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  Spray slurry delivery system for polish performance improvement and cost reductionUSPTO Application #: 20060025049Title: Spray slurry delivery system for polish performance improvement and cost reduction Abstract: Methods and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one aspect, the apparatus comprises a vertical arm having a delivery portion located proximate to a circumference of a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a first adjustable droplet size, and at least a second nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a second adjustable droplet size. In another aspect of the invention, the apparatus comprises a horizontal arm having a delivery portion disposed at least partially over a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a first adjustable droplet size across a first region of the polishing surface, and at least a second nozzle disposed horizontally spaced from the first nozzle on the delivery portion, and adapted to dispense the polishing fluid with a second adjustable droplet size across a second region of the polishing surface. (end of abstract)
Agent: Patterson & Sheridan, LLP - Houston, TX, US Inventors: Lizhong Sun, Lei Zhu, Gary Ka Ho Lam, Robert L. Jackson, Wei-Yung Hsu USPTO Applicaton #: 20060025049 - Class: 451005000 (USPTO) Related Patent Categories: Abrading, Precision Device Or Process - Or With Condition Responsive Control, Computer Controlled The Patent Description & Claims data below is from USPTO Patent Application 20060025049. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims benefit of U.S. provisional patent application Ser. No. 60/592,669, filed Jul. 30, 2004, which is herein incorporated by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] Embodiments of the present invention generally relate to a slurry delivery method and apparatus for polishing a substrate in a chemical mechanical polishing system. [0004] 2. Description of the Related Art [0005] Chemical mechanical planarization, or chemical mechanical polishing (CMP), is a common technique used to planarize substrates. Chemical mechanical planarization systems generally utilize a polishing head to retain and press a substrate against a polishing surface of a polishing material while providing motion therebetween. In conventional CMP techniques, a substrate carrier or polishing head is mounted on a carrier assembly and positioned in contact with a polishing article in a CMP apparatus. The carrier assembly provides a controllable pressure to the substrate urging the substrate against the polishing article. The article is moved relative to the substrate by an external driving force. Thus, the CMP apparatus effects polishing or rubbing movement between the surface of the substrate and the polishing article while dispersing a polishing composition to effect both chemical activity and mechanical activity. [0006] Some planarization systems utilize a polishing head that is moveable over a stationary platen that supports the polishing material. Other systems utilize different configurations including a rotating platen to provide relative motion between the polishing material and the substrate. A polishing fluid is typically disposed between the substrate and the polishing material during polishing to provide chemical activity that assists in the removal of material from the substrate. Some polishing fluids may also contain abrasives. [0007] One of the challenges in developing robust polishing systems and processes is providing uniform material removal across the polished surface of the substrate. For example, as the substrate travels across the polishing surface, the edge of the substrate is often polished at a higher rate. This is due in part to the tendency of the substrate to nose drive, that is, centrifugal and frictional forces force the substrate to move toward the exterior of the support surface as the substrate moves across the support surface. [0008] An additional problem with polishing uniformity is the distribution of slurry on the polishing surface. If the slurry is unevenly distributed, the polishing surface may not evenly polish across the substrate surface. If too little slurry is used, the polishing surface may distort the features of the substrate surface. If too much slurry is applied, valuable slurry may be wasted. Therefore, a system for delivering a polishing fluid to a chemical mechanical polishing surface that adjustably distributes and conserves slurry is needed. SUMMARY OF THE INVENTION [0009] The present invention generally provides a method and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface. In one aspect, an apparatus is provided for delivering a polishing fluid to a chemical mechanical polishing surface including a vertical arm having a delivery portion located proximate to a circumference of a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a first adjustable droplet size, and at least a second nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a second adjustable droplet size. [0010] In another aspect, an apparatus is provided for delivering a polishing fluid to a chemical mechanical polishing surface including a horizontal arm having a delivery portion disposed at least partially over a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a first adjustable droplet size across a first region of the polishing surface, and at least a second nozzle disposed horizontally spaced from the first nozzle on the delivery portion, and adapted to dispense the polishing fluid with a second adjustable droplet size across a second region of the polishing surface. [0011] In another aspect, an apparatus is provided for delivering a polishing fluid to a chemical mechanical polishing surface including a delivery arm, two or more nozzles disposed on a delivery portion of the delivery arm with each nozzle adapted to disperse the polishing fluid with an adjustable droplet size wherein each nozzle has an aperture that is independently controlled, a tubing system configured to supply fluid to the two or more nozzles, a pump system to provide a controlled pressure to the tubing system, and a control system to independently control each aperture of each nozzle and the pump system. [0012] In another aspect, a method is provided for delivering a polishing fluid to a chemical mechanical polishing surface including dispensing the polishing fluid onto the polishing material with a controlled droplet size across a first region of the polishing material, and dispensing the polishing fluid onto the polishing material with a controlled droplet size across a second region of the polishing material, wherein a first nozzle provides polishing fluid with an adjustable first angle between the arm and the first region of the polishing surface and at least second nozzle provides polishing fluid with an adjustable second angle between the arm and the second region of the polishing surface. BRIEF DESCRIPTION OF THE DRAWINGS [0013] So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments. [0014] FIG. 1 is a sectional view of a polishing system having one embodiment of a polishing fluid delivery system. [0015] FIG. 2 is a plan view of the system of FIG. 1. [0016] FIG. 3 is a sectional view of an alternative embodiment of a polishing fluid delivery system. [0017] FIG. 4 is a sectional view of an additional alternative embodiment of a polishing fluid delivery system. DETAILED DESCRIPTION [0018] The present invention provides a slurry delivery method and apparatus for polishing a substrate in a chemical mechanical polishing system. In one aspect, the invention provides a slurry delivery method and apparatus that utilizes a plurality of nozzles that may be configured to dispense droplets with adjustable size and adjustable droplet stream path angles. [0019] Examples of polishing systems which may be adapted to benefit from aspects of the invention are disclosed in U.S. Pat. No. 6,244,935 issued Jun. 12, 2001 by Birang, et al. and U.S. Pat. No. 5,738,574 issued Apr. 14, 1998 to Tolles, et al., both of which are incorporated by reference in their entirety. Continue reading... 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