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Satoshi Oikawa patents

Recent patents with Satoshi Oikawa listed as an inventor - additional entries may be under other spellings.


Satoshi Oikawa - Related organizations: Canon Kabushiki Kaisha patents

Manufacture method of liquid supply member, manufacture apparatus, and liquid supply member

12/01/16 - 20160347072 - A housing and a cover member are injection-molded and these housing and cover member are joined within a pair of mold. When the housing and the cover member are joined by molten resin, a mold for suppressing deformation is positioned at a face of the housing opposite to a face
Inventors: Takuya Iwano, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Hiromasa Amma, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima, Kyosuke Toda

Method for manufacturing molded member and liquid ejecting head, liquid ejecting head, and mold

12/01/16 - 20160347066 - There is provided a method for manufacturing a molded member having a hollow part. The method comprises a step for molding the hollow part by extracting a first piece, a second piece, a third piece and a fourth piece of a mold in four different directions. The second piece has
Inventors: Hiromasa Amma, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Takuya Iwano, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima, Kyosuke Toda

Manufacture method of liquid supply member and manufacture apparatus

12/01/16 - 20160346976 - First and second constituting components are injection-molded and joined within one pair of molds. In order to join the first and second constituting components, one of the respective regions of the first and second constituting components abutted to each other is pushed into the other.
Inventors: Naoko Tsujiuchi, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Hiromasa Amma, Takuya Iwano, Satoshi Kimura, Yasushi Iijima, Kyosuke Toda

Molded part, manufacturing method of molded part and mold

12/01/16 - 20160346971 - A molded part including a first member having a plurality of openings and a second member contacting with a peripheral edge of each of the plurality of openings so as to cover the openings, and having a hollow portion formed by sealing the contact portion with a sealing material, wherein:
Inventors: Takuya Iwano, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Hiromasa Amma, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima, Kyosuke Toda

Method for manufacturing liquid supply member

12/01/16 - 20160346970 - There is provided a manufacturing method for molding a liquid supply member by using a first mold and a second mold. The method includes a first molding step of performing injection molding to form a first component part of the liquid supply member and a plurality of component parts of
Inventors: Satoshi Oikawa, Yukuo Yamaguchi, Mikiya Umeyama, Hiromasa Amma, Takuya Iwano, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima, Kyosuke Toda

Method for manufacturing liquid-ejecting head

12/01/16 - 20160346969 - Provided is construction that in die slide injection molding, surely leaves each part in a mold on a specified side in the stage of opening a molding mold. In order to accomplish this, in an opening step, a push-out mechanism that applies a force on at least one of the
Inventors: Kyosuke Toda, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Hiromasa Amma, Takuya Iwano, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima

Method for manufacturing liquid-ejecting head

12/01/16 - 20160346968 - Provided is a method for manufacturing a liquid-ejecting head whereby in die slide injection molding it is possible to stably inject resin in secondary molding without damaging the shapes of parts that were formed in primary molding. In order for that, in the connecting section in which a convex section
Inventors: Satoshi Kimura, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Hiromasa Amma, Takuya Iwano, Naoko Tsujiuchi, Yasushi Iijima, Kyosuke Toda

Method for manufacturing liquid supply member

12/01/16 - 20160346967 - There is provided a manufacturing method for molding a liquid supply member by using a first mold and a second mold in which the first mold is capable of being slid relatively to the second mold, the method including a first molding step of performing injection molding to form a
Inventors: Satoshi Oikawa, Yukuo Yamaguchi, Mikiya Umeyama, Hiromasa Amma, Takuya Iwano, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima, Kyosuke Toda

Ink tank and printing apparatus

03/31/16 - 20160089894 - A light emitting portion of an ink tank emits light after a delay time in accordance with a mounting speed of the ink tank has elapsed after connecting second electrode pads on an ink tank side and a second contact on a holder side.
Inventors: Toshihiko Ujita, Satoshi Oikawa

Liquid ejection head

08/27/15 - 20150239243 - This invention suppresses the occurrence of ejection failures caused by air bubbles generated inside a liquid ejection head. A liquid ejection head includes an element substrate and a support member. The element substrate includes a ejection orifice row, and a supply port. The support member includes a first flow path
Inventors: Chiaki Muraoka, Mikiya Umeyama, Satoshi Oikawa, Takuya Iwano

