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Solid-state imaging device, fabrication method of the same, and camera module


Title: Solid-state imaging device, fabrication method of the same, and camera module.
Abstract: There is provided a solid-state imaging device including: a semiconductor package support mounting a solid-state image sensor; bonding wires electrically connecting first terminals formed on the solid-state image sensor and second terminals formed on the semiconductor package support; a sealing member sealing at least the second terminals to which the bonding wires are connected; and an optically-transparent member made of an optically-transparent material and disposed above the solid-state image sensor, in which the optically-transparent member is supported by different support members formed on the semiconductor package support at three or more positions not on a single straight line. ...


- Chicago, IL, US
Inventor: Noboru Kawabata
USPTO Applicaton #: #20070194439 - Class: $ApplicationNatlClass (USPTO) -


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Related Patent Categories: Active Solid-state Devices (e.g., Transistors, Solid-state Diodes), Housing Or Package, Insulating Material, Cap Or Lid
The Patent Description & Claims data below is from USPTO Patent Application 20070194439, Solid-state imaging device, fabrication method of the same, and camera module.

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stats Patent Info
Application #
US 20070194439 A1
Publish Date
08/23/2007
Document #
11567959
File Date
12/07/2006
USPTO Class
257704000
Other USPTO Classes
International Class
01L23/12
Drawings
8


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