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Semiconductor integrated circuit and semiconductor integrated circuit arrangement device and processSemiconductor integrated circuit and semiconductor integrated circuit arrangement device and process description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070222989, Semiconductor integrated circuit and semiconductor integrated circuit arrangement device and process. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATION [0001] This is a Division of application Ser. No. 11/150,228 filed Jun. 13, 2005. The disclosure of the prior application is hereby incorporated by reference herein in its entirety. [0002] This application claims priority under 35 USC 119 from Japanese Patent Application No. 2004-273964, the disclosure of which is incorporated by reference herein. BACKGROUND OF THE INVENTION [0003] 1. Field of the Invention [0004] The present invention relates to a semiconductor integrated circuit and to a semiconductor integrated circuit arrangement device and process, and more particularly relates to a semiconductor integrated circuit which includes an optical device for optical communication and is structured so as to exhibit a predetermined function, and to a semiconductor integrated circuit arrangement device and process for arranging this semiconductor integrated circuit at a predetermined position. [0005] 2. Description of the Related Art [0006] Heretofore, semiconductor integrated circuits which include optical devices and are structured so as to exhibit predetermined functions have been proposed. When such a semiconductor integrated circuit is being arranged at a printed circuit board, it is not judged whether or not the optical device(s) function(s) properly. Consequently, it has been possible for semiconductor integrated circuits equipped with unsatisfactory optical devices to be arranged at printed circuit boards. [0007] Furthermore, conventionally, semiconductor integrated circuits have been arranged at printed circuit boards as described below (see Japanese Patent Application Laid-Open (JP-A) No. 11-273816). Specifically, optical devices dedicated to positioning are provided beforehand at each of a semiconductor integrated circuit and a printed circuit board. When the semiconductor integrated circuit is being arranged at the printed circuit board, the semiconductor integrated circuit is positioned at the printed circuit board at a position at which conditions of light emission and light reception, by the optical devices for positioning which have been provided at the semiconductor integrated circuit and the printed circuit board, are optimal. [0008] However, even if a semiconductor integrated circuit is positioned at a printed circuit board using optical devices for positioning in this manner and the optical devices for positioning are disposed at accurate positions, there may be fabrication errors and the like unrelated to the optical devices for positioning, which may cause a mounted optical device to be disposed at a position which is offset from an original position. SUMMARY OF THE INVENTION [0009] The present invention has been devised in consideration of the circumstances described above, and provides a semiconductor integrated circuit, semiconductor integrated circuit arrangement device and semiconductor integrated circuit arrangement process which are capable of preventing the arrangement at predetermined positions of unsatisfactory semiconductor integrated circuits. [0010] The present invention also provides a semiconductor integrated circuit arrangement device and process capable of directly positioning an optical device that is to be positioned at a scheduled position of arrangement and improving accuracy of positioning of a semiconductor integrated circuit. [0011] A first aspect of the present invention is a semiconductor integrated circuit which includes an optical device for optical communication and is structured so as to exhibit a predetermined function, the semiconductor integrated circuit including: a first electricity supply portion connected to the optical device; and a second electricity supply portion connected to the optical device, which differs from the first electricity supply portion. [0012] That is, the semiconductor integrated circuit of the present invention includes the optical device for performing optical communication and has structure such that the predetermined function is realized. The first electricity supply portion and the second electricity supply portion are connected to this optical device. [0013] A semiconductor integrated circuit arrangement device of a second aspect of the present invention includes: a retaining portion which touches the second electricity supply portion of the semiconductor integrated circuit and retains the semiconductor integrated circuit; a movement section which moves the retaining portion; an operating portion which operates the optical device by supplying current via the retaining portion and the second electricity supply portion; and a judgment section which judges quality of the optical device on the basis of an operating state of the optical device caused by the operating portion. [0014] With the invention described above, it is judged whether the semiconductor integrated circuit is satisfactory or not and the semiconductor integrated circuit is arranged at a predetermined scheduled position of arrangement. However, it is also possible for the semiconductor integrated circuit to be arranged at the predetermined scheduled position of arrangement without judging whether the semiconductor integrated circuit is satisfactory or not. In other words, a semiconductor integrated circuit arrangement device of a third aspect of the present invention is a semiconductor integrated circuit arrangement device which includes: a retaining portion which touches the second electricity supply portion of the semiconductor integrated circuit and retains the semiconductor integrated circuit; a movement section which moves the retaining portion; and an operating portion which operates the optical device, wherein the movement section disposes the semiconductor integrated circuit at a pre-specified scheduled position of arrangement, disposes a positioning optical device at an optical communication position, at which optical communication with the optical device of the semiconductor integrated circuit is possible, and, in a state in which the optical device is being operated, positions the semiconductor integrated circuit on the basis of a condition of optical communication between the optical device and the positioning optical device. [0015] A semiconductor integrated circuit arrangement process of a fourth aspect of the present invention is a semiconductor integrated circuit arrangement process for arranging a semiconductor integrated circuit, which includes an optical device for optical communication and is structured so as to exhibit a predetermined function, at a predetermined position of arrangement, the process including: a step of operating the optical device; a step of performing optical communication with the optical device which is being operated by the step of operating; and a step of positioning the semiconductor integrated circuit with respect to a board on the basis of a condition of optical communication in the step of performing optical communication. BRIEF DESCRIPTION OF THE DRAWINGS [0016] An embodiment of the present invention will be described in detail based on the following figures, wherein: [0017] FIG. 1A is a schematic view of a mounter relating to the present embodiment, being a plan view of the mounter; [0018] FIG. 1B is a schematic view of the mounter, being a side view of the mounter; [0019] FIG. 2 is a perspective view of an IC chip; [0020] FIG. 3A is a sectional view of the IC chip; Continue reading about Semiconductor integrated circuit and semiconductor integrated circuit arrangement device and process... 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