0005] FIGS. 4A-4H illustrate one embodiment of forming an opening through a substrate. DETAILED DESCRIPTION [0006] In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments. In this regard, directional terminology, such as "top," "bottom," "front," "back," "leading," "trailing," etc., is used with reference to the orientation of the Figure(s) being described. Because components described herein can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the disclosure. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims. [0007] FIG. 1 illustrates one embodiment of an inkjet printing system 10. Inkjet printing system 10 constitutes one embodiment of a fluid ejection system which includes a fluid ejection assembly, such as an inkjet printhead assembly 12, and a fluid supply assembly, such as an ink supply assembly 14. In the illustrated embodiment, inkjet printing system 10 also includes a mounting assembly 16, a media transport assembly 18, and an electronic controller 20. [0008] Inkjet printhead assembly 12, as one embodiment of a fluid ejection assembly, includes one or more printheads or fluid ejection devices which eject drops of ink or fluid through a plurality of orifices or nozzles 13. In one embodiment, the drops are directed toward a medium, such as print medium 19, so as to print onto print medium 19. Print medium 19 is any type of suitable sheet material, such as paper, card stock, transparencies, Mylar, fabric, and the like. Typically, nozzles 13 are arranged in one or more columns or arrays such that properly sequenced ejection of ink from nozzles 13 causes, in one embodiment, characters, symbols, and/or other graphics or images to be printed upon print medium 19 as inkjet printhead assembly 12 and print medium 19 are moved relative to each other. [0009] Ink supply assembly 14, as one embodiment of a fluid supply assembly, supplies ink to inkjet printhead assembly 12 and includes a reservoir 15 for storing ink. As such, in one embodiment, ink flows from reservoir 15 to inkjet printhead assembly 12. In one embodiment, inkjet printhead assembly 12 and ink supply assembly 14 are housed together in an inkjet or fluid-jet cartridge or pen. In another embodiment, ink supply assembly 14 is separate from inkjet printhead assembly 12 and supplies ink to inkjet printhead assembly 12 through an interface connection, such as a supply tube. [0010] Mounting assembly 16 positions inkjet printhead assembly 12 relative to media transport assembly 18 and media transport assembly 18 positions print medium 19 relative to inkjet printhead assembly 12. Thus, a print zone 17 is defined adjacent to nozzles 13 in an area between inkjet printhead assembly 12 and print medium 19. In one embodiment, inkjet printhead assembly 12 is a scanning type printhead assembly and mounting assembly 16 includes a carriage for moving inkjet printhead assembly 12 relative to media transport assembly 18. In another embodiment, inkjet printhead assembly 12 is a non-scanning type printhead assembly and mounting assembly 16 fixes inkjet printhead assembly 12 at a prescribed position relative to media transport assembly 18. [0011] Electronic controller 20 communicates with inkjet printhead assembly 12, mounting assembly 16, and media transport assembly 18. Electronic controller 20 receives data 21 from a host system, such as a computer, and may include memory for temporarily storing data 21. Data 21 may be sent to inkjet printing system 10 along an electronic, infrared, optical or other information transfer path. Data 21 represents, for example, a document and/or file to be printed. As such, data 21 forms a print job for inkjet printing system 10 and includes one or more print job commands and/or command parameters. [0012] In one embodiment, electronic controller 20 provides control of inkjet printhead assembly 12 including timing control for ejection of ink drops from nozzles 13. As such, electronic controller 20 defines a pattern of ejected ink drops which form characters, symbols, and/or other graphics or images on print medium 19. Timing control and, therefore, the pattern of ejected ink drops, is determined by the print job commands and/or command parameters. In one embodiment, logic and drive circuitry forming a portion of electronic controller 20 is located on inkjet printhead assembly 12. In another embodiment, logic and drive circuitry forming a portion of electronic controller 20 is located off inkjet printhead assembly 12. [0013] FIG. 2 illustrates one embodiment of a portion of a fluid ejection device 30. Fluid ejection device 30 includes an array of drop ejecting elements 31. Drop ejecting elements 31 are