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Plating solution of palladium alloy and method for plating using the same

Abstract: The present invention relates to a plating solution of palladium alloy and has an object to provide a plating solution of palladium alloy highly stable and capable of stably forming a plated film of a given alloy composition. The present invention relates to a plating solution of palladium alloy containing a palladium complex and a metal salt, wherein the palladium complex is coordinated with at least one neutral amino acid selected from the group consisting of glycine, alanine, valine, leucine, serine, threonine, asparagine, glutamine and tyrosine as a ligand. ...

USPTO Applicaton #: #20080073218 - Class: 205 50 (USPTO)

Related Terms: Asparagine Glutamine Leucine Threonine Valine
The Patent Description & Claims data below is from USPTO Patent Application 20080073218, Plating solution of palladium alloy and method for plating using the same.

Asparagine Glutamine Leucine Threonine Valine

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Method and apparatus for manufacturing negative electrode for non-aqueous electrolyte secondary battery
Next Patent Application:
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same
Industry Class:
Electrolysis: processes, compositions used therein, and methods of preparing the compositions

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