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Se Young Yang patents

Recent patents with Se Young Yang listed as an inventor - additional entries may be under other spellings.


Se Young Yang - Related organizations: Apple Inc. patents, Invensas Corporation patents

Double side mounting memory integration in thin low warpage fanout package

10/13/16 - 20160300813 - Packages and methods of formation are described. In an embodiment, a package includes a redistribution layer (RDL) formed directly on a top die, and a bottom die mounted on a back surface of the RDL.
Inventors: Jun Zhai, Kunzhong Hu, Chonghua Zhong, Mengzhi Pang, Se Young Yang

System in package fan out stacking architecture and process flow

09/08/16 - 20160260684 - Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), and a plurality of die attached to the front and back side of the first RDL. The first and second RDLs are coupled together with a plurality of
Inventors: Jun Zhai, Kunzhong Hu, Kwan-yu Lai, Mengzhi Pang, Chonghua Zhong, Se Young Yang

Reconfigured wide i/o memory modules and package architectures using same

12/17/15 - 20150364454 - In some embodiments, it is desirable to increase memory bandwidth using an integrated solution. In one embodiment, wide I/O memory may be used. Described herein are embodiments of systems and methods of reconfiguring wide I/O memory modules. The reconfigured memory modules may be configured such that the memory modules function
Inventors: Jun Zhai, Chonghua Zhong, Kunzhong Hu, Se Young Yang

Emi shielded wafer level fan-out pop package

10/22/15 - 20150303149 - In some embodiments, a semiconductor device package assembly may include a first substrate. The first substrate may include a first set of electrical conductors which electrically connect the assembly. In some embodiments, the assembly may include at least one electrical conductor coupled to the first substrate such that at least
Inventors: Jun Zhai, Mengzhi Pang, Se Young Yang, Leland W. Lew

Thin wafer handling and known good die test method

01/15/15 - 20150014688 - A method of attaching a microelectronic element to a substrate can include aligning the substrate with a microelectronic element, the microelectronic element having a plurality of spaced-apart electrically conductive bumps each including a bond metal, and reflowing the bumps. The bumps can be exposed at a front surface of the
Inventors: Charles G. Woychik, Se Young Yang, Pezhman Monadgemi, Terrence Caskey


### Se Young Yang patent invention listings

The bibliographic references displayed about Se Young Yang's patents are for a recent sample of Se Young Yang's publicly published patent applications. The inventor/author may have additional bibliographic citations listed at the USPTO.gov. FreshPatents.com is not associated or affiliated in any way with the author/inventor or the United States Patent/Trademark Office but is providing this non-comprehensive sample listing for educational and research purposes using public bibliographic data published and disseminated from the United States Patent/Trademark Office public datafeed. This information is also available for free on the USPTO.gov website. If Se Young Yang filed recent patent applications under another name, spelling or location then those applications could be listed on an alternate page. If no bibliographic references are listed here, it is possible there are no recent filings or there is a technical issue with the listing--in that case, we recommend doing a search on the USPTO.gov website.

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