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  Structure and process for packaging rf mems and other devicesUSPTO Application #: 20060211177Title: Structure and process for packaging rf mems and other devices Abstract: A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, for example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices. (end of abstract) Agent: Miles & Stockbridge PC - Mclean, VA, US Inventors: Leonard W. Schaper, Ajay P. Malshe, Chad O'Neal USPTO Applicaton #: 20060211177 - Class: 438125000 (USPTO) Related Patent Categories: Semiconductor Device Manufacturing: Process, Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor, Insulative Housing Or Support The Patent Description & Claims data below is from USPTO Patent Application 20060211177. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] This invention is concerned with the packaging of MEMS (Micro Electro Mechanical System) devices and other devices. Typically, MEMS are micromachines that may include elements, sensors, actuators and electronics on a common silicon or other substrate. [0002] MEMS technology is sometimes referred to as the next semiconductor revolution. For scientists and system engineers it brings unique and timely opportunity to integrate various functions such as electrical, optical, fluidic, etc. and is part of next-generation "multi-functional systems (MFS)". MEMS technology has seen a significant surge in the past decade, and MEMS devices are finding applications in many strategic as well as consumer fields. While MEMS technology has progressed rapidly, barriers to packaging, and costs, have hindered widespread realization of MEMS-based systems. [0003] Packaging of MEMS is an area of intense interest for the past few years and will be of greater importance in the years to come. Unlike IC packaging, packaging of MEMS is "application specific". The development of application specific surfaces and interfaces and integration of dissimilar materials for building MEMS integrated system-in-package (SIP) for RF applications, are of particular interest. Frequently, MEMS devices must be packaged in an inert atmosphere or vacuum. Bringing leads out on the top surface of a silicon substrate, for example, creates topography that makes sealing of a cap to the substrate difficult and that makes anodic bonding of a glass cap to the substrate impossible. SUMMARY OF THE INVENTION [0004] The present invention provides an improved structure and process for packaging RF MEMS and other devices. [0005] An improved package for MEMS and other devices in accordance with the invention can provide, as desired, a physical housing to protect the device, functional interconnects to mechanical systems, avenues for managing by-products like heat and for reducing functional losses like insertion loss of the system, and electrical interfaces to electronic control systems. [0006] In a preferred embodiment of the invention, leads are not brought out on the top surface of a silicon substrate, so that a reliable bond between a glass cap to a smooth silicon substrate can be achieved. [0007] Among the features and advantages of packaging in accordance with the invention are the following: [0008] (1) small electrical interconnection lengths [0009] (2) integration of paper-thin IC chips as a part of a system [0010] (3) wafer scale packages [0011] (4) chip-scale integration of MEMS devices with electrical control platforms [0012] (5) use of traditional processing steps, which makes fabrication manufacturing economical [0013] (6) adaptability to flat/rigid (e.g., ceramic) as well as flexible (e.g., Kapton) substrate carriers. [0014] Furthermore, the invention meets the needs of application specific packaging requirements, which may include the following: [0015] (1) low insertion loss* [0016] (2) high Q factor* [0017] (3) hermetic/vacuum packaging [0018] (4) high material integrity [0019] (5) low temperature processing [0020] (6) integral mechanical strength.sup.1 .sup.1*(Note: as a function of frequency) [0021] A packaged RF relay MEMS device in accordance with the invention can provide: [0022] (1) high bandwidth (DC to 20 GHz) Continue reading... Full patent description for Structure and process for packaging rf mems and other devices Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Structure and process for packaging rf mems and other devices patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Structure and process for packaging rf mems and other devices or other areas of interest. ### Previous Patent Application: Manufacturing method for physical quantity sensor using lead frame and bonding device therefor Next Patent Application: Fabrication of lean-free stacked capacitors Industry Class: Semiconductor device manufacturing: process ### FreshPatents.com Support Thank you for viewing the Structure and process for packaging rf mems and other devices patent info. IP-related news and info Results in 1.07898 seconds Other interesting Feshpatents.com categories: Canon USA , Celera Genomics , Cephalon, Inc. , Cingular Wireless , Clorox , Colgate-Palmolive , Corning , Cymer , |
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