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Reciprocating megasonic probeRelated Patent Categories: Cleaning And Liquid Contact With Solids, Liquid Treating Forms And Mandrels, Including Application Of Electrical Radiant Or Wave Energy To WorkReciprocating megasonic probe description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070144556, Reciprocating megasonic probe. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS REFERENCE TO RELATED APPLICATIONS [0001] The present application is a divisional application of U.S. patent application Ser. No. 10/140,029, filed on May 6, 2002, the entirety of which is hereby incorporated by reference. FIELD OF THE INVENTION [0002] The present invention relates to an apparatus and method for cleaning substrates, including semiconductor wafers or other such items requiring extremely high levels of cleanliness. BACKGROUND OF THE INVENTION [0003] Substrates such as semiconductor wafers are frequently cleaned in a cleaning solution into which megasonic energy is propagated. Megasonic cleaning systems, which operate at a frequency over twenty times higher than ultrasonic, safely and effectively remove particles from materials without the negative side effects associated with ultrasonic cleaning. [0004] One type of megasonic cleaning apparatus shown in U.S. Pat. No. 6,140,744 comprises a piezoelectric transducer coupled to a transmitter in the form of a probe. The transducer is electrically excited such that it vibrates, and the probe transmits high frequency energy into liquid sprayed onto an adjacent, rotating semiconductor wafer. The agitation of the cleaning fluid produced by the megasonic energy loosens particles on the wafer. Contaminants are thus vibrated away from the surfaces of the wafer and removed through the continuous flow of the cleaning fluid. [0005] In U.S. Pat. No. 4,537,511, issued to Frei, an elongated metal tube in a tank of cleaning fluid is energized in the longitudinal wave mode by a transducer that extends through a wall of the tank and is attached to the end of the tube. In order to compensate for relatively high internal losses, the radiating arrangement uses a relatively thin-walled tubular member. [0006] A need exists for an improved apparatus and method which can be used to clean semiconductor wafers and other substrates. SUMMARY OF THE INVENTION [0007] In accordance with one embodiment of the invention, a method of cleaning a substrate comprises placing the substrate on a rotating fixture, applying a liquid to at least one side of the substrate, and creating a standing wave of megasonic energy oriented generally parallel to the substrate. The standing wave generates an associated pattern of high-agitation regions in the liquid. The method further comprises creating relative back-and-forth movement between the standing wave and the substrate so as to move the pattern of high-agitation regions with respect to the substrate. [0008] In accordance with another embodiment of the invention, an apparatus for cleaning substrates comprises a rotary support which is adapted to support the substrate and rotate it about a first axis, and a megasonic energy transmitter extending generally parallel to a surface of the substrate. The apparatus further comprises a megasonic transducer in acoustically coupled relation to the transmitter, and a reciprocation drive in fixed relation to the transmitter. The reciprocation drive moves the transmitter back-and-forth within a plane generally parallel to the surface of the substrate. The megasonic transmitter agitates a liquid on a surface of the substrate, which results in a pattern of high-agitation regions formed in the liquid by the transmitter. [0009] In still another embodiment a method of cleaning a substrate comprises placing the substrate on a rotating fixture, placing a liquid on at least one side of the substrate, and creating a standing wave of megasonic energy oriented generally parallel to the substrate. The standing wave generates an associated pattern of high-agitation regions in the liquid. The method further comprises causing back-and-forth movement of the standing wave relative to the substrate or vice versa so as to move the pattern of high-agitation regions about with respect to the substrate. [0010] In still another embodiment a method of cleaning a substrate comprises placing the substrate on a rotating fixture, applying a liquid to at least one side of the substrate, and creating a wave of megasonic energy oriented generally parallel to the substrate, the wave generating high-agitation regions in the liquid. The method further comprises moving the high-agitation regions about with respect to the substrate. [0011] All of these embodiments are intended to be within the scope of the invention herein disclosed. These and other embodiments of the present invention will become readily apparent to those skilled in the art from the following detailed description of the preferred embodiments having reference to the attached figures, the invention not being limited to any particular preferred embodiment(s) disclosed. BRIEF DESCRIPTION OF THE DRAWINGS [0012] Having thus summarized the general nature of the invention and its essential features and advantages, certain preferred embodiments and modifications thereof will become apparent to those skilled in the art from the detailed description herein having reference to the figures that follow, of which: [0013] FIG. 1 is a schematic side elevation view of a known megasonic wafer cleaner; [0014] FIG. 2 is a schematic side elevation view of a transmitter-wafer junction of the prior-art cleaner of FIG. 1; [0015] FIG. 3 is a schematic side elevation view of the inventive megasonic wafer cleaner; and [0016] FIG. 4 is a schematic side elevation view of a transmitter-wafer junction of the inventive cleaner of FIG. 3. [0017] FIG. 5 is a perspective view of one embodiment of a reciprocation drive for use with the cleaner of FIG. 3. [0018] FIG. 6 is a partial perspective view of the reciprocation drive of FIG. 5. [0019] FIG. 7A is a graph of one control methodology for the reciprocation drive. Continue reading about Reciprocating megasonic probe... Full patent description for Reciprocating megasonic probe Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Reciprocating megasonic probe patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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