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  Plating tankUSPTO Application #: 20070108044Title: Plating tank Abstract: Provides a plating tank that can transport platy work securely without causing abrasion and attain uniform plating quality and uniform plating film thickness. The shields are comprised of four shielding plates 108, 109, 112, and 113 on upper part and lower part of the thin plate board as follows. The restrict roller 304 is comprised of the roller stand body 120 which reaches until nearly upper end area's height of thin plate board and stood on upper face of the lower shielding plates 108, and the work-end deviation preventing member 122. (end of abstract) Agent: Merchant & Gould PC - Minneapolis, MN, US Inventors: Tomoji Okuda, Junji Mizumoto, Yutaka Kimura, Hiroki Omura USPTO Applicaton #: 20070108044 - Class: 204198000 (USPTO) Related Patent Categories: Chemistry: Electrical And Wave Energy, Apparatus, Electrolytic, Object Protection, Work Conveyer The Patent Description & Claims data below is from USPTO Patent Application 20070108044. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS REFERENCE TO RELATED APPLICATIONS [0001] The entire disclosure of Japanese Patent Application No. 2005-300255 including specification, claims, drawings and summary are incorporated herein by reference in its entirety. FIELD OF THE INVENTION [0002] The present invention relates to the skill which is used for electroplating a platy work, for example printed board etc., by a surface treatment device like an electroplating device. BACKGROUND ART [0003] A conventional surface treatment device like an electroplating device treats a platy work which is secured to a rack as to transfer without swinging. However, the surface treatment device of rackless type is suggested, because it is bothering task to mount the platy work in the rack and it is so large load that the device grows in size. [0004] As a surface treatment device of rackless type like this, Japanese Laid Open Patent Application No. 2002-363796 (Patent Document 1) is known. Referring to FIG. 14 and FIG. 15, the structure of the surface treatment device will be described as follows. FIG. 14 shows plane view of the surface treatment device 300 from upside. FIG. 15 shows side view of the surface treatment device 300 from .alpha.-direction. [0005] As shown in FIG. 14 and FIG. 15, the surface treatment device 300 is the surface treatment device of so-called pusher type, and has guide rails 10-13 for transporting the transport hanger 15 which is holding the platy work such as a printed board. Along with these guide rails 10-13, the surface treatment device 300 has the pre-treatment tank 1 of each type for processing before plating, plating tank 2 for electroplating, recovery tank 3 and water-washing tank 4 for processing after plating, unload section 5 for unloading the platy work, exfoliate tank 6 for separating plating films (hanger restoring process), water-washing tank 7 for water-washing the transport hanger 15 after separating, and load section 8 for loading a board. [0006] As rise-and-fall guide rails 10, 12 shown in FIG. 14 falls, the platy work W is dipped into various tanks (e.g., plating tank 2, exfoliate tank 6, water-washing tank, and hot water-washing tank, cleaner tank, etc.). Also, when Rise-and-fall guide rails 10, 12 are fallen as shown in FIG. 15, guide rails 10-13 configure one circular guide rail. [0007] By falling of rise-and-fall guide rails 10, 12 shown in FIG. 14, the platy work W is guided into treatment liquids on a dipping position ((x) position of FIG. 14) of the plating tank 2. The platy work W dipped into treatment liquids is transferred inside the platy tank 2. [0008] The transport hanger 15 used for the surface treatment device 300 of the above-mentioned so-called pusher type, as shown FIG. 9, has treating-object holding member 47 with plural clamps 48 for holding the platy work W, slide member 35 which contact slidably with guide rails such as fixed guide rail 11, and connecting members 44 for connecting such members. The transport hanger 15 holds the upper end of the platy work W by clamp 48. [0009] For the purpose to achieve uniform plating quality or uniform plating film thickness, the surface treatment device 300 of pusher type like the above-mentioned treats the platy work W by spouting jet flow of treatment liquids to the platy work W from spouters arranged both sides of the platy work W inside the platy tank. However, because it doesn't use the rack, the plating film thickness of platy work W became non-uniform as the platy work W swings when transporting and the distance to electrode is not constant, or the plating film thickness of the edge of the platy work became thicker unusually because current concentration has occurred on