formed on a substrate 40 which has a fluid (or ink) feed slot 41 formed therein. As such, fluid feed slot 41 provides a supply of fluid (or ink) to drop ejecting elements 31. Substrate 40 is formed, for example, of silicon, glass, or ceramic. [0014] In one embodiment, each drop ejecting element 31 includes a thin-film structure 32 with a resistor 34, and an orifice layer 36. Thin-film structure 32 has a fluid (or ink) feed hole 33 formed therein which communicates with fluid feed slot 41 of substrate 40. Orifice layer 36 has a front face 37 and a nozzle opening 38 formed in front face 37. Orifice layer 36 also has a nozzle chamber 39 formed therein which communicates with nozzle opening 38 and fluid feed hole 33 of thin-film structure 32. Resistor 34 is positioned within nozzle chamber 39 and includes leads 35 which electrically couple resistor 34 to a drive signal and ground. [0015] Thin-film structure 32 is formed, for example, by one or more passivation or insulation layers of silicon dioxide, silicon carbide, silicon nitride, tantalum, poly-silicon glass, or other material. In one embodiment, thin-film structure 32 also includes a conductive layer which defines resistor 34 and leads 35. The conductive layer is formed, for example, by aluminum, gold, tantalum, tantalum-aluminum, or other metal or metal alloy. [0016] In one embodiment, during operation, fluid flows from fluid feed slot 41 to nozzle chamber 39 via fluid feed hole 33. Nozzle opening 38 is operatively associated with resistor 34 such that droplets of fluid are ejected from nozzle chamber 39 through nozzle opening 38 (e.g., normal to the plane of resistor 34) and toward a medium upon energization of resistor 34. [0017] Example embodiments of fluid ejection device 30 include a thermal printhead, as previously described, a piezoelectric printhead, a flex-tensional printhead, or any other type of fluid-jet ejection device known in the art. In one embodiment, fluid ejection device 30 is a fully integrated thermal inkjet printhead. [0018] FIG. 3 illustrates another embodiment of a portion of a fluid ejection device 130 of inkjet printhead assembly 12. Fluid ejection device 130 includes an array of drop ejecting elements 131. Drop ejecting elements 131 are formed on a substrate 140 which has a fluid (or ink) feed slot 141 formed therein. As such, fluid feed slot 141 provides a supply of fluid (or ink) to drop ejecting elements 131. Substrate 140 is formed, for example, of silicon, glass, or ceramic. [0019] In one embodiment, drop ejecting elements 131 include a thin-film structure 132 with resistors 134, and an orifice layer 136. Thin-film structure 132 has a fluid (or ink) feed hole 133 formed therein which communicates with fluid feed slot 141 of substrate 140. Orifice layer 136 has a front face 137 and nozzle openings 138 formed in front face 137. Orifice layer 136 also has nozzle chambers 139 formed therein which communicate with respective nozzle openings 138 and fluid feed hole 133. In one embodiment, orifice layer 136 includes a barrier layer 1361 which defines nozzle chambers 139 and a nozzle plate 1362 which defines nozzle openings 138. [0020] In one embodiment, during operation, fluid flows from fluid feed slot 141 to nozzle chambers 139 via fluid feed hole 133. Nozzle openings 138 are operatively associated with respective resistors 134 such that droplets of fluid are ejected from nozzle chambers 139 through nozzle openings 138 and toward a medium upon energization of resistors 134. [0021] As illustrated in the embodiment of FIG. 3, substrate 140 has a first side 143 and a second side 144. Second side 144 is opposite of first side 143 and, in one embodiment, oriented substantially parallel with first side 143. As such, fluid feed hole 133 communicates with first side 143 of substrate 140 and fluid feed slot 141 communicates with second side 144 of substrate 140. Fluid feed hole 133 and fluid feed slot 141 communicate with each other so as to form a fluid channel or opening 145 through substrate 140. As such, fluid feed slot 141 forms a portion of opening 145 and fluid feed hole 133 forms a portion of opening 145. In one embodiment, opening 145 is formed in substrate 140 by abrasive machining, as described below. Continue reading about Substrate and method of forming substrate for fluid ejection device... Full patent description for Substrate and method of forming substrate for fluid ejection device Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Substrate and method of forming substrate for fluid ejection device patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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