| Reducing or eliminating cross-talk at device-substrate interface -> Monitor Keywords |
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  Reducing or eliminating cross-talk at device-substrate interfaceRelated Patent Categories: Electricity: Conductors And Insulators, Conduits, Cables Or Conductors, Preformed Panel Circuit Arrangement (e.g., Printed Circuit), With Electrical DeviceThe Patent Description & Claims data below is from USPTO Patent Application 20060011384. Brief Patent Description - Full Patent Description - Patent Application Claims
FIELD OF THE INVENTION [0001] This invention is generally related to printed circuit boards, and more particularly to inter-layer shielding. BACKGROUND OF THE INVENTION [0002] It has always been a trend in the field of electronics to develop more complex, higher performance devices in the smallest practical size. Consequently, the density of connectors and conductive traces, and transmission rates on those connectors and traces is always increasing. Current manufacturing techniques enable reliable production of circuit boards with such great density and transmission rates that signal integrity is compromised by both cross-talk between densely packed traces and electromagnetic interference ("EMI") from other components in the surrounding environment. It would therefore be desirable to have practical means for mitigating these factors which compromise signal integrity. SUMMARY OF THE INVENTION [0003] In accordance with the present invention a portion of a signal transmission line which is orthogonal with the planes defined by layers of the printed circuit board is surrounded by grounded shielding, i.e., inter-layer shielding. The inter-layer shielding is a continuous, electrically conductive, grounded wall structure. Inter-layer shielding may be disposed between adjacent inner layers, between inner layers separated by one or more inner layers, between an outer layer and an adjacent inner layer, between an outer layer and an inner layer separated by one or more inner layers, and between an outer layer or inner layer and a component. [0004] In one embodiment of the invention inter-layer shielding is employed in conjunction with intra-layer shielding to provide even greater protection against cross-talk and EMI. Intra-layer shielding is a grounded wall around a transmission line along a run on a single printed circuit board layer. The intra-layer shielding may include an opening at a position where an electrical connection to another layer or component is desired. The inter-layer shielding is connected with the intra-layer shielding proximate to the opening such that a conductor may be disposed within the inter-layer shielding in contact with the transmission line either directly or with a connector such as a via-in-pad. Neither the intra-layer shielding nor the inter-layer shielding contact the transmission line or conductor. [0005] In another embodiment of the invention inter-layer shielding is employed as an integral part of a component around contacts such as electrically conducting pins. The shielding around the component contacts is designed to mate with a second portion of inter-layer shielding connected with intra-layer shielding such that an overlap is formed. The two inter-layer shieldings may be closely mated such that the component contact shielding is in physical contact with the second portion of inter-layer shielding. Further, the exposed overlap junction may be sealed with a conductive material. Alternatively, the shieldings may be loosely mated such that they are not in physical contact, but the overlap and gap between the shieldings present no line-of-sight path between the environment and the contact within the shieldings. [0006] Inter-layer shielding advantageously mitigates undesirable cross-talk and EMI. In particular, the grounded shielding tends to reduce or eliminate the undesirable effects of cross-talk and EMI on the portion of conductor within the shielding. When used in conjunction with intra-layer shielding, protection against cross-talk and EMI is extended along entire runs which traverse multiple printed circuit board layers. When used in conjunction with components, protection is extended into the component packaging. Each of these techniques advantageously enables more densely packed transmission lines of higher frequency. BRIEF DESCRIPTION OF THE DRAWINGS [0007] In order to facilitate a fuller understanding of the present invention, reference is now made to the appended drawings. These drawings should not be construed as limiting the present invention, but are intended to be exemplary only. [0008] FIG. 1 is a perspective view of inter-layer shielding; [0009] FIG. 2 is a cross-sectional view of the shielding of FIG. 1 taken along A-A'. [0010] FIG. 3 is a side-view diagram of component contact shielding for use with the shielding of FIGS. 1 and 2. [0011] FIG. 4 is a bottom-view of the shielding of FIG. 3. [0012] FIG. 5 is a perspective view illustrating use of the shielding of FIG. 3 with the shielding of FIGS. 1 and 2. [0013] FIG. 6 is a cross-sectional view of the interconnected shieldings of FIG. 5 taken along line B-B'. [0014] FIG. 7 is a diagram of an alternative implementation of the shielding of FIG. 3 with the shielding of FIGS. 1 and 2. DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS [0015] Referring to FIGS. 1 and 2, a printed circuit board includes signal transmission lines 12, 14 for transmitting signals between components on the board, and also between components on the board and other components associated with other boards. Each transmission line includes a conductor 16, such as a copper trace, disposed on a substrate 18. In the case of a multi-layer circuit board, a plurality of signal layers with transmission lines, power layers and ground layers are laminated in parallel. The power and ground layers are sometimes referred to as power and ground "planes" because they typically include relatively large areas of conductive material and relatively few traces. In the illustrated embodiment a signal layer is disposed adjacent to a ground plane 20. [0016] The transmission line is shielded along intra-layer runs by a grounded, electrically conductive shield 22 such as that described in U.S. Pat. No. 6,444,922 which is incorporated by reference. The intra-layer shield 22 is connected with the ground plane 20 in order to form a wall that completely surrounds, but does not contact, the conductor. The connection between the intra-layer shielding and the ground plane also provides the requisite grounding of the shielding. The volume of the transmission line between the conductor and the shield is filled with a dielectric material 24 such as thermoplastic polymer modified epoxy resin and glass cloth (e.g., FR4, FR5), polytetrafluoroethylene ("Teflon") or other materials having similar dielectric constant. [0017] Means for providing electrical interconnection between layers, i.e., inter-layer connection, are employed to interconnect corresponding transmission lines on parallel signal layers and also to connect components with transmission lines. For example, a via-in-pad 26 may be disposed at least partially within the intra-layer shielding 22 and in contact with the conductor 16. The intra-layer shielding includes an opening 28 proximate to the electrical interconnect 26 to permit interconnection with a parallel layer of the printed circuit board without shorting to the shielding. For example, the transmission line may include a conductive material disposed through the opening and between corresponding inter-layer connectors associated with different layers of the printed circuit board. Similarly, the conductive material may be disposed through the opening, and between the inter-layer connector and a component. [0018] Referring now to FIGS. 1 and 2, in contrast with known shielding techniques, the portion of the transmission line which traverses between first and second layers of a printed circuit board, or between a first layer and a component, is surrounded by grounded inter-layer shielding 30. The inter-layer shielding 30 is orthogonal with planes defined by printed circuit board layers and may be formed from copper, conductive paste or other suitable electrically conductive materials. The inter-layer shielding is connected with the intra-layer shielding 22 proximate to the opening 28 in the intra-layer shielding. The connection with the intra-layer shielding provides an electrically conductive pathway to the ground plane 20, i.e., grounding of the inter-layer shielding. Consequently, the combined shielding structure is a continuous, uninterrupted (except at termination) barrier to cross-talk and EMI. [0019] The inter-layer shielding 30, shown in FIG. 2, may be employed to provide shielding between an inner layer and an outer layer, between first and second inner layers, and also between a transmission line and an electronic component. To provide shielding between an inner layer and an outer layer, the shielding extends from the intra-layer shielding on the inner layer to the outer layer. It should be noted that the interconnected layers may be adjacent or separated by one or more intermediate layers. To provide shielding between transmission lines on different layers, the shielding may be formed around aligned via-in-pad type connectors which are connected with a conductive material. Again, the interconnected layers may be adjacent or separated by one or more intermediate layers. Continue reading... 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