Browse: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 1 | 3 |
Patterson & Sheridan, LLP patentsThe following is a sampling of recent Patterson & Sheridan, LLP patent applications (USPTO Patent Application #, Patent Title) sorted by month.
April 2008 - Patterson & Sheridan, LLP patents
20080092947 - Pulse plating of a low stress film on a solar cell substrate
20080093022 - Method for sequencing substrates
20080098115 - Method and apparatus for dynamic content generation
20080087074 - Method and apparatus for v-bank filter bed scanning
20080087214 - Load lock chamber with decoupled slit valve door seal compartment
20080087808 - Method and system for controlling beam scanning in an ion implantation device
20080090309 - Controlled annealing method
20080090393 - Ultra shallow junction with rapid thermal anneal
20080083623 - Method and apparatus for treatment of plating solutions
20080083673 - Method and apparatus for treatment of plating solutions
20080084650 - Apparatus and method for substrate clamping in a plasma chamber
20080085084 - Air cavity plastic package for high frequency optical devices
20080085611 - Deposition and densification process for titanium nitride barrier layers
20080079530 - Integrated magnetic features
March 2008 - Patterson & Sheridan, LLP patents
20080072820 - Modular cvd epi 300mm reactor
20080072822 - System and method including a particle trap/filter for recirculating a dilution gas
20080072823 - Self aligning non contact shadow ring process kit
20080072929 - Dilution gas recirculation
20080075834 - Dosimetry using optical emission spectroscopy/residual gas analyzer in conjuntion with ion current
20080076268 - Fluorine plasma treatment of high-k gate stack for defect passivation
20080067058 - Monolithic target for flat panel application
20080067416 - Uv assisted thermal processing
20080070130 - Phase shifting photomask and a method of fabricating thereof
20080070385 - Water-barrier performance of an encapsulating film
20080070421 - Bi-layer capping of low-k dielectric films
20080061439 - Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond
20080061807 - Configurable prober for tft lcd array test
20080063798 - Precursors and hardware for cvd and ald
20080064225 - Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond
20080065578 - Method and apparatus for safe ontology reasoning
20080057220 - Silicon photovoltaic cell junction formed from thin film doping source
20080057729 - Etch methods to form anisotropic features for high aspect ratio applications
20080057737 - System and method for forming a gate dielectric
February 2008 - Patterson & Sheridan, LLP patents
20080047841 - Electroprocessing profile control
20080047901 - Method and system for point of use treatment of substrate polishing fluids
20080050286 - Smart addition system
20080050661 - Photomask fabrication utilizing a carbon hard mask
20080050932 - Overall defect reduction for pecvd films
20080051009 - Endpoint for electroprocessing
20080051929 - Scheduling method for processing equipment
20080051930 - Scheduling method for processing equipment
20080041307 - Control of gas flow and delivery to suppress the formation of particles in an mocvd/ald system
20080041311 - Chemical delivery apparatus for cvd or ald
20080041313 - Gas delivery apparatus for atomic layer deposition
20080042077 - Process and apparatus for post deposition treatment of low dielectric materials
20080042597 - Method and apparatus for controlling an input voltage to a light emitting diode
20080043246 - Multi-axis interferometer system using independent, single axis interferometers
20080044557 - Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond
20080044569 - Methods for atomic layer deposition of hafnium-containing high-k dielectric materials
20080044573 - Rate control process for a precursor delivery system
20080044594 - Stress reduction of sioc low k film by addition of alkylenes to omcts based processes
20080044595 - Method for semiconductor processing
20080045012 - Electroprocessing profile control
20080035202 - Method and apparatus for gas flow measurement
20080035306 - Heating and cooling of substrate support
20080035474 - Apparatus for electroprocessing a substrate with edge profile control
20080035882 - Composition for polishing a substrate
20080037932 - Optical switch having angle tuning elements and multiple-fiber collimators
20080038463 - Atomic layer deposition process
20080038900 - Methods for surface activation by plasma immersion ion implantation process utilized in silicon-on-insulator structure
20080029032 - Substrate support with protective layer for plasma resistance
20080029211 - Self-passivating plasma resistant material for joining chamber components
20080032041 - Atomic layer deposition of tantalum-containing materials using the tantalum precursor taimata
20080032510 - Cmos sion gate dielectric performance with double plasma nitridation containing noble gas
