Polishing apparatus and method with direct load platen

Title: Polishing apparatus and method with direct load platen

Related Patent Categories: Abrading, Precision Device Or Process - Or With Condition Responsive Control, Computer Controlled

Brief Patent Description - Full Patent Description - Patent Claims

The Patent Description & Claims data below is from USPTO Patent Application 20070077861, Polishing apparatus and method with direct load platen.

1. A chemical mechanical polishing apparatus, comprising: a carousel having N (where N>2) polishing heads, the N polishing heads positioned at substantially equal angles around an axis of rotation of the carousel; N platens, including a loading platen, each of the N platens configured to support a polishing article, the N platens positioned at substantially equal angles around the axis of rotation of the carousel, such that each polishing head can position a substrate in contact with a polishing article at an associated platen; and a robot located proximate to the loading platen and configured to position a substrate on the polishing article at the loading platen for loading into a polishing head from the N polishing heads.

2. The apparatus of claim 1, wherein the N polishing heads are rotatable.

3. The apparatus of claim 1, wherein the robot is configured to position the substrate only at the loading platen.

4. The apparatus of claim 1, wherein the robot is configured to position the substrate at one of a plurality of platens from the N platens.

5. The apparatus of claim 1, wherein the robot is configured to retrieve a substrate from the loading platen.

6. The apparatus of claim 1, wherein the robot is configured to retrieve a substrate from a platen other than the loading platen.

7. The apparatus of claim 1, further comprising another robot located proximate to a second platen other than the loading platen and configured to position a substrate on the polishing article at the second platen for loading into another polishing head from the N polishing heads.

8. The apparatus of claim 1, further including a first positioning sensor to notify the robot that a substrate has reached a first desired position along a first dimension associated with the loading platen.

9. The apparatus of claim 8, further including a second positioning sensor to notify the robot that a substrate has reached a second desired position along a second dimension associated with the loading platen.

10. The apparatus of claim 8, wherein the first positioning sensor is coupled to the robot.

11. The apparatus of claim 8, wherein the first positioning sensor is coupled to one or more of the carousel or carrier head.

12. The apparatus of claim 8, further including: a controller, in communication with the first positioning sensor and the robot, the controller configured to receive a feedback signal from the first positioning sensor responsive to a position and, in response, send a position signal to the robot that directs movement of the robot.

13. The apparatus of claim 1, further including: means for adjusting a position of a substrate after being released by the robot and before being chucked by one of the N polishing heads.

14. The apparatus of claim 13, wherein the polishing head includes a retaining ring configured to adjust from a first diameter to a second diameter that is smaller than the first diameter.

15. The apparatus of claim 14, wherein the adjustable ring is configured to unload the substrate by adjusting from the second diameter to the first diameter.

16. The apparatus of claim 13, wherein the loading platen includes a set of alignment pins to more accurately position the substrate for loading by repositioning the substrate.

17. The apparatus of claim 16, wherein the alignment pins are retractable into the platen.

18. The apparatus of claim 17, wherein a spacing between inner surfaces of the alignment pins provides a dimension that is larger at a top than a bottom of the alignment pints.

19. The apparatus of claim 1, wherein the loading platen is rotatable to a loading position for access that is not obstructed by the carrier head, and the loading platen is rotatable to a chucking position for access by the carrier head.

20. The apparatus of claim 1, further comprising: a base, wherein the carousel and the N platens are each coupled to the base for support.

21. A chemical mechanical polishing apparatus, comprising: a polishing head; a platen configured to support a polishing article; a robot located proximate to the platen and configured to position a substrate on the polishing article; and an adjustment mechanism having a moveable element to engage the substrate at a first position and move to reposition the substrate to a second position laterally displaced from the first position, the second position being within a range of positions for the polishing head to chuck the substrate from the polishing article on the platen, the first position including positions that are out of the range.

22. The apparatus of claim 21, wherein the moveable element includes a retaining ring configured to adjust from a first diameter to a second diameter that is smaller than the first diameter.

23. The apparatus of claim 21, wherein the moveable element includes a set of alignment pins retractable into the platen.

24. The apparatus of claim 21, wherein the platen is rotatable to a loading position for access that is not obstructed by the carrier head, and the platen is rotatable to a loading position for access by the carrier head.

25. A chemical mechanical polishing apparatus, comprising: a platen to support a polishing article; a robot located proximate the platen and configured to position a substrate on the polishing article; a carrier head having a retaining ring; a carrier head support mechanism configured to move the carrier head into a position that the retaining ring surrounds the substrate; and a controller configured to control the robot to position the substrate on the polishing article before the retaining ring contacts the polishing article.

26. A method of operating a polishing system, comprising: placing a substrate onto a polishing surface with a robot; bringing at least a portion of a carrier head into a loading position such that a retaining ring of the carrier head contacts the polishing surface after the substrate is placed onto the polishing surface, and surrounds the substrate; and causing relative motion between the carrier head and the polishing surface so as to polish the substrate.

27. The method of claim 26, wherein the substrate is placed onto the polishing surface at a first position, and further comprising moving the substrate from the first position to the loading position.

28. The method of claim 27, wherein moving the substrate includes adjusting a diameter of an inner surface of the retaining ring.

29. The method of claim 27, wherein moving the substrate includes contacting an edge of the substrate with an alignment pin.

30. The method of claim 27, wherein moving the substrate includes moving the platen.

31. The method of claim 26, further comprising chucking the substrate with the carrier head, moving the carrier head with the substrate to another polishing surface, and polishing the substrate with the another polishing surface.

32. The chemical mechanical polishing apparatus of claim 25, wherein the robot includes: an articulated arm having a substrate gripper to secure the substrate during motion of the robot; and a vertical shaft operable to adjust a vertical position of the articulated arm relative to the polishing article or the carrier head.

33. The chemical mechanical polishing apparatus of claim 25, further comprising a positioning sensor to determine whether the substrate has reached the position.

34. The chemical mechanical polishing apparatus of claim 25, wherein the retaining ring includes an adjustable inner diameter that provides a predetermined position tolerance associated with the position at which the substrate is placed by the robot.

35. The method of claim 26, further comprising transferring the substrate from the polishing surface to a different polishing surface using a different robot.

36. The method of claim 26, further comprising positioning a different substrate onto the polishing surface after transferring the substrate to a different polishing surface polishing station.

37. The chemical mechanical polishing apparatus of claim 23, wherein each retractable alignment pin includes tapered edges such that a top portion of the retractable alignment pin provides a larger substrate diameter than that of a lower portion of the retractable alignment pin.

Brief Patent Description - Full Patent Description - Patent Claims

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