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05/01/08 | 31 views | #20080099149 | Prev - Next | USPTO Class 156 | About this Page  156 rss/xml feed  monitor keywords

Rework process for removing residual uv adhesive from c4 wafer surfaces

USPTO Application #: 20080099149
Title: Rework process for removing residual uv adhesive from c4 wafer surfaces
Abstract: A method for the removal of residual UV radiation-sensitive adhesive from the surfaces of semiconductor wafers, remaining thereon from protective UV radiation-sensitive tapes which were stripped from the semiconductor wafers. Moreover, provided is an arrangement for implementing the removal of residual sensitive adhesive, which remain from tapes employed as protective layers on semiconductor wafers, particularly wafers having surfaces including C4 connections. (end of abstract)
Agent: Scully, Scott, Murphy & Presser, P.C. - Garden City, NY, US
Inventors: Steven R. Codding, Timothy C. Krywanczyk, Edward J. Sprogis, Jocelyn Sylvestre, Matthew R. Whalen
USPTO Applicaton #: 20080099149 - Class: 156382000 (USPTO)


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Previous Patent Application:
Method for fabricating plasma reactor parts
Next Patent Application:
Adhesive connecting member, optical connecting structure used therewith, and jig for attaching adhesive connecting member
Industry Class:
Adhesive bonding and miscellaneous chemical manufacture

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