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Reza Jalilizeinali patents

Recent patents with Reza Jalilizeinali listed as an inventor - additional entries may be under other spellings.


Reza Jalilizeinali - Related organizations: Qualcomm Incorporated patents

Electrostatic protection for stacked multi-chip integrated circuits

04/10/14 - 20140098448 - One feature pertains to a multi-chip module that comprises at least a first integrated circuit (IC) die and a second IC die. The second IC die has an input/output (I/O) node electrically coupled to the first IC die by a through substrate via. The second die's active surface also includes
Inventors: Brian M. Henderson, Chiew-guan Tan, Gregory A. Uvieghara, Reza Jalilizeinali

Reduced susceptibility to electrostatic discharge during 3d semiconductor device bonding and assembly

05/23/13 - 20130127046 - Electrostatic discharge susceptibility is reduced when assembling a stacked IC device by coupling a ground plane of a first semiconductor device and a ground plane of a second semiconductor device to place the ground plane at substantially a same electrical potential. Active circuitry on the first semiconductor device and active
Inventors: Brian M. Henderson, Ronnie A. Lindley, Dong Wook Kim, Reza Jalilizeinali, Shiqun Gu, Matthiew M. Nowak

Block power switch with embedded electrostatic discharge (esd) protection and adaptive body biasing

05/02/13 - 20130105951 - A block power switch may be embedded with electrostatic discharge (ESD) protection circuitry. A transistor portion of the block power switch may he allocated to act as part of ESD protection circuitry and may be combined with an RC clamp to provide ESD protection. Adaptive body biasing (ABB) may be
Inventors: Mikhail Popovich, Yuan-cheng Pan, Boris Andreev, Junmou Zhang, Reza Jalilizeinali

Distributed building blocks of r-c clamping circuitry in semiconductor die core area

09/06/12 - 20120224284 - A semiconductor die includes resistor-capacitor (RC) clamping circuitry for electrostatic discharge (ESD) protection of the semiconductor die. The RC clamping circuitry includes building blocks distributed in the pad ring and in the core area of the semiconductor die, The building blocks include at least one capacitor block in the core
Inventors: Reza Jalilizeinali, Evan Siansuri, Sreeker R. Dundigal, Eugene R. Worley

Diode having a pocket implant blocked and circuits and methods employing same

03/29/12 - 20120074496 - Diodes, including gated diodes and shallow trench isolation (STI) diodes, manufacturing methods, and related circuits are provided without at least one halo or pocket implant thereby reducing capacitance of the diode. In this manner, the diode may be used in circuits and other devices having performance sensitive to load capacitance
Inventors: Reza Jalilizeinali, Eugene R. Worley, Evan Siansuri, Sreeker Dundigal


### Reza Jalilizeinali patent invention listings

The bibliographic references displayed about Reza Jalilizeinali's patents are for a recent sample of Reza Jalilizeinali's publicly published patent applications. The inventor/author may have additional bibliographic citations listed at the USPTO.gov. FreshPatents.com is not associated or affiliated in any way with the author/inventor or the United States Patent/Trademark Office but is providing this non-comprehensive sample listing for educational and research purposes using public bibliographic data published and disseminated from the United States Patent/Trademark Office public datafeed. This information is also available for free on the USPTO.gov website. If Reza Jalilizeinali filed recent patent applications under another name, spelling or location then those applications could be listed on an alternate page. If no bibliographic references are listed here, it is possible there are no recent filings or there is a technical issue with the listing--in that case, we recommend doing a search on the USPTO.gov website.

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