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Single wafer dryer and drying methodsRelated Patent Categories: Cleaning And Liquid Contact With Solids, Liquid Treating Forms And Mandrels, With Treating Fluid MotionSingle wafer dryer and drying methods description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060174921, Single wafer dryer and drying methods. Brief Patent Description - Full Patent Description - Patent Application Claims
[0001] This application is a continuation of and claims priority from U.S. patent application Ser. No. 11/179,926 filed Jul. 12, 2005 which is a division of and claims priority from U.S. patent application Ser. No. 10/286,404 filed Nov. 1, 2002, which claims priority from U.S. Provisional Patent Application Ser. No. 60/335,335, filed Nov. 2, 2001. All of the above-identified patent applications are hereby incorporated by reference herein in their entirety. FIELD OF THE INVENTION [0002] This invention is concerned with semiconductor manufacturing and is more particularly concerned with techniques for drying a substrate. BACKGROUND OF THE INVENTION [0003] As semiconductor device geometries continue to decrease, the importance of ultra clean processing increases. Aqueous cleaning within a tank of fluid (or a bath) followed by a rinsing bath (e.g., within a separate tank, or by replacing the cleaning tank fluid) achieves desirable cleaning levels. After removal from the rinsing bath, absent use of a drying apparatus, the bath fluid would evaporate from the substrate's surface causing streaking, spotting and/or leaving bath residue on the surface of the substrate. Such streaking, spotting and residue can cause subsequent device failure. Accordingly, much attention has been directed to improved methods for drying a substrate as it is removed from an aqueous bath. [0004] A method known as Marangoni drying creates a surface tension gradient to induce bath fluid to flow from the substrate in a manner that leaves the substrate virtually free of bath fluid, and thus may avoid streaking, spotting and residue marks. Specifically, during Marangoni drying a solvent miscible with the bath fluid (e.g., IPA vapor) is introduced to a fluid meniscus which forms as the substrate is lifted from the bath or as the bath fluid is drained past the substrate. The solvent vapor is absorbed along the surface of the fluid, with the concentration of the absorbed vapor being higher at the tip of the meniscus. The higher concentration of absorbed vapor causes surface tension to be lower at the tip of the meniscus than in the bulk of the bath fluid, causing bath fluid to flow from the drying meniscus toward the bulk bath fluid. Such a flow is known as a "Marangoni" flow, and can be employed to achieve substrate drying without leaving streaks, spotting or bath residue on the substrate. SUMMARY OF THE INVENTION [0005] In a first aspect of the invention, a first module is provided that is adapted to process a wafer. The module includes a processing portion having a load port through which a wafer may be lowered into the processing portion, and an unload port, horizontally displaced from the load port, such that the wafer may be raised out of the processing portion at the unload port. The module also includes a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with the load port, to a second orientation wherein the wafer is in line with the unload port. [0006] In a second aspect of the invention, a second module is provided that is adapted to process a wafer. The second module includes a processing portion having the load port and unload port described with regard to the first module. The second module also includes (1) an external overflow weir positioned along the exterior of the processing portion; and (2) a separation wall positioned between the load port and the unload port so as to divide an upper region of the processing portion into a first section and a second section, and so as to deter surface fluid from traveling between the first section and the second section. [0007] In a third aspect of the invention, a third module is provided that is adapted to process a wafer. The third module includes a processing portion having the load port described with regard to the first module. The third module also includes a spray mechanism adapted to be submerged in fluid contained in the processing portion during processing, and positioned so as to spray fluid to the underwater surface of a wafer as the wafer is lowered through the load port. [0008] In a fourth aspect of the invention, a fourth module is provided that is adapted to process a wafer. The fourth module includes a processing portion having the load port and unload port described with regard to the first module. The fourth module also includes an output portion having (1) a first wafer receiver adapted to receive a wafer raised through the unload port; and (2) a catcher coupled to the wafer receiver and adapted to contact a wafer being elevated from the unload port and to elevate passively therewith. [0009] In a fifth aspect of the invention, a fifth module is provided that is adapted to process a wafer. The fifth module includes a processing portion having the load port and unload port described with regard to the first module. The fifth module also includes an output portion having a first wafer receiver adapted to receive a wafer raised through the unload port, and an enclosure surrounding the first wafer receiver. The enclosure includes (1) a first opening adapted such that a wafer may be raised from the processing portion, through the unload port, to the first wafer receiver; (2) a second opening adapted to allow a wafer handler to extract a wafer from the first wafer receiver; and (3) a plurality of additional openings adapted to allow a laminar flow of air to be established within the enclosure. [0010] In a sixth aspect of the invention, a sixth module is provided that is adapted to process a wafer. The fifth module includes a processing portion having the load port and unload port described with regard to the first module. The fifth module also includes an output portion having (1) a first wafer receiver adapted to receive a wafer raised through the unload port; and (2) a second wafer receiver adapted to receive a wafer raised through the unload port. The first and second wafer receivers are adapted to translate between a first position wherein the first wafer receiver is positioned to receive a wafer raised through the unload port, and a second position wherein the second wafer receiver is positioned to receive a wafer raised through the unload port. Numerous other aspects are provided, as are methods, apparatus and systems in accordance with these and other aspects. [0011] Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS [0012] FIG. 1 is a schematic side view of an inventive drying apparatus comprising a processing portion, and an output portion, both configured according to a first aspect; [0013] FIGS. 2A-I are schematic side views of the inventive drying apparatus of FIG. 1 showing sequential stages of wafer transport through, and output from, the inventive drying apparatus; [0014] FIGS. 3A-B are a schematic side view and a top plan view respectively showing the drying apparatus of FIG. 1 wherein the output portion is configured according to a second aspect; [0015] FIGS. 4A-I are schematic side views of the inventive drying apparatus of FIGS. 3A-B showing sequential positions of the output portion during wafer output thereto; [0016] FIG. 5 is a schematic side view showing the inventive drying apparatus wherein the processing portion is configured according to a second aspect; [0017] FIG. 6 is a schematic side view of a vapor flow deflector that may be installed in association with a vapor nozzle in a drying apparatus; [0018] FIG. 7 is a graph which plots the number of particles observed on wafers dried via various IPA concentrations and various flow rates; [0019] FIG. 8A is a schematic drawing useful in describing a vapor flow angle; and [0020] FIG. 8B is a table showing preferred vapor flow angles for drying substrates comprising various materials. 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