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12/29/05 - USPTO Class 324 |  113 views | #20050285609 | Prev - Next | About this Page  324 rss/xml feed  monitor keywords

Probe unit and its manufacturing method

USPTO Application #: 20050285609
Title: Probe unit and its manufacturing method
Abstract: A probe unit comprises a substrate and a lead formed on the substrate and having a tip part projecting from an edge of the substrate and contacting to an electrode of a sample, and a thick part of which thickness is thicker than the tip part. The probe unit can make continuity with a sample firmly with a proper contact pressure while lowering electrical resistance of leads. (end of abstract)



Agent: Dickstein Shapiro Morin & Oshinsky LLP - New York, NY, US
Inventors: Masahiro Sugiura, Kunio Hiyama, Susumu Ogino
USPTO Applicaton #: 20050285609 - Class: 324754000 (USPTO)

Probe unit and its manufacturing method description/claims


The Patent Description & Claims data below is from USPTO Patent Application 20050285609, Probe unit and its manufacturing method.

Brief Patent Description - Full Patent Description - Patent Application Claims
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CROSS REFERENCE TO RELATED APPLICATION

[0001] This application is based on Japanese Patent Application 2004-190963, filed on Jun. 29, 2004, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

[0002] A) Field of the Invention

[0003] The present invention relates to a probe unit and a manufacturing method thereof.

[0004] B) Description of the Related Art

[0005] Conventionally a probe unit having a plurality of leads projecting from a substrate and contacting with electrodes of a sample is known. In a probe unit disclosed in Japanese Laid-open Patent No.2002-286755 (hereinafter called the Patent Document 1), tips of leads and their peripheral areas are bent by overdrive because the leads are projecting from a substrate. Therefore, the tips of the leads and the electrodes of the sample can be conducted firmly with a proper contacting pressure.

[0006] In the conventional probe unit as disclosed in the Patent Document 1, thicknesses of the leads are uniformed. Moreover, material for the leads and the thicknesses of the leads are designed in accordance with durability of the projection parts of the leads from the substrate and the above-described contacting pressure. Therefore, it is not easy for the probe unit according to the Patent Document 1 to be designed to have low electric resistance by forming the leads with material having low electric resistance and by making the thicknesses thick. In addition to that, widths of the leads are designed in accordance with a pitch of the electrodes of the sample. Therefore, narrowing the widths of the leads cannot lower the electric resistance of the leads. In this type of the probe unit, a frequency range that can be used in a continuity test will be narrow because of a high conductor loss.

[0007] On the other hand, Japanese Laid-open Patent No.2003-57266 discloses a probe unit wherein leads are formed on a film, tips of the leads are projecting from the film, and the tips and the middle parts of the leads are made of different materials. In the probe unit according to the Patent Document 2, middle parts of the leads can be made of material having lower electrical resistance than their tips. That is, the frequency range of a signal that can be used in a continuity test can be widened by lowering conductor losses because the electrical resistance of the leads can be lowered.

[0008] However, the probe unit according to the Patent Document 2 is manufactured by forming leads on a supporting metal plate, contacting parts of the leads that are not projecting from a film with the film by adhesive, and separating the supporting metal plate. The leads on the supporting metal plate side will be plane because they are formed on the supporting metal plate. Moreover, the adhesive contacts the leads and the film; therefore, large steps cannot be formed on the film side of the leads. That is, widths of the leads in the probe unit according to the Patent Document 2 cannot be designed freely to lower the electrical resistance of the leads.

SUMMARY OF THE INVENTION

[0009] It is an object of the present invention to provide a probe unit and its manufacturing method which can make continuity with a sample firmly with a proper contact pressure while lowering electrical resistance of leads.

[0010] According to one aspect of the present invention, there is provided a probe unit, comprising: a substrate; and a lead formed on the substrate and having a tip part projecting from an edge of the substrate and contacting to an electrode of a sample, and a thick part of which thickness is thicker than the tip part.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG. 1A is a cross sectional view showing a probe cut in line X1-X1 in FIG. 1B according to a first embodiment of a probe unit of the present invention, and FIG. 1B is a plan view showing the probe.

[0012] FIG. 2A is a side view of the probe according to the first embodiment of the probe unit of the present invention, and FIG. 2B is a plan view showing the probe.

[0013] FIG. 3A is a side view showing a first layer of the probe according to the first embodiment of the probe unit of the present invention, and FIG. 38 is a plan view.

[0014] FIG. 4 is a schematic diagram of the probe of a probe unit according to the first embodiment of the probe unit of the present invention.

[0015] FIG. 5 is a schematic diagram of the probe of the probe unit according to the first embodiment of the probe unit of the present invention,

[0016] FIG. 6 is a schematic diagram of the probe of the probe unit according to the first embodiment of the probe unit of the present invention.

[0017] FIG. 7A1 to FIG. 7B2 are schematic diagrams showing a continuity test by the probe of the probe unit according to the first embodiment of the probe unit of the present invention.

[0018] FIG. 8 is a schematic diagram of the probe of the probe unit according to the first embodiment of the probe unit of the present invention.

[0019] FIG. 9A is a cross sectional view showing a probe cut in line X2-X2 in FIG. 9B according to a second embodiment of the probe unit of the present Invention, and FIG. 9B is a plan view showing the probe.

[0020] FIG. 10A and FIG. 10B are schematic diagrams showing a continuity test by the probe of the probe unit according to the second embodiment of the probe unit of the present invention.

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