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06/14/07 | 2 views | #20070135020 | Prev - Next | USPTO Class 451 | About this Page  451 rss/xml feed  monitor keywords

Polishing apparatus and polishing method

USPTO Application #: 20070135020
Title: Polishing apparatus and polishing method
Abstract: A polishing apparatus polish a surface of a substrate, such as a semiconductor substrate. The polishing apparatus according to the present invention includes a substrate holding mechanism, a polishing table having a polishing surface, and a polishing surface temperature controller for controlling a temperature distribution of the polishing surface. The substrate holding mechanism and the polishing table are operable to provide relative movement between the surface of the substrate and the polishing surface while the substrate holding mechanism presses the surface of the substrate against the polishing surface to thereby polish the surface of the substrate. The polishing surface temperature controller controls the temperature distribution so that the polishing surface has a predetermined temperature distribution to thereby control removal rates of portions of the surface of the substrate. (end of abstract)
USPTO Applicaton #: 20070135020 - Class: 451007000 (USPTO)
Related Patent Categories: Abrading, Precision Device Or Process - Or With Condition Responsive Control, Controlling Temperature

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