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Polishing apparatus and method with direct load platenRelated Patent Categories: Abrading, Precision Device Or Process - Or With Condition Responsive Control, Computer ControlledPolishing apparatus and method with direct load platen description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070077861, Polishing apparatus and method with direct load platen. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND [0001] This present invention relates to chemical mechanical polishing apparatus and methods. [0002] An integrated circuit is typically formed on a substrate by the sequential deposition of conductive, semiconductive or insulative layers on a silicon wafer. One fabrication step involves depositing a filler layer over a non-planar surface, and planarizing the filler layer until the non-planar surface is exposed. For example, a conductive filler layer can be deposited on a patterned insulative layer to fill the trenches or holes in the insulative layer. The filler layer is then polished until the raised pattern of the insulative layer is exposed. After planarization, the portions of the conductive layer remaining between the raised pattern of the insulative layer form vias, plugs and lines that provide conductive paths between thin film circuits on the substrate. In addition, planarization is needed to planarize the substrate surface for photolithography. [0003] Chemical mechanical polishing (CMP) by a polisher is one accepted method of planarization. A conventional polisher includes a base with several polishing stations and a loading port. The loading port is typically dedicated to providing a precise position for chucking by a carrier or polishing head. After chucking the substrate from the loading port, the polisher may move the substrate to one or more of the polishing stations for processing. During planarization, the exposed surface of the substrate is placed against a polishing surface of a polishing pad, such as a rotating polishing disk or linearly advancing belt. The carrier head provides a controllable load on the substrate to push it against the polishing pad. A polishing liquid, which can include abrasive particles, is supplied to the surface of the polishing pad, and the relative motion between the substrate and polishing pad results in planarization and polishing. [0004] Conventional polishing pads include "standard" pads and fixed-abrasive pads. A typical standard pad has a polyurethane polishing layer with a durable roughened surface, and can also include a compressible backing layer. In contrast, a fixed-abrasive pad has abrasive particles held in a containment media, and can be supported on a generally incompressible backing layer. [0005] Overall, the process of forming an integrated circuit can be prohibitively and increasingly expensive. One major factor in expense is the necessary size of a conventional semiconductor fabrication plant that includes numerous processing machines other than the polisher. Each of the machines consume a certain area of the floor, known as a footprint. In particular, the loading port of a polisher can consume up to a quarter of a polisher footprint. Another major factor in expense is the amount time needed for the numerous steps in processing. Time of processing affects throughput, or production volume. Moreover, many steps require a handoff which can spoil a substrate through damage. SUMMARY [0006] This disclosure generally describes systems, methods, computer program products, and means for a chemical polishing apparatus. In general, a chemical polishing apparatus can load (and unload) a substrate directly on a polishing article or platen from which the substrate can be chucked by a polishing head. [0007] In one aspect, the invention is directed to a chemical mechanical polishing apparatus. The apparatus includes a carousel having N polishing heads, N platens and a robot. The N polishing heads positioned at substantially equal angles around an axis of rotation of the carousel. Each of the N platens is configured to support a polishing article, and the N platens are positioned at substantially equal angles around the axis of rotation of the carousel, such that each polishing head can position a substrate in contact with a polishing article at an associated platen. The N platens include a loading platen, and the robot is located proximate to the loading platen and is configured to position a substrate on the polishing article at the loading platen for loading into a polishing head from the N polishing heads. [0008] Implementations of the invention may include one or more of the following. The N polishing heads may be rotatable. The robot may be configured to position the substrate only at the loading platen, or be configured to position the substrate at one of a plurality of platens from the N platens. The robot may be configured to retrieve a substrate from the loading platen, or be configured to retrieve a substrate from a platen other than the loading platen. Another robot may be located proximate to a second platen other than the loading platen and may be configured to position a substrate on the polishing article at the second platen for loading into another polishing head from the N polishing heads. A first positioning sensor may notify the robot that a substrate has reached a first desired position along a first dimension associated with the loading platen. A second positioning sensor may notify the robot that a substrate has reached a second desired position along a second dimension associated with the loading