January 2008 - Patterson & Sheridan, LLP patents
20080023319 - Magnetron assembly
20080023732 - Use of carbon co-implantation with millisecond anneal to produce ultra-shallow junctions
20080024762 - Raman spectroscopy as integrated chemical metrology
20080024855 - Ultra-fast beam dithering with surface acoustic wave modulator
20080025354 - Ultra-fast beam dithering with surface acoustic wave modulator
20080025821 - Octagon transfer chamber
20080026553 - Method for fabricating an integrated gate dielectric layer for field effect transistors
20080026584 - Lpcvd gate hard mask
20080026681 - Conductive polishing article for electrochemical mechanical polishing
20080017116 - Substrate support with adjustable lift and rotation mount
20080017117 - Substrate support with adjustable lift and rotation mount
20080017501 - Cooled dark space shield for multi-cathode design
20080017521 - Process control in electro-chemical mechanical polishing
20080017628 - Multizone heater for furnace
20080019806 - Small footprint modular processing system
20080020146 - Diffuser plate with slit valve compensation
20080020319 - Graded arc for high na and immersion lithography
20080020550 - Process for making thin film field effect transistors using zinc oxide
20080020570 - Dual damascene fabrication with low k materials
20080020682 - Method for conditioning a polishing pad
20080011601 - Cooled anodes
20080014058 - Scheduling method for processing equipment
20080014709 - Method and apparatus for electroprocessing a substrate with edge profile control
20080014724 - Methods for depositing tungsten after surface treatment
20080014732 - Application of pvd w/wn bilayer barrier to aluminum bondpad in wire bonding
20080014759 - Method for fabricating a gate dielectric layer utilized in a gate structure
20080014761 - Decreasing the etch rate of silicon nitride by carbon addition
20080014845 - Conditioning disk having uniform structures
20080006523 - Cooled pvd shield
20080008823 - Deposition processes for tungsten-containing barrier layers
20080008842 - Method for plasma processing
20080000495 - Apparatus and method for single substrate processing
20080000768 - Electrically coupled target panels
20080000770 - Vacuum elastomer bonding apparatus and method
20080001113 - Valve door with ball coupling
20080003358 - Power loading substrates to reduce particle contamination
20080003702 - Low power rf tuning using optical and non-reflected power methods
20080003824 - Method for depositing an amorphous carbon film with improved density and step coverage
20080003931 - System and method for in-situ head rinse
December 2007 - Patterson & Sheridan, LLP patents
20070295272 - Methods to improve the in-film defectivity of pecvd amorphous carbon films
20070295274 - Batch processing platform for ald and cvd
20070295596 - Pvd target
20070295598 - Backing plate assembly
20070295602 - Ground shield with reentrant feature
20070295610 - Electrolyte retaining on a rotating platen by directional air flow
20070295611 - Method and composition for polishing a substrate
20070296426 - Prober for electronic device testing on large area substrates
20070296437 - Mini-prober for tft-lcd testing
20070298575 - Methods for contact resistance reduction of advanced cmos devices
20070298590 - Methods and apparatus for depositing a microcrystalline silicon film for photovoltaic device
20070298692 - Pad cleaning method
20070289124 - Fast substrate loading on polishing head without membrane inflation step
20070289359 - Method for determining plasma characteristics
20070289864 - Large area sputtering target
20070289869 - Large area sputtering target
20070289871 - Electrolytic capacitor for electric field modulation
20070290166 - Method and composition for polishing a substrate
20070292244 - Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same
20070294043 - Method for determining plasma characteristics
20070283886 - Apparatus for integration of barrier layer and seed layer
20070285515 - Method and apparatus for calibrating video signals
20070285516 - Method and apparatus for automatically directing the adjustment of home theater display settings
20070286954 - Methods for low temperature deposition of an amorphous carbon layer
20070286965 - Methods for the reduction and elimination of particulate contamination with cvd of amorphous carbon
20070287301 - Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics
20070288116 - Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
20070277599 - Atomic force microscope technique for minimal tip damage
20070280816 - Multiple slot load lock chamber and method of operation
20070281083 - Elimination of first wafer effect for pecvd films
20070281090 - System architecture and method for solar panel formation
20070281497 - Method to mitigate impact of uv and e-beam exposure on semiconductor device film properties by use of a bilayer film
