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  Sliding flexible electrical contact for electrochemical processingUSPTO Application #: 20060180465Title: Sliding flexible electrical contact for electrochemical processing Abstract: Embodiments of a contact element for biasing a substrate during electrically assisted processing is provided herein. In one embodiment, the electrical contact includes a conductive base. At least one conductive flat spring is coupled to the base. A contact is coupled to each flat spring, the contact is suitable for slidably engaging a processed face of the substrate during processing. (end of abstract) Agent: Patterson & Sheridan, LLP - Houston, TX, US Inventors: Rashid A. Mavliev, Ralph M. Wadensweiler USPTO Applicaton #: 20060180465 - Class: 204297100 (USPTO) Related Patent Categories: Chemistry: Electrical And Wave Energy, Apparatus, Electrolytic, Elements, Electrode Support Or Work Holder, Workpiece Rack, Including Resilient Means (e.g., Spring, Etc.) The Patent Description & Claims data below is from USPTO Patent Application 20060180465. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] Embodiments of the invention generally relate to a contact assembly for electrochemical processing. [0003] 2. Description of the Related Art [0004] Electrochemical Mechanical Processing (ECMP) is a technique used to deposit or remove conductive materials from a substrate surface. For example, in an ECMP polishing process, conductive materials are removed from the surface of a substrate by electrochemical dissolution while concurrently polishing the substrate with reduced mechanical abrasion as compared to conventional Chemical Mechanical Polishing (CMP) processes. [0005] Electrochemical dissolution is performed by applying a bias between a cathode and a substrate surface to remove conductive materials from the substrate surface into a surrounding electrolyte. The bias may be applied to the substrate surface by a conductive contact disposed on or through a polishing material upon which the substrate is processed. A mechanical component of the polishing process is performed by providing relative motion between the substrate and the polishing material that enhances the removal of the conductive material from the substrate. ECMP systems may generally be adapted for deposition of conductive material on the substrate by reversing the polarity of the bias. [0006] The energization, or biasing of the conductive material may be accomplished through the use of conductive balls that contact the conductive material during processing. However, although conductive balls as contact elements for biasing the conductive layer have demonstrated good results, service life and cost has made a search for an alternative contact element desirable. [0007] Thus, there is a need for an improved apparatus for electrochemical mechanical polishing. SUMMARY OF THE INVENTION [0008] In one embodiment, a contact element for electrically biasing a substrate is provided. The electrical contact includes a conductive base. At least one conductive flat spring is coupled to the base. A contact is coupled to each flat spring and is suitable for slidably engaging a processed face of the substrate during processing. [0009] In another embodiment, a processing pad assembly for electrically assisted processing of a substrate includes a processing pad having a processing surface. A contact element is laterally disposed therewith and is configured to contact a surface of the substrate opposing the processing surface at least contemporaneously with the processing surface. The contact element includes a conductive base. At least one conductive flat spring is coupled to the base. A contact is coupled to each flat spring and is suitable for slidably engaging a processed face of the substrate during processing. [0010] In another embodiment, an electrically assisted substrate processing system includes a platen and a processing pad disposed on the platen. The processing pad has a processing surface. A contact element is laterally disposed with respect to the processing pad and is adapted to contact the surface of a substrate during processing at least contemporaneously with the processing surface of the processing pad. The contact element includes a conductive base. At least one conductive flat spring is coupled to the base. A contact is coupled to each flat spring and is suitable for slidably engaging a processed face of the substrate during processing. BRIEF DESCRIPTION OF THE DRAWINGS [0011] So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments. [0012] FIG. 1 is a side view, partially in cross-section, of an electrochemical mechanical processing station; [0013] FIGS. 2A and B are partial top and side views, respectively, of one embodiment of a contact element of the processing station of FIG. 1; [0014] FIG. 3 is a partial side view of one embodiment of a contact element; [0015] FIG. 4 is a partial side view of another embodiment of a contact element; and [0016] FIG. 5 is a partial side view of another embodiment of a contact element. [0017] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. DETAILED DESCRIPTION [0018] FIG. 1 depicts a sectional view of a processing station 100 having a pad assembly 106 and one embodiment of a contact element 134 of the present invention. The processing station 100 includes a carrier head assembly 118 adapted to hold a substrate 120 against a platen assembly 142. Relative motion is provided between the pad assembly 106 and the substrate 120 during processing. The relative motion may be rotational, linear, or some combination thereof and may be provided by at least one of the carrier head assembly 118 and the platen assembly 142. [0019] In one embodiment, the carrier head assembly 118 may be positioned over the platen assembly 142 by an arm 164 coupled to a column 130. The carrier head assembly 118 generally includes a drive system 102 coupled to a carrier head 122. The drive system 102 generally provides at least rotational motion to the carrier head 122. The carrier head 122 additionally may be actuated toward the platen assembly 142 such that the substrate 120 retained in the carrier head 122 may be disposed against a processing surface 104 of the pad assembly 106 during processing. [0020] In one embodiment, the carrier head 122 may be a TITAN HEAD.TM. or TITAN PROFILER.TM. wafer carrier manufactured by Applied Materials, Inc., of Santa Clara, Calif. Generally, the carrier head 122 comprises a housing 124 and retaining ring 126 that define a center recess in which the substrate 120 is retained while leaving a feature side of the substrate exposed. The retaining ring 126 circumscribes the substrate 120 disposed within the carrier head 122 to prevent the substrate 120 from slipping out from under the carrier head 122 during processing. It is contemplated that other carrier heads may be utilized. Continue reading... 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