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  Pad design for electrochemical mechanical polishingUSPTO Application #: 20060070872Title: Pad design for electrochemical mechanical polishing Abstract: A method and apparatus for processing a substrate by electrochemical mechanical planarization and electrochemical mechanical plating is disclosed. Included are various embodiments of a processing pad article comprising an open cell foam subpad that is adapted to retain an electrolyte while encountering centrifugal motion, and simultaneously provide electrical and/or abrasive contact to a feature side of a substrate. Also disclosed is a platen capable of holding an electrolyte during processing at a desired RPM, then releasing the electrolyte centrifugally at a higher RPM. The release is actuated by an operator or by centrifugal force. (end of abstract) Agent: Patterson & Sheridan, LLP - Houston, TX, US Inventors: Rashid A. Mavliev, Paul D. Butterfield, Raplh M. Wadensweiler USPTO Applicaton #: 20060070872 - Class: 20422400M (USPTO) The Patent Description & Claims data below is from USPTO Patent Application 20060070872. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims benefit of U.S. provisional patent application Ser. No. 60/615,198, filed Oct. 1, 2004, which is herein incorporated by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] Embodiments of the present invention generally relate to a processing apparatus for planarizing or polishing a substrate. More particularly, the invention relates to polishing pad design for planarizing or polishing a semiconductor wafer by electrochemical mechanical planarization. [0004] 2. Description of the Related Art [0005] In the fabrication of integrated circuits and other electronic devices on substrates, multiple layers of conductive, semiconductive, and dielectric materials are deposited on or removed from a feature side, i.e., a deposit receiving surface, of a substrate. As layers of materials are sequentially deposited and removed, the feature side of the substrate may become non-planar and require planarization. Planarization is a procedure where previously deposited material is removed from the feature side of a substrate to form a generally even, planar or level surface. The process is useful in removing undesired surface topography and surface defects, such as rough surfaces, agglomerated materials, crystal lattice damage and scratches. The planarization process is also useful in forming features on a substrate by removing excess deposited material used to fill the features and to provide an even or level surface for subsequent deposition and processing. [0006] Electrochemical Mechanical Planarization (ECMP) is one exemplary process which is used to remove materials from the feature side of a substrate. ECMP typically uses a pad having conductive properties adapted to combine physical abrasion with electrochemical activity that enhances the removal of materials. The pad is attached to an apparatus having a rotating platen assembly that is adapted to couple the pad to a power source. The apparatus also has a substrate carrier, such as a polishing head, that is mounted on a carrier assembly above the pad that holds a substrate. The polishing head places the substrate in contact with the pad and is adapted to provide downward pressure, controllably urging the substrate against the pad. The pad is moved relative to the substrate by an external driving force and the polishing head typically moves relative to the moving pad. A chemical composition, such as an electrolyte, is typically provided to the surface of the pad which enhances electrochemical activity between the pad and the substrate. The ECMP apparatus effects abrasive or polishing activity from frictional movement while the electrolyte combined with the conductive properties of the pad selectively removes material from the feature side of the substrate. [0007] Although ECMP has produced good results in recent years, there is an ongoing effort to develop pads with improved polishing qualities combined with optimal electrical properties that will not degrade over time and require less conditioning, thus providing extended periods of use with less downtime for replacement. Inherent in this challenge is the difficulty in producing a pad that will not react with process chemistry, which may cause degradation, or require excessive conditioning. [0008] Platen rotation is another parameter that affects the planarizing process. Electrolyte retention in the current conductive pad design becomes difficult when the platen is rotated at higher revolutions per minute (RPM). When the pad is rotated to the desired RPM, the electrolyte tends to be removed axially from the substrate due to centrifugal force, and a break in the conductive current is sustained. This may result in uneven processing or possibly a total cessation of material removal. [0009] Therefore, there exists a need in the art for a processing article or pad that is adapted for the removal of conductive materials and other materials on a feature side of a substrate designed to facilitate electrolyte retention during rotation. SUMMARY OF THE INVENTION [0010] The present invention generally provides an article of manufacture and an apparatus for planarizing a layer on a substrate using electrochemical dissolution processes, polishing processes, and/or combinations thereof. [0011] In one embodiment, a substrate processing article is described having a conductive layer having a first contact surface and a fastener adapted to couple to a power supply, and a second contact surface, wherein the first and second contact surfaces are adapted to polish the substrate. [0012] In another embodiment, an apparatus for polishing a substrate is described having a first contact surface adapted to couple to a power source and a second contact surface disposed below the first contact surface. The second contact surface is adapted to receive and retain an electrolyte and couple to an electrode in communication with the power source, wherein at least one electrochemical cell is created when the power source is activated and the substrate is in contact with the first and second contact surfaces. [0013] In another embodiment, an apparatus for performing an electrochemical process on a substrate is described. The apparatus includes a pad having a processing layer adapted to couple to an electrode. The processing layer includes a plurality of elevated portions and a plurality of interstitial areas. The plurality of interstitial areas comprise open cell foam supporting and surrounding the plurality of elevated portions and a portion of the plurality of elevated portions and the open cell foam is adapted to contact the substrate. [0014] A rotatable platen assembly is also described having a controlled valve assembly. In one embodiment, the valve assembly is RPM controlled. The valves are configured to open at a desired RPM whereby spent or used electrolyte is centrifugally forced out of the platen. In another embodiment, the valves are operator or mechanically actuated, at parameters defined by the user. BRIEF DESCRIPTION OF THE DRAWINGS [0015] So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments. [0016] FIG. 1 is a plan view of a processing apparatus. [0017] FIG. 2 is a sectional view of one embodiment of an ECMP station. [0018] FIG. 3 is a partial cross-sectional view of one embodiment of a process pad assembly. [0019] FIG. 4 is a partial cross-sectional view of another embodiment of a process pad assembly. [0020] FIG. 5 is a partial cross-sectional view of another embodiment of a process pad assembly. Continue reading... Full patent description for Pad design for electrochemical mechanical polishing Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Pad design for electrochemical mechanical polishing patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Pad design for electrochemical mechanical polishing or other areas of interest. ### Previous Patent Application: Cathodic protection system for underground storage tank Next Patent Application: Expandable anodes for chlor-alkali diaphragm cells Industry Class: Chemistry: electrical and wave energy ### FreshPatents.com Support Thank you for viewing the Pad design for electrochemical mechanical polishing patent info. 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