20070281589 - Rotational alignment mechanism for load cups
November 2007 - Patterson & Sheridan, LLP patents
20070271751 - Method of forming a reliable electrochemical capacitor
20070272657 - Apparatus and method for single substrate processing
20070275569 - Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices
20070267144 - Heating and cooling plate for a vacuum chamber
20070261951 - Reactive sputtering zinc oxide transparent conductive oxides onto large area substrates
20070262488 - Friction weld of two dissimilar materials
20070256627 - Method of ultra-shallow junction formation using si film alloyed with carbon
20070256785 - Apparatus for etching high aspect ratio features
20070256786 - Apparatus for etching high aspect ratio features
20070259111 - Method and apparatus for photo-excitation of chemicals for atomic layer deposition of dielectric film
20070259110 - Plasma, uv and ion/neutral assisted ald or cvd in a batch tool
20070251832 - Method and apparatus for electrochemical mechanical polishing of cu with higher liner velocity for better surface finish and higher removal rate during clearance
20070252299 - Synchronization of precursor pulsing and wafer rotation
20070252500 - Substrate processing chamber with dielectric barrier discharge lamp assembly
20070254112 - Apparatus and method for high utilization of process chambers of a cluster system through staggered plasma cleaning
20070254481 - Method for forming tungsten materials during vapor deposition processes
20070254485 - Abrasive composition for electrochemical mechanical polishing
October 2007 - Patterson & Sheridan, LLP patents
20070249071 - Neural network methods and apparatuses for monitoring substrate processing
20070243452 - Reliable fuel cell electrode design
20070243709 - Planarization of substrates at a high polishing rate using electrochemical mechanical polishing
20070243721 - Absorber layer for dsa processing
20070235059 - Method of recovering valuable material from exhaust gas stream of a reaction chamber
20070235085 - Chemical delivery apparatus for cvd or ald
20070235320 - Reactive sputtering chamber with gas distribution tubes
20070235344 - Process for high copper removal rate with good planarization and surface finish
20070235345 - Polishing method that suppresses hillock formation
20070235665 - Charged particle beam system and method for manufacturing and inspecting lcd devices
20070238202 - Adaptive control method for rapid thermal processing of a substrate
20070238254 - Method of etching low dielectric constant films
20070227876 - Rf powered target for increasing deposition uniformity in sputtering systems
20070227901 - Temperature control for ecmp process
20070227902 - Removal profile tuning by adjusting conditioning sweep profile on a conductive pad
20070231108 - Method and apparatus for transferring wafers
20070231750 - Method of forming damascene structure
20070232071 - Method to improve the step coverage and pattern loading for dielectric films
20070232072 - Formation of protection layer on wafer to prevent stain formation
20070232082 - Method to improve the step coverage and pattern loading for dielectric films
September 2007 - Patterson & Sheridan, LLP patents
20070221128 - Method and apparatus for improving uniformity of large-area substrates
20070221495 - Electropolish assisted electrochemical mechanical polishing apparatus
20070221640 - Apparatus for thermal processing structures formed on a substrate
20070223861 - Multiport switch for optical performance monitor
20070224803 - Methods for etching a dielectric barrier layer with high selectivity
20070224807 - Methods for etching a dielectric barrier layer with high selectivity
20070224825 - Methods for etching a bottom anti-reflective coating layer in dual damascene application
20070224827 - Methods for etching a bottom anti-reflective coating layer in dual damascene application
20070224830 - Low temperature etchant for treatment of silicon-containing surfaces
20070215488 - Methods and apparatus for electroprocessing with recessed bias contact
20070216428 - Method to reduce cross talk in a multi column e-beam test system
20070217735 - Optical switch having angle tuning elements and multiple-fiber collimators
20070218587 - Soft conductive polymer processing pad and method for fabricating the same
20070218623 - Method of fabricating a high dielectric constant transistor gate using a low energy plasma apparatus
20070218644 - Method of thermal processing structures formed on a substrate
20070218688 - Method for depositing tungsten-containing layers by vapor deposition techniques
20070219103 - Novel rinse solution to remove cross-contamination
20070209684 - Copper deposition chamber having integrated bevel clean with edge bevel removal detection
20070209930 - Apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
