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Sputtering target for titanium sputtering chamberUSPTO Application #: 20070125646Title: Sputtering target for titanium sputtering chamber Abstract: A sputtering target for a sputtering chamber comprises a backing plate and titanium sputtering plate mounted on the backing plate. The sputtering plate comprises a central cylindrical mesa having a plane, and a peripheral inclined annular rim surrounding the cylindrical mesa, the annular rim being inclined relative to the plane of the cylindrical mesa by an angle of at least about 8°. (end of abstract) USPTO Applicaton #: 20070125646 - Class: 204298120 (USPTO) Related Patent Categories: Chemistry: Electrical And Wave Energy, Apparatus, Coating, Forming Or Etching By Sputtering, Coating, Specified Target Particulars
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