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  Rotational alignment mechanism for load cupsUSPTO Application #: 20070281589Title: Rotational alignment mechanism for load cups Abstract: The present invention generally relates to a substrate transferring system having an alignment mechanism of a surface and to two points. One embodiment of the present invention provides a load cup for transferring a substrate. The load cup comprises a cup having a substrate supporting surface configured to support the substrate thereon, and two alignment pins protruding from the cup outside the substrate supporting surface, wherein the two alignment pins are both positioned at a first distance away from a center of the substrate supporting surface, and the cup is pivotable about a pivoting point positioned at a second distance away from the center. (end of abstract)
Agent: Patterson & Sheridan, LLP - Houston, TX, US Inventors: Jeonghoon Oh, Hung Chih Chen, Steven M. Zuniga USPTO Applicaton #: 20070281589 - Class: 451 11 (USPTO) The Patent Description & Claims data below is from USPTO Patent Application 20070281589. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001]This application claims priority to U.S. Provisional Patent Application Ser. No. 60/810,350, entitled "Rotational Alignment Mechanism for New Load Cup", filed Jun. 2, 2006, which is herein incorporated by reference in its entirety. BACKGROUND OF THE INVENTION [0002]1. Field of the Invention [0003]Embodiments of the present invention generally relate to an apparatus and a method for transferring a substrate. [0004]2. Description of the Related Art [0005]Sub-micron multi-level metallization is one of the key technologies for the next generation of ultra large-scale integration (ULSI). The multilevel interconnects that lie at the heart of this technology require planarization of interconnect features formed in high aspect ratio apertures, including contacts, vias, trenches and other features. [0006]Planarization is generally performed using Chemical Mechanical Polishing (CMP) and/or Electro-Chemical Mechanical Deposition (ECMP). A planarization method typically requires that a substrate be mounted in a carrier head, with the surface to be polished exposed. The substrate supported by the carrier head is then placed against a rotating polishing pad. The carrier head holding the substrate may also rotate, to provide additional motion between the substrate and the polishing pad surface. [0007]A load cup is generally used for substrate transferring to and from a carrier head. During the substrate transferring process, good concentricity/alignment between the carrier head and the load cup is desired to ensure fast, reliable and safe substrate hand off between the load cup and the carrier head. The alignment mechanism in the state of the art system generally includes sliding a tapered surface of on the load cup to a tapered lip on the carrier head. This alignment mechanism has a few limitations including limited capture range, requiring precise surface control over large area, and uncertain mate condition since the mate is over a tapered surface to a tapered surface. [0008]Therefore, there is a need for an apparatus and method to improve substrate transferring between a load cup and a carrier head. SUMMARY OF THE INVENTION [0009]The present invention generally relates to a substrate transferring system having an alignment mechanism of a surface and two points. [0010]One embodiment of the present invention provides a load cup for transferring a substrate comprising a cup having a substrate supporting surface configured to support the substrate thereon, and two alignment pins protruding from the cup outside the substrate supporting surface, wherein the two alignment pins are both positioned at a first distance away from a center of the substrate supporting surface, and the cup is pivotable about a pivoting point positioned at a second distance away from the center. [0011]Another embodiment of the present invention relates to a substrate transfer assembly, comprising a load cup comprising a substrate supporting surface having a center, the substrate supporting surface configured to support a substrate thereon, and two alignment pins protruding from the load cup at a first distance away from the center, a shaft extending from the load cup at a second distance away from the center, and a supporting arm pivotably connected to the shaft, and a carrier head having a substrate receiving surface configured to receive a substrate, the carrier head is relatively movable from the load cup. [0012]Yet another embodiment of the present invention relates to a method for aligning a load cup with a carrier head for transferring a substrate comprising providing two alignment pins extending from the load cup, wherein the two alignment pins are configured to align the load cup with the carrier head, providing a pivoting point about which the load cup may rotate, wherein the pivoting point is away from a central axis of the load cup, moving the carrier head and the load cup relatively such that the carrier head is in contact with one of the two alignment pins, pivoting the load cup about the pivoting point such that the carrier head is in contact with both of the two alignment pins. BRIEF DESCRIPTION OF THE DRAWINGS [0013]So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments. [0014]FIG. 1 illustrates a partial sectional view of a state of the art system for substrate transferring. [0015]FIG. 2 illustrates a partial sectional view of a substrate transferring system in accordance with one embodiment of the present invention. [0016]FIG. 3A illustrates a top view of the substrate transferring system of FIG. 2. [0017]FIG. 3B illustrates a top view of the substrate transferring system of FIG. 2 at a pivoted position. [0018]FIG. 4A and 4B illustrate an exemplary method for aligning a load cup and a carrier head. [0019]FIG. 5 schematically illustrates a capturing range for the substrate transferring system of the present invention. DETAILED DESCRIPTION Continue reading... Full patent description for Rotational alignment mechanism for load cups Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Rotational alignment mechanism for load cups patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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