20070209931 - Notched deposition ring
20070209946 - Method and apparatus for evaluating polishing pad conditioning
20070212859 - Method of thermal processing structures formed on a substrate
20070212895 - Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
20070212896 - Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
20070212976 - Smart polishing media assembly for planarizing substrates
20070204702 - Method and apparatus for pressure and mix ratio control
20070205101 - Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers
20070206456 - Trajectory mapping for improved motion-system jitter while minimizing tracking error
20070207275 - Enhancement of remote plasma source clean for dielectric films
20070207596 - Selective epitaxy process with alternating gas supply
20070207624 - Multiple nitrogen plasma treatments for thin sion dielectrics
20070207628 - Method for forming silicon oxynitride materials
20070207704 - Smart conditioner rinse station
August 2007 - Patterson & Sheridan, LLP patents
20070199922 - Etch methods to form anisotropic features for high aspect ratio applications
20070202254 - Process for forming cobalt-containing materials
20070202700 - Etch methods to form anisotropic features for high aspect ratio applications
20070196011 - Integrated vacuum metrology for cluster tool
20070197027 - Formation of boride barrier layers using chemisorption techniques
20070197028 - Formation of boride barrier layers using chemisorption techniques
20070198383 - Method and apparatus for data center analysis and planning
20070187258 - Method for electrochemically polishing a conductive material on a substrate
20070190362 - Patterned electroless metallization processes for large area electronics
20070190780 - Atomic layer deposition of barrier materials
20070181149 - Single wafer backside wet clean
20070181441 - Method and apparatus for electropolishing
20070181442 - Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process
20070184354 - Process for etching photomasks
20070175752 - Anolyte for copper plating
20070175858 - Methods for post-etch deposition of a dielectric film
July 2007 - Patterson & Sheridan, LLP patents
20070169696 - Two-step post nitridation annealing for lower eot plasma nitrided gate dielectrics
20070166133 - Decoupled chamber body
20070157886 - Substrate support assembly with thermal isolating plate
20070158201 - Electrochemical processing with dynamic process control
20070158207 - Methods for electrochemical processing with pre-biased cells
20070158654 - Apparatus for fabricating large-surface area polycrystalline silicon sheets for solar cell application
20070159623 - Apparatus and method for automatic optical inspection reference to co-pending applications
20070161250 - Method for electrochemically mechanically polishing a conductive material on a substrate
20070161255 - Method for etching with hardmask
20070151514 - Apparatus and method for hybrid chemical processing
20070151861 - Reliability barrier integration for cu application
20070151866 - Substrate polishing with surface pretreatment
20070151867 - Apparatus and a method for electrochemical mechanical processing with fluid flow assist elements
20070153453 - Fully conductive pad for electrochemical mechanical processing
20070153520 - Method and apparatus for providing an led light for use in hazardous locations
June 2007 - Patterson & Sheridan, LLP patents
20070144439 - Cartesian cluster tool configuration for lithography type processes
20070144915 - Process and composition for passivating a substrate during electrochemical mechanical polishing
20070145269 - Electron anti-fogging baffle used as a detector
20070145998 - Method and apparatus for characterizing features formed on a substrate
20070147976 - Substrate processing sequence in a cartesian robot cluster tool
20070147979 - Substrate gripper for a substrate handling robot
20070147982 - Method of retaining a substrate during a substrate transferring process
20070148336 - Photovoltaic contact and wiring formation
20070140814 - Large area substrate transferring method
20070141855 - Methods of modifying interlayer adhesion
20070141954 - Paired pivot arm
20070131562 - Method and apparatus for planarizing a substrate with low fluid consumption
20070134435 - Method to improve the ashing/wet etch damage resistance and integration stability of low dielectric constant films
20070134821 - Cluster tool for advanced front-end processing
20070125657 - Method of direct plating of copper on a substrate structure
20070128538 - Method of depositing an amorphous carbon layer
20070128553 - Method for forming feature definitions
20070128863 - Apparatus and process for plasma-enhanced atomic layer deposition
20070128864 - Apparatus and process for plasma-enhanced atomic layer deposition
20070128869 - Method and apparatus for annealing copper films