platen. The first positioning sensor may be coupled to the robot, or is coupled to one or more of the carousel or carrier head. A controller may be in communication with the first positioning sensor and the robot, and the controller may configured to receive a feedback signal from the first positioning sensor responsive to a position and, in response, send a position signal to the robot that directs movement of the robot. The apparatus may include a means for adjusting a position of a substrate after being released by the robot and before being chucked by one of the N polishing heads. A retaining ring in the carrier head may be configured to adjust from a first diameter to a second diameter that is smaller than the first diameter. The adjustable ring may be configured to unload the substrate by adjusting from the second diameter to the first diameter. The loading platen may include a set of alignment pins to more accurately position the substrate for loading by repositioning the substrate. The alignment pins may be retractable into the platen. A spacing between inner surfaces of the alignment pins may provide a dimension that is larger at a top than a bottom of the alignment pints. The loading platen may be rotatable to a loading position for access that is not obstructed by the carrier head, and may be rotatable to a chucking position for access by the carrier head. The carousel and the N platens may each be coupled to the base for support. [0009] In another aspect, the invention is directed to a chemical mechanical polishing apparatus that includes a polishing head, a platen configured to support a polishing article, a robot located proximate to the platen and configured to position a substrate on the polishing article, and [0010] an adjustment mechanism to engage the substrate at a first position and reposition the substrate to a second position. The second position is within a range of positions for a polishing head to chuck the substrate from the loading platen, and the first position includes positions that are out of range. [0011] Implementations of the invention may include one or more of the following features. The adjustment mechanism may include a retaining ring configured to adjust from a first diameter to a second diameter that is smaller than the first diameter. The adjustment mechanism includes a set of alignment pins retractable into the platen. The platen may be rotatable to a loading position for access that is not obstructed by the carrier head, and the loading platen may be rotatable to a loading position for access by the carrier head. [0012] In another aspect, the invention is directed to a chemical mechanical polishing apparatus that includes a platen to support a polishing article, a robot located proximate the platen and configured to position a substrate on the polishing article, a carrier head having a retaining ring, and a carrier head support mechanism configured to move the carrier head into a position that the retaining ring surrounds the substrate. [0013] In another aspect, the invention is directed to a method of operating a polishing system. The method includes placing a substrate onto a polishing surface with a robot, bringing at least a portion of a carrier head into a loading position such that a retaining ring of the carrier head surrounds the substrate, and causing relative motion between the carrier head and the polishing surface so as to polish the substrate. [0014] Implementations of the invention may include one or more of the following features. The substrate may be placed onto the polishing surface at a first position, and the substrate may be moved from the first position to the loading position. Moving the substrate may include adjusting a diameter of an inner surface of the retaining ring, contacting an edge of the substrate with an alignment pin, or moving the platen. The substrate may be chucked with the carrier head, the carrier head may move with the substrate to another polishing surface, and the substrate may be polished with the another polishing surface. [0015] Implementations of the invention can include one or more of the following advantages. The apparatus, without a need for a dedicated load port, can have a reduced footprint within a fabrication facility. Moreover, by obviating a handoff, the apparatus can have a higher throughput and experience fewer losses from machine damage. As a result, the apparatus can reduce expenses incurred in connection with a semiconductor fabrication plant. [0016] The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the invention will be apparent from the description and drawings, and from the claims. DESCRIPTION OF DRAWINGS [0017] FIG. 1 is a schematic top views illustrating an implementation of a system to process substrates. [0018] FIG. 2 is a schematic cross-sectional side view illustrating a polishing station from the system of FIG. 1. [0019] FIGS. 3A-3C are schematic side views illustrating a process of loading a substrate into a polishing station. [0020] FIG. 4 is a schematic drawing illustrating another implementation of a system to process substrates. [0021] FIG. 5 is a schematic drawing illustrating another implementation of a system to process substrates. Continue reading about Polishing apparatus and method with direct load platen... Full patent description for Polishing apparatus and method with direct load platen Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Polishing apparatus and method with direct load platen patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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