Method of manufacturing liquid ejection head and liquid ejection head

06/12/14 - 20140160205 - A method of manufacturing a liquid ejection head including a liquid ejection substrate, an electric wiring member, and a supporting member having a first supporting surface and a second supporting surface, including: positioning an outer peripheral portion of the electric wiring member disposed on the side of the second supporting
Inventors: Satoshi Oikawa

Print head and ink jet printing apparatus

01/23/14 - 20140022309 - A print head and an ink jet printing apparatus are provided which can have smaller sizes if a print head is used which includes a substrate with a plurality of ejection port arrays and a substrate with ejection port arrays longer than the plurality of ejection port arrays. A drive
Inventors: Satoshi Oikawa, Yuji Tamaru, Yukuo Yamaguchi, Satoshi Kimura

Liquid ejecting head, method of manufacturing liquid ejecting head, and liquid ejection printing apparatus

10/31/13 - 20130286099 - The liquid ejecting head includes a printing element board having a plurality of printing elements for producing energy used to eject liquid, a contact board having a contact terminal for electrically connecting to a liquid ejection printing apparatus, and a functional element, a plurality of lands which are provided on
Inventors: Chiaki Muraoka, Yukuo Yamaguchi, Satoshi Oikawa, Junji Tatsumi, Satoshi Kimura, Takuya Iwano

Recording apparatus

05/17/12 - 20120120154 - A liquid ejection apparatus has an ejection orifice ejecting a liquid; a liquid storage section storing the liquid; a conductive communication path forming member forming a communication path to supply the liquid from the liquid storage section to the ejection orifice; and an electrode provided inside the liquid storage section
Inventors: Satoshi Oikawa, Yusuke Kiyokawa, Kenji Kitabatake, Takuya Iwano

Liquid ejection head and flexible wiring substrate used in liquid ejection head

05/10/12 - 20120113192 - A flexible wiring substrate that is used in a liquid ejection head having an element substrate provided with energy generating elements for generating energy for ejecting liquid includes: a bending portion; a base member including resin; electrical wiring lines formed on the base member and electrically connected to the element
Inventors: Satoshi Kimura, Satoshi Oikawa, Kenji Kitabatake, Yukuo Yamaguchi

Liquid discharge head and assembly method of liquid discharge head

12/22/11 - 20110310161 - An assembly method of a liquid discharge head is provided. The liquid discharge head includes an element substrate, an electrode portion, a flexible wiring member which has the element substrate at one end and the electrode portion at another end, and includes a plurality of bent portions, wherein, each edge
Inventors: Satoshi Kimura, Satoshi Oikawa, Kenji Kitabatake, Yukuo Yamaguchi

Recording head and method for manufacturing the same

06/16/11 - 20110141196 - One of an electric wiring substrate and a retaining member includes a section having an absorptance with respect to a laser beam, and the other one of the electric wiring substrate and the retaining member includes a section having a transmittance with respect to the laser beam. The electric wiring
Inventors: Satoshi Oikawa

Liquid discharge head and method of manufacturing the same

03/24/11 - 20110069119 - A liquid discharge head includes a liquid discharge substrate including a discharge port; a flow path for supplying liquid to the liquid discharge substrate; an absorption member capable of absorbing a laser beam, wherein a first flow path portion constituting a portion of a wall of the flow path is
Inventors: Osamu Morita, Kenji Kitabatake, Satoshi Oikawa

Liquid discharge head and method of manufacturing the same

06/24/10 - 20100156996 - A liquid discharge head includes a liquid discharge substrate including a discharge port for discharging liquid, and a flow path member including a transparent member that is transparent to a laser beam, an absorption member capable of absorbing a laser beam, and a flow path for supplying liquid to the
Inventors: Satoshi Oikawa, Osamu Morita


### Satoshi Oikawa patent invention listings

The bibliographic references displayed about Satoshi Oikawa's patents are for a recent sample of Satoshi Oikawa's publicly published patent applications. The inventor/author may have additional bibliographic citations listed at the USPTO.gov. FreshPatents.com is not associated or affiliated in any way with the author/inventor or the United States Patent/Trademark Office but is providing this non-comprehensive sample listing for educational and research purposes using public bibliographic data published and disseminated from the United States Patent/Trademark Office public datafeed. This information is also available for free on the USPTO.gov website. If Satoshi Oikawa filed recent patent applications under another name, spelling or location then those applications could be listed on an alternate page. If no bibliographic references are listed here, it is possible there are no recent filings or there is a technical issue with the listing--in that case, we recommend doing a search on the USPTO.gov website.

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