the edge of the platy work. [0010] Therefore, it is big issue to be solved for the surface treatment device of rackless type to restrict swinging of the platy work and not to occur current concentration on the edge of the platy work W. [0011] Consequently, the above-mentioned Patent Document 1 discloses interval between adjacent platy works of back-and-forth is adjusted by fast-forwarding until it becomes predetermined distance (for example, 50 mm) inside the plating tank 2 to prevent from occurring current concentration on the back-and-forth end of the platy work W. Additionally, a linear guide made of Teflon (registered trademark) is attached inside of a surface treatment tank such as a plating tank for preventing the platy work W from swinging, or a shielding plate is attached for preventing from occurring current concentration on the edge of the platy work W (Refer to the Japanese Laid Open Patent Applications No. 2000-178784 (Patent Document 2) and No. 2002-13000 (Patent Document 3)). [0012] Moreover, when the printed board (thickness is below 0.1 mm) is used as the platy work (hereinafter referred to as thin plate board), it is suggested that leading guide etc. as shown in FIG. 16 is arranged inside a tank for the purpose of dipping the platy work W smoothly into each treatment tank (Refer to the Japanese Laid Open Patent Applications No. 2004-346391 (Patent Document 4). [0013] The leading guide of Patent Document 4 is comprised of a pair of commutate members 131 (slant down flow boards 131a, 131b) placed at falling position of the thin plate board. As shown in FIG. 16, the slant down flow boards 131a, 131b are formed its upper side like as V style. And spouting tubes 132 are arranged along upper end area of the slant down flow boards 131a, 131b. Further, a liquid suction tube 133 is arranged on lower part of the slant down flow boards 131a, 131b, which aspirates plating liquids and spouts it from the spouting tubes 132. Therefore, it becomes possible to guide the thin plate board promptly with the flow on the lower side spouting from the slant down flow boards 131a, 131b. [0014] However, the above-mentioned conventional art can't achieve uniform plating quality by jet flow of plating liquids or uniform plating film thickness by preventing from occurring current concentration on the upper and lower end of the platy work W, though it was possible to prevent current concentration on the back-and-forth end of platy works. [0015] For instance, although Patent Documents 2 and 3 discloses that a louver is used for achieving uniform plating quality by commutating the jet flow of plating liquids, the plating efficiency or plating quality may get worse as it may occur excessive current shielding effect in some cases. Also, although shielding plate is arranged on the lower end of the platy work W, enough effect was not attained because currency detouring occurs in some cases. Thus, it is likely to vary plating thickness as occurring current concentration on the upper and lower end of the platy work W. [0016] Further, although a linear guide made of Teflon is used for preventing the platy work W from swinging, linear shaped Teflon was easily to break away by touching with platy work W. Therefore, sometimes it is not prevented platy work W from swinging. Further, although it is possible to add metal wire as a core member to the linear guide made of Teflon, when plastic Teflon is broken away and metal wire became exposed, it was caused abrasion on the platy work W by touching with exposed metal wire, and plating quality became worse because the plating adhered to the metal wire is mixed in treatment liquids. Especially, when the thin plate board (thickness is below 0.1 mm) is used, it is subject to swing and twist easily because of plating jet flow. And it is subject to cause abrasion as transporting slidably with platy work W. SUMMARY OF THE INVENTION [0017] As to solve the above problems, an object of the present invention is to provide a plating tank used for a surface treatment device such as a electroplating device (especially, for the electroplating device which transports a platy work such as printed board in holding vertically) which can transport platy work such as thin printed board (thickness is below 0.1 mm) securely without causing abrasion, and attain uniform plating quality and uniform plating film thickness. [0018] A plural of Independent aspects of the present invention will be indicated as follows. [0019] (1) In accordance with characteristics of the present invention, there is provided a plating tank comprising: [0020] a treatment tank main body for holding treatment liquids which is arranged as extending in transporting direction of the platy work; Continue reading... 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