| Structure of embedded active components and manufacturing method thereof -> Monitor Keywords |
|
|
 
Structure of embedded active components and manufacturing method thereofRelated Patent Categories: Semiconductor Device Manufacturing: Process, Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor, Making Plural Separate DevicesStructure of embedded active components and manufacturing method thereof description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060110853, Structure of embedded active components and manufacturing method thereof. Brief Patent Description - Full Patent Description - Patent Application Claims
PRIORITY STATEMENT [0001] This Non-provisional application claims priority under 35 U.S.C. .sctn. 119(a) on Patent Application No(s). 93135743 filed in Taiwan on Nov. 19, 2004, the entire contents of which are hereby incorporated by reference. BACKGROUND [0002] 1. Field of Invention [0003] The invention relates to a package structure and the manufacturing method thereof. In particular, it relates to a structure of embedded active components and the method of making the same. [0004] 2. Related Art [0005] In order to create larger space and to enhance the functions of the module within a limited substrate area, shrunk or embedded passive components are often used to minimize the circuit layout and to reduce the signal transmission distance. Thus, more space is left for installing active components and enhancing the overall performance. Therefore, substrates with passive components such as embedded resistors, capacitors, and inductors are developed. [0006] In order to more effectively minimize the packaging of the components, methods of embedding active components (such as IC chips) on a substrate have been developed. The substrate with an embedded IC module as disclosed in the U.S. Pat. No. 5,497,033 has a plurality of chips installed thereon. A molding plate is first used to enclose the chips to be the embedded components. A molding material then covers the chips using the conventional molding method. The chips are thud embedded in the molding material after curing. However, this method completes the whole process of embedding components on the substrate. It is likely to damage other components not to be embedded. The finished substrate is not flexible and has limited applications. [0007] In the U.S. Pat. No. 6,027,958, a transferring manufacturing method for the flexible IC components is teached. A semiconductor substrate with silicon on insulator (SOI) structure is provided to form the required IC thereon. An adhesive layer is used to attach another flexible substrate on the IC. Finally, etching is employed to remove the semiconductor substrate, thereby transferring the IC onto the surface of the flexible substrate. SUMMARY [0008] In view of the foregoing, an objective of the invention is to provide a structure of embedded active components and the method of making the same. By forming an embedded structure with multiple active components, the alignment problem in subsequent packaging can be solved. Moreover, the active components are electrically tested. Therefore, the invention can effectively increase the product yield. [0009] The disclosed method for making the structure of embedded active components includes the steps of; providing a molding plate; disposing with alignment a plurality of active components on the molding plate; covering a dielectric layer on the molding plate to cap the active components; making a circuit on the dielectric layer, in contact with the active components; and releasing the dielectric layer embedded with the active components from the molding plate. [0010] The dielectric layer may be a polymer layer. The step of making a circuit on the dielectric layer can be performed by forming a plurality of conductive holes connecting to the active components on the dielectric layer and then forming the circuit passing through the conductive hole. [0011] The invention further discloses a structure of embedded active components, which comprises a dielectric layer, a plurality of active components, and a circuit. The active components are embedded into the dielectric layer. The circuit is installed on the dielectric layer and connected to the active components. BRIEF DESCRIPTION OF THE DRAWINGS [0012] The invention will become more fully understood from the detailed description given hereinbelow illustration only, and thus are not limitative of the present invention, and wherein: [0013] FIG. 1 is a schematic view of the disclosed method; [0014] FIGS. 2A to 2F are schematic cross-sectional views of the manufacturing process according to an embodiment of the invention; and [0015] FIG. 3 is a schematic cross-sectional view of another embodiment of the invention. DETAILED DESCRIPTION [0016] The steps of the disclosed method are shown in FIG. 1. First, a molding plate is provided (step 110). Several active components are disposed with alignment on the molding plate (step 120). A dielectric layer is deposited on the molding plate (step 130) to cover the active components. A circuit is made on the dielectric layer (step 140), in contact with the active components. Finally, the molding plate is removed (step 150), releasing the dielectric layer with embedded active components from the molding plate. One then obtains a structure of embedded active components. [0017] When the dielectric layer is a polymer layer, it can be a preprocessed or existing polymer layer, such as the Ajinomoto build-up film (ABF) or the resin coated copper foil (RCC). The above process also includes the step of embossing to embed active components into the polymer layer or the step of coating a polymer solution followed by curing to form the dielectric layer. The latter includes the steps of: covering a polymer solution on the active components by spraying, spin-coating, or printing; and curing the polymer solution to form a polymer layer. [0018] Step 140 in FIG. 1 makes a circuit on the insulator. Several conductive holes connecting to the active components are first formed on the dielectric layer, followed by forming the circuit passing through the conductive holes. [0019] The process in an embodiment of the invention is further described in detail with reference to FIGS. 2A to 2F. Continue reading about Structure of embedded active components and manufacturing method thereof... Full patent description for Structure of embedded active components and manufacturing method thereof Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Structure of embedded active components and manufacturing method thereof patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Structure of embedded active components and manufacturing method thereof or other areas of interest. ### Previous Patent Application: Methods to achieve precision alignment for wafer scale packages Next Patent Application: Methods and systems for providing mems devices with a top cap and upper sense plate Industry Class: Semiconductor device manufacturing: process ### FreshPatents.com Support Thank you for viewing the Structure of embedded active components and manufacturing method thereof patent info. IP-related news and info Results in 0.41902 seconds Other interesting Feshpatents.com categories: Accenture , Agouron Pharmaceuticals , Amgen , AT&T , Bausch & Lomb , Callaway Golf 174 |
 * Protect your Inventions * US Patent Office filing 
PATENT INFO |
|