20070128982 - Bubble suppressing flow controller with ultrasonic flow meter
20070128992 - Method for conditioning processing pads
May 2007 - Patterson & Sheridan, LLP patents
20070119371 - Apparatus and process for plasma-enhanced atomic layer deposition
20070119373 - Chemical vapor deposition chamber with dual frequency bias and method for manufacturing a photomask using the same
20070119544 - Apparatus and method for single substrate processing using megasonic-assisted drying
20070123051 - Oxide etch with nh4-nf3 chemistry
20070113868 - Apparatus and a method for cleaning a dielectric film
20070117500 - Materials for chemical mechanical polishing
20070107660 - Heated gas box for pecvd applications
20070108404 - Method of selectively depositing a thin film material at a semiconductor interface
20070111519 - Integrated electroless deposition system
20070111638 - Pad assembly for electrochemical mechanical polishing
20070101733 - Radiation shield for cryogenic pump for high temperature physical vapor deposition
20070102283 - Pvd method to condition a substrate surface
20070102303 - Method and composition for electrochemically polishing a conductive material on a substrate
20070105381 - Process for etching a metal layer suitable for use in photomask fabrication
20070095285 - Apparatus for cyclical depositing of thin films
20070095367 - Apparatus and method for atomic layer cleaning and polishing
20070095677 - Electrochemical method for ecmp polishing pad conditioning
20070096315 - Ball contact cover for copper loss reduction and spike reduction
20070097383 - Method and apparatus for integrating metrology with etch processing
20070099417 - Adhesion and minimizing oxidation on electroless co alloy films for integration with low k inter-metal dielectric and etch stop
20070099422 - Process for electroless copper deposition
20070099552 - Conductive pad with ion exchange membrane for electrochemical mechanical polishing
20070099806 - Composition and method for selectively removing native oxide from silicon-containing surfaces
April 2007 - Patterson & Sheridan, LLP patents
20070089817 - Method for providing gas to a processing chamber
20070089990 - Adjustable dosing algorithm for control of a copper electroplating bath
20070090516 - Heated substrate support and method of fabricating same
20070091535 - Temperature controlled semiconductor processing chamber liner
20070093013 - Method for fabricating a gate dielectric of a field effect transistor
20070084406 - Reaction chamber with opposing pockets for gas injection and exhaust
20070084406 - Reaction chamber with opposing pockets for gas injection and exhaust
20070084408 - Batch processing chamber with diffuser plate and injector assembly
20070084408 - Batch processing chamber with diffuser plate and injector assembly
20070084720 - Magnetron sputtering system for large-area substrates having removable anodes
20070084729 - Contact assembly cleaning in an electrochemical mechanical processing apparatus
20070085027 - Real-time compensation of mechanical position error in pattern generation or imaging applications
20070085029 - Dc only tool cell with a charged particle beam system
20070085030 - Critical dimension effects correction in raster pattern generator
20070085031 - Placement effects correction in raster pattern generator
20070085905 - Method and apparatus for substrate imaging
20070086881 - Dual substrate loadlock process equipment
20070087583 - Method of forming a silicon oxynitride layer
20070079759 - Ampoule splash guard apparatus
20070079932 - Directed purge for contact free drying of wafers
20070080067 - Pre-treatment to eliminate the defects formed during electrochemical plating
20070080141 - Low-voltage inductively coupled source for plasma processing
20070082451 - Methods to fabricate mosfet devices using a selective deposition process
20070082507 - Method and apparatus for the low temperature deposition of doped silicon nitride films
20070082833 - Low cost and low dishing slurry for polysilicon cmp
20070083753 - System and method using information based indicia for securing and authenticating transactions
20070074663 - Batch wafer handling system
20070075256 - Electrostatic deflection system with impedance matching for high positioning accuracy
20070075262 - Electrostatic deflection system with low aberrations and vertical beam incidence
20070076216 - Multi-axis interferometer system using independent, single axis interferometers
20070077354 - Thermal conditioning plate with gas gap leak
20070077750 - Atomic layer deposition processes for ruthenium materials
March 2007 - Patterson & Sheridan, LLP patents
20070044714 - Method and apparatus for maintaining a cross sectional shape of a diffuser during processing
20070044719 - Processing chamber configured for uniform gas flow
20070046927 - Integrated metrology tools for monitoring and controlling large area substrate processing chambers
