| Polishing pad and polishing apparatus -> Monitor Keywords |
|
|
  Polishing pad and polishing apparatusUSPTO Application #: 20070135024Title: Polishing pad and polishing apparatus Abstract: A polishing pad enables efficient removal of a polishing product and an “old polishing liquid” remaining on a surface (polishing surface) or in through-holes of a polishing pad. The polishing pad has a polishing surface and a plurality of through-holes extending in the thickness direction, which communicate with each other by communication grooves. The through-holes have a diameter of, e.g., 2 to 5 mm. The aperture ratio of the through-holes is, e.g., 10 to 50% of the surface area of the polishing surface of the polishing pad. The depth of the communication grooves is, e.g., 40 to 60% of the thickness of the polishing pad. The width of the communication grooves is, e.g., 10 to 50% of the diameter of the through-holes. (end of abstract) USPTO Applicaton #: 20070135024 - Class: 451056000 (USPTO) Related Patent Categories: Abrading, Abrading Process, With Tool Treating Or Forming
Click on the above for other options relating to this Polishing pad and polishing apparatus patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Polishing pad and polishing apparatus or other areas of interest. ### Previous Patent Application: Lapping system having a polymeric lapping tool Next Patent Application: Surface treating method for golf club head Industry Class: Abrading ### FreshPatents.com Support Thank you for viewing the Polishing pad and polishing apparatus patent info. IP-related news and info Results in 0.19077 seconds Other interesting Feshpatents.com categories: Tyco , Unilever , Warner-lambert , 3m |
|||
