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08/16/07 - USPTO Class 051 |  126 views | #20070186485 | Prev - Next | About this Page  051 rss/xml feed  monitor keywords

Polishing composition and rinse composition

USPTO Application #: 20070186485
Title: Polishing composition and rinse composition
Abstract: A polishing composition for reducing the haze level of the surface of silicon wafers contains hydroxyethyl cellulose, polyethylene oxide, an alkaline compound, water, and silicon dioxide. (end of abstract)



Agent: Vidas, Arrett & Steinkraus, P.A. - Minnetonka, MN, US
Inventor: Shoji IWASA
USPTO Applicaton #: 20070186485 - Class: 051308000 (USPTO)

Related Patent Categories: Abrasive Tool Making Process, Material, Or Composition, With Inorganic Material, Clay, Silica, Or Silicate

Polishing composition and rinse composition description/claims


The Patent Description & Claims data below is from USPTO Patent Application 20070186485, Polishing composition and rinse composition.

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Previous Patent Application:
Metal-polishing liquid and chemical mechanical polishing method using the same
Next Patent Application:
Polishing composition and rinse composition
Industry Class:
Abrasive tool making process, material, or composition

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