20070048451 - Substrate movement and process chamber scheduling
20070048992 - Integrated pvd system using designated pvd chambers
20070049020 - Method and apparatus for reducing tensile stress in a deposited layer
20070049043 - Nitrogen profile engineering in hi-k nitridation for device performance enhancement and reliability improvement
20070049053 - Pretreatment processes within a batch ald reactor
February 2007 - Patterson & Sheridan, LLP patents
20070039942 - Active cooling substrate support
20070040041 - Substrate temperature regulating support pins
20070042130 - Method of treating films using uv-generated active species
20070042610 - Method of depositing low k barrier layers
20070034506 - Pad assembly for electrochemical mechanical processing
20070034623 - Method of hot wire welding of plastics
20070036548 - System with a distributed optical performance monitor for use in optical networks
20070028842 - Vacuum chamber bottom
20070029642 - Heating and cooling of substrate support
20070031609 - Chemical vapor deposition chamber with dual frequency bias and method for manufacturing a photomask using the same
20070022832 - Sensor device for non-intrusive diagnosis of a semiconductor processing system
20070022952 - Unique passivation technique for a cvd blocker plate to prevent particle formation
20070023144 - Gas line weldment design and process for cvd aluminum
20070023390 - Cluster tool and method for process integration in manufacturing of a photomask
20070026321 - Cluster tool and method for process integration in manufacturing of a photomask
20070026529 - System and methods for measuring chemical concentrations of a plating solution
20070026602 - Method of minimal wafer support on bevel edge of wafer
January 2007 - Patterson & Sheridan, LLP patents
20070017445 - Hybrid pvd-cvd system
20070020890 - Method and apparatus for semiconductor processing
20070020903 - Hybrid pvd-cvd system
20070020924 - Tungsten nitride atomic layer deposition processes
20070012557 - Low voltage sputtering for large area substrates
20070012558 - Magnetron sputtering system for large-area substrates
20070012559 - Method of improving magnetron sputtering of large-area substrates using a removable anode
20070012660 - Cluster tool with integrated metrology chamber for transparent substrates
20070012663 - Magnetron sputtering system for large-area substrates having removable anodes
20070013363 - Test structure design for reliability test
20070014933 - Blue printing ink for color filter applications
20070015360 - Contact clean by remote plasma and repair of silicide surface
20070015847 - Red printing ink for color filter applications
20070015848 - Green printing ink for color filter applications
20070006936 - Load lock chamber with substrate temperature regulation
20070007660 - Mask etch processing apparatus
20070009658 - Pulse nucleation enhanced nucleation technique for improved step coverage and better gap fill for wcvd process
20070010103 - Nitric oxide reoxidation for improved gate leakage reduction of sion gate dielectrics
20070000608 - Chamber isolation valve rf grounding
20070003698 - Enhanced copper growth with ultrathin barrier layer for high performance interconnects
20070004201 - Process for electroless copper deposition
20070005489 - Method for selling pre-owned integrated circuit manufacturing equipment online
December 2006 - Patterson & Sheridan, LLP patents
20060289291 - Method for adjusting electromagnetic field across a front side of a sputtering target disposed inside a chamber
20060289795 - Vacuum reaction chamber with x-lamp heater
20060292291 - System and methods for inkjet printing for flat panel displays
20060292310 - Process kit design to reduce particle generation
20060292808 - Absorber layer for dsa processing
20060292844 - Manufacturing method for two-step post nitridation annealing of plasma nitrided gate dielectric
20060292874 - method for forming tungsten materials during vapor deposition processes
20060283688 - Substrate handling system
20060283702 - Random pulsed dc power supply
20060283705 - Electron beam welding of sputtering target tiles
20060283716 - Method of direct plating of copper on a ruthenium alloy
20060286300 - Cluster tool architecture for processing a substrate
20060286763 - Gate electrode dopant activation method for semiconductor manufacturing
20060286774 - Method for forming silicon-containing materials during a photoexcitation deposition process
20060286775 - Method for forming silicon-containing materials during a photoexcitation deposition process
20060286776 - Method for forming silicon-containing materials during a photoexcitation deposition process
20060278165 - Cluster tool architecture for processing a substrate
20060278497 - Linear vacuum deposition system
20060280588 - Substrate conveyor system
20060281310 - Rotating substrate support and methods of use
