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Process of cleaning a substrate for microelectronic applications including directing mechanical energy through a fluid bath and apparatus of same

Process of cleaning a substrate for microelectronic applications including directing mechanical energy through a fluid bath and apparatus of same description/claims

The following disclosure is a non-provisional application which claims priority to U.S. Provisional Application No. 61/020,658 filed Jan. 11, 2008, entitled “Process of cleaning a substrate for microelectronic applications including directing mechanical energy through a fluid bath and apparatus of same” and having named inventors Oh-Hun Kwon, Raymond H. Bryden, and Qiang Zhao, and further claims priority to U.S. Provisional Application No. 60/912,128 filed Apr. 16, 2007, entitled “Process of cleaning a substrate for microelectronic applications including directing mechanical energy through a fluid bath and apparatus of same” and having named inventors Oh-Hun Kwon, Raymond H. Bryden, and Qiang Zhao, applications of which are incorporated by reference herein in their entirety.

1. Field of the Disclosure

This disclosure pertains in general to semiconductor processing and, more specifically to directing mechanical energy through a fluid bath.

2. Description of the Related Art

Within the semiconductor processing arts, contamination control is a critical and ongoing problem. As the core component size is reduced with successive generations, contamination control remains an ongoing concern. Of particular concern is the elimination of particulate contamination from workpieces, such as semiconductor substrates, photomasks, and reticles.

One method of removing particulate contamination includes submerging the workpiece in a cleaning solution and applying ultrasonic or megasonic energy to help dislodge unwanted particles at the surface of the workpiece. However, the size of the particulate contamination of interest has reduced as the size of the electrical components formed has decreased with succeeding generations. Transfer of ultrasonic or megasonic energy to smaller particles is less efficient than with larger particles so more energy is applied to maintain cleaning efficiency as smaller particles are removed. Thus, at successive generations, smaller and more fragile structures along the surfaces of the workpieces are subjected to more energy, increasing the likelihood of process-induced damage during the cleaning process.

Accordingly, the industry continues to demand improved articles and processes for removing particulate contamination that will decrease the process-induced damage that occurs during cleaning a substrate for microelectronic application.

The present disclosure may be better understood, and its numerous features and advantages made apparent to those skilled in the art by referencing the accompanying drawings.

FIG. 1 includes an illustration of cross-sectional view of a workpiece in a tank, according to one embodiment.

FIG. 2 includes an illustration of a cross-sectional view of a portion of a fixture, according to one embodiment.

FIG. 3 includes an illustration of a cross-sectional view of a portion of a tank, according to one embodiment.

FIG. 4 includes an illustration of a cross-sectional view of a plurality of workpieces in a tank, according to one embodiment.

FIG. 5 includes an illustration of a cross-sectional view of a workpiece in a tank, according to one embodiment.

FIG. 6 includes an illustration of a cross-sectional view of a workpiece on a fixture, according to one embodiment.

FIG. 7 includes a plot of weight loss as a function test cycle for samples and comparative samples according to one embodiment.

• Provisional Patent
• Utility Patent

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