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  Semiconductor light emitting deviceUSPTO Application #: 20070120139Title: Semiconductor light emitting device Abstract: A semiconductor light emitting device includes a mold resin having a cup shape portion on an upper surface of the mold resin. One or more holes penetrate through the cup shape portion to outside of the mold resin and/or one or more trenches extend from the cup-shaped portion to outside the mold resin. A first lead is provided in the mold resin and extending from the cup shape portion to outside of the mold resin in a first direction, and a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin in a second direction which is opposite to the first direction. A light emitting element is mounted on the first lead in the cup shape portion, and a wire electrically connects the light emitting element and the second lead. A sealing resin is embedded in the one or more holes and the one or more trenches and is configured to seal the light emitting element and the wire. (end of abstract) Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C. - Alexandria, VA, US Inventor: Reiji ONO USPTO Applicaton #: 20070120139 - Class: 257099000 (USPTO) Related Patent Categories: Active Solid-state Devices (e.g., Transistors, Solid-state Diodes), Incoherent Light Emitter Structure, With Housing Or Contact Structure The Patent Description & Claims data below is from USPTO Patent Application 20070120139. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS REFERENCE TO RELATED APPLICATION [0001] This application is a Divisional of and claims the benefit of priority under 35 U.S.C. .sctn.120 from U.S. Ser. No. 11/360,521, filed Feb. 24, 2006 and claims the benefit of priority under 35 U.S.C. .sctn.119 from Japanese Patent Application No. 2005-48312, filed on Feb. 24, 2005, the entire contents of which are incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] SMD (Surface Mounting Device) type semiconductor light emitting devices have a wide field of applications since such devices can be surface mounted to a printed circuit board. [0003] With the application field being broadened, the semiconductor light emitting device may be used in a wide range ambient temperature. For example, in the automotive use, the semiconductor light emitting device may be required to be operable in a range of -40-+80 degree Centigrade. [0004] On the other hand, a LED chip, a mold resin, a sealing resin and a metal lead frame have a different heat expansion coefficient and a different Young's modulus. In case an ambient temperature of the semiconductor light emitting device is raised and lowered, the sealing resin is expanded and compressed. So the optical characteristic of the semiconductor light emitting device may be worsened, or damage, such as peeling of the sealing resin from another constituent element and/or cracks in the LED chip, may occur in the semiconductor light emitting device. SUMMARY [0005] According to one aspect of the present invention, there is provided a semiconductor light emitting device including a mold resin having a cup shape portion on an upper surface of the mold resin and a hole penetrating through the cup shape portion to outside the mold resin; a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin in a first direction; a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin in a second direction which is opposite to the first direction; a light emitting element mounted on the first lead in the cup shape portion; a wire electrically connecting the light emitting element and the second lead; and a sealing resin configured to seal the light emitting element and the wire, embedding the hole. [0006] According to another aspect of the present invention, there is provided a semiconductor light emitting device including a mold resin having a cup shape portion on an upper surface of the mold resin; a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin in a first direction; a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin in a second direction which is opposite to the first direction; and the mold resin having a first trench extending from the cup shape portion to outside of the mold resin in a third direction and a second trench extending from the cup shape portion to outside of the mold resin in a fourth direction which is opposite to the third direction; a light emitting element mounted on the first lead in the cup shape portion; a wire electrically connecting the light emitting element and the second lead; and a sealing resin configured to seal the light emitting element and the wire, embedding the first trench and the second trench. [0007] According to a further aspect of the present invention, there is provided a semiconductor light emitting device may include a mold resin having a cup shape portion on an upper surface of the mold resin and a hole penetrating from the cup shape portion to a bottom surface of the mold resin; a first lead having a first inner lead portion and a first outer lead portion, the first outer lead portion extending from the cup shape portion to outside of the mold resin in a first direction, the first inner lead portion provided in the cup shape portion and being thicker than the first outer lead portion; a second lead having a second inner lead portion and a second outer lead portion, the second outer lead portion extending from the cup shape portion to outside of the mold resin in a second direction which is opposite to the first direction, the second inner lead portion provided in the cup shape portion; a semiconductor light emitting element mounted on the first inner lead portion of the first lead; a wire connecting the semiconductor light emitting element and the second inner lead portion of the second lead; a sealing resin configured to seal the light emitting element and the wire, embedding the hole. BRIEF DESCRIPTION OF THE DRAWINGS [0008] A more complete appreciation of the invention and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein: [0009] FIG. 1 is a top view of a semiconductor light emitting device in accordance with a first embodiment of the present invention. [0010] FIG. 2 is a cross sectional view taken along line A-A in FIG. 1. [0011] FIG. 3 is a cross sectional view taken along line B-B in FIG. 1. [0012] FIG. 4 is a cross sectional view taken along line B-B in FIG. 1, showing a heat expansion of a sealing resin in a high temperature. [0013] FIG. 5 is a cross sectional view taken along line B-B in FIG. 1, showing a heat compression of a sealing resin in a low temperature. [0014] FIG. 6 is a top view of a semiconductor light emitting device in accordance with a comparative example. [0015] FIG. 7 is a cross sectional view taken along line E-E in FIG. 6, showing a heat expansion of a sealing resin in a high temperature. [0016] FIG. 8 is a cross sectional view taken along line E-E in FIG. 6, showing a heat compression of a sealing resin in a low temperature. [0017] FIG. 9 is a top view of a semiconductor light emitting device in accordance with a second embodiment of the present invention. [0018] FIG. 10 is a cross sectional view taken along line C-C in FIG. 9. [0019] FIG. 11 is an end view of the semiconductor light emitting device shown in FIG. 9. [0020] FIG. 12 is a top view of a semiconductor light emitting device in accordance with a third embodiment of the present invention. Continue reading... Full patent description for Semiconductor light emitting device Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Semiconductor light emitting device patent application. Patent Applications in related categories: 20080111150 - Replaceable through-hole high flux led lamp - The present invention is a through-hole LED light source with capability of emitting a beam angle of less than 75 degrees. The light source presents a three-dimensional lead frame with a well, into which at least one LED is mounted, and an optical housing which serves as a directional lens. ... ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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