20060272772 - Vacuum reaction chamber with x-lamp heater
20060273815 - Substrate support with integrated prober drive
20060275933 - Thermally conductive ceramic tipped contact thermocouple
20060276020 - Deposition methods for barrier and tungsten materials
20060276054 - In situ oxide cap layer development
20060276111 - Conditioning element for electrochemical mechanical processing
November 2006 - Patterson & Sheridan, LLP patents
20060266288 - High plasma utilization for remote plasma clean
20060266643 - Elastomer bonding of large area sputtering target
20060266653 - In-situ profile measurement in an electroplating process
20060269120 - Design-based method for grouping systematic defects in lithography pattern writing system
20060269658 - Method to deposit organic grafted film on barrier layer
20060270221 - Heated gas feedthrough for cvd chambers
20060270322 - Smart conditioner rinse station
20060264031 - Method for depositing tungsten-containing layers by vapor deposition techniques
20060264043 - Electroless deposition process on a silicon contact
20060264067 - Surface pre-treatment for enhancement of nucleation of high dielectric constant materials
20060254715 - Method and apparatus for vertical transfer of semiconductor substrates in a cleaning module
20060254904 - Ground shield for a pvd chamber
20060255825 - Method and apparatus for characterizing features formed on a substrate
20060257295 - Apparatus and method for generating a chemical precursor
20060249078 - High efficiency uv curing system
20060249175 - High efficiency uv curing system
20060249394 - Process and composition for electrochemical mechanical polishing
20060249395 - Process and composition for electrochemical mechanical polishing
20060251800 - Contact metallization scheme using a barrier layer over a silicide layer
20060251801 - In-situ silicidation metallization process
20060251827 - Tandem uv chamber for curing dielectric materials
20060252252 - Electroless deposition processes and compositions for forming interconnects
20060252273 - Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profile
20060243060 - Method and apparatus for pressure control and flow measurement
20060243598 - Auxiliary electrode encased in cation exchange membrane tube for electroplating cell
20060244467 - In-line electron beam test system
20060245690 - Tunable single-channel dispersion compensator for high-speed optical systems
20060246217 - Electroless deposition process on a silicide contact
20060246690 - Electro-chemical deposition system
20060246699 - Process for electroless copper deposition on a ruthenium seed
20060246831 - Materials for chemical mechanical polishing
October 2006 - Patterson & Sheridan, LLP patents
20060236793 - Sensor device for non-intrusive diagnosis of a semiconductor processing system
20060236934 - Plasma uniformity control by gas diffuser hole design
20060236941 - Passive wafer support for particle free wafer acceleration
20060237307 - Electrochemical processing cell
20060237308 - Contact ring with embedded flexible contacts
20060237325 - Cu ecp planarization by insertion of polymer treatment step between gap fill and bulk fill steps
20060237330 - Algorithm for real-time process control of electro-polishing
20060240187 - Deposition of an intermediate catalytic layer on a barrier layer for copper metallization
20060240542 - Substrate support lift mechanism
20060240652 - Very low dielectric constant plasma-enhanced cvd films
20060241813 - Optimized cluster tool transfer process and collision avoidance design
20060231029 - Rf current return path for a large area substrate plasma reactor
20060231205 - Method and apparatus for cleaning a cvd chamber
20060231414 - Contacts for electrochemical processing
20060231524 - Techniques for the use of amorphous carbon (apf) for various etch and litho integration schemes
20060231925 - Poly-silicon-germanium gate stack and method for forming the same
20060234449 - Flash gate stack notch to improve coupling ratio
20060234470 - Process sequence for doped silicon fill of deep trenches
20060234488 - Methods of selective deposition of heavily doped epitaxial sige
20060225767 - Method and apparatus for cleaning a cvd chamber
20060228075 - Fiber optic pigtail design for reducing insertion loss and insertion loss ripple
20060228490 - Gas distribution uniformity improvement by baffle plate with multi-size holes for large size pecvd systems
20060228496 - Plasma uniformity control by gas diffuser curvature
20060228992 - Process control in electrochemically assisted planarization
20060229007 - Conductive pad
20060219663 - Metal cmp process on one or more polishing stations using slurries with oxidizers
20060222771 - Methods for the reduction and elimination of particulate contamination with cvd of amorphous carbon
20060223322 - Method of forming a trench structure
20060223323 - Method of forming an interconnect structure
20060223333 - Single wafer thermal cvd processes for hemispherical grained silicon and nano-crystalline grain-sized polysilicon
20060223339 - Ald metal oxide deposition process using direct oxidation
September 2006 - Patterson & Sheridan, LLP patents
20060207508 - Film deposition using a spring loaded contact finger type shadow frame
20060208215 - Method for hafnium nitride deposition
20060209297 - System and method for assembling optical components
20060201813 - Apparatus and method for plating solution analysis
20060201814 - Apparatus and method for improving uniformity in electroplating
20060205206 - Method of eliminating photoresist poisoning in damascene applications
20060205223 - Line edge roughness reduction compatible with trimming
20060196778 - Tungsten electroprocessing
20060198574 - Optical switch
20060198581 - Electro-optical device
20060199372 - Reduction of copper dewetting by transition metal deposition
August 2006 - Patterson & Sheridan, LLP patents
20060193102 - Method and apparatus to confine plasma and to enhance flow conductance
20060185795 - Anodized substrate support
20060189162 - Adhesion improvement for low k dielectrics
20060190099 - Closed loop control on liquid delivery system ecp slim cell
20060180465 - Sliding flexible electrical contact for electrochemical processing
20060182535 - Cartesian robot design
20060182536 - Cartesian robot cluster tool architecture
20060182615 - Method for transferring substrates in a load lock chamber
20060183408 - Method for sequencing substrates
20060174912 - Wafer cleaning solution for cobalt electroless application
20060175201 - Immersion process for electroplating applications
20060175298 - Method and composition for polishing a substrate
20060178018 - Silicon oxynitride gate dielectric formation using multiple annealing steps
20060178095 - Polishing media stabilizer
20060169210 - Chamber for uniform heating of large area substrates
20060169597 - Method and composition for polishing a substrate
20060169668 - Low temperature etchant for treatment of silicon-containing surfaces
20060169669 - Etchant treatment processes for substrate surfaces and chamber surfaces
20060169674 - Method and composition for polishing a substrate
20060169910 - Multi-axis compound lens, beam system making use of the compound lens, and method using the compound lens
20060170910 - Automatic optical inspection using multiple objectives
20060172542 - Method and apparatus to confine plasma and to enhance flow conductance
20060172664 - Methods for reducing delamination during chemical mechanical polishing
20060172671 - Conductive polishing article for electrochemical mechanical polishing
July 2006 - Patterson & Sheridan, LLP patents
20060162658 - Ruthenium layer deposition apparatus and method
20060163074 - Algorithm for real-time process control of electro-polishing
20060163203 - Methods and apparatus for etching metal layers on substrates
20060163488 - Multi-axis lens, beam system making use of the compound lens, and method of manufacturing the compound lens
20060165349 - Monolithic optical component
20060165892 - Ruthenium containing layer deposition method
20060166414 - Selective deposition
20060166487 - Method and apparatus for chemical mechanical polishing of semiconductor substrates
20060156975 - Integrated apparatus of substrate treatment for manufacturing of color filters by inkjet printing systems
20060156979 - Substrate processing apparatus using a batch processing chamber
20060158208 - Prober tester
20060159843 - Method of substrate treatment for manufacturing of color filters by inkjet printing systems
20060160376 - Interface engineering to improve adhesion between low k stacks
20060151306 - Build-in loto device on equipment breaker panel
20060151336 - Pad for electrochemical processing
20060151735 - Curved slit valve door with flexible coupling
20060153973 - Ruthenium layer formation for copper film deposition
20060153995 - Method for fabricating a dielectric stack
20060154151 - Method for quartz photomask plasma etching
20060154388 - Integrated metrology chamber for transparent substrates
20060154493 - Method for producing gate stack sidewall spacers
20060154569 - Platen assembly utilizing magnetic slip ring
20060144334 - Method and apparatus for deposition of low dielectric constant materials
20060144825 - Dual reduced agents for barrier removal in chemical mechanical polishing
20060148253 - Integration of ald tantalum nitride for copper metallization
20060148381 - Pad assembly for electrochemical mechanical processing
###
This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Patterson & Sheridan, LLP in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Patterson & Sheridan, LLP with additional patents listed. Browse our Agent directory for other possible listings.
###
FreshPatents.com Support
|
REGISTER now for FREE 
