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Package structure of a microphoneRelated Patent Categories: Active Solid-state Devices (e.g., Transistors, Solid-state Diodes), Combined With Electrical Contact Or LeadPackage structure of a microphone description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070182002, Package structure of a microphone. Brief Patent Description - Full Patent Description - Patent Application Claims
RELATED APPLICATIONS [0001] The present application is based on, and claims priority from, Taiwan Application Serial Number b 95102675, filed Jan. 24, 2006, the disclosure of which is hereby incorporated by reference herein in its entirety. BACKGROUND [0002] 1. Field of Invention [0003] The present invention relates generally to the package structure of microphone, and more particularly to the package structure of microphone with avoiding the short circuit caused by the overflowing of the conductive paste. [0004] 2. Description of Related Art [0005] Modern electromagnetic communication is frequently facilitated by hand held and home based wireless communication devices. Nowadays, dense signal transmissions in mobile telephones cause serious interference in the amplifier circuit of the microphone. This phenomenon usually happens between popular mobile telephones and the microphones. [0006] Reference is made to FIG. 1, which illustrates a stereo assembly drawing of a related microphone package structure. The package structure comprises the body 100, the substrate 110, sound processing unit 120, bounding pad 130, conductive line 140 and the upper cap 160. [0007] The substrate 110 includes the circuit board and the sound processing unit 120 is set on the circuit board with the conductive line 140 and the bounding pad 130. The substrate connection 111 is also prepared to connect to the connection 161 on the upper cap 160, and the acoustic hole 162 is on the upper cap 160. [0008] Reference is made to FIG. 1 and FIG. 2, which illustrate profiles of the package structure of the microphone. The bounding pad 130 is on the same plate as the substrate connection 111, moreover, these bounding pads 130 are separated by a short distance. After smearing the conductive paste 150 on the substrate connection 111, the upper cap 160 can be attached to the body 100. The conductive paste 150 may make two bounding pads 130 conductive when the upper cap 160 presses the conductive paste 150. This unnecessary short circuit would disable the sound processing unit 120. (In order to illustrate the relative position between the conductive paste 150 and the upper cap 160, there are only two sides of the conductive paste 150 except for the front part, and so are the other profiles.) [0009] A good connection cannot be established between the body 100 and the upper cap 160. If this package structure were hit by a foreign force, the middle of the body 100 and upper cap 160 would slide so that the appearance and the reliability of the package structure would be diminished. [0010] The problems as mentioned about the known technology could disable the sound gathering and processing functions; therefore, the reliability and quality of the microphone would be diminished and the maintenance cost of the microphone would increase, but all these problems can be improved by the present invention. SUMMARY [0011] In order to not only solve the aforementioned and other problems, but also achieve the technical benefits which this invention advocates, the present invention provides a microphone package structure that prevents the short circuit caused by the conductive paste overflow. [0012] It is the objective of the present invention to provide a microphone package structure which forms at least one trench in the connection between the substrate and the upper cap, and a gap between this trench and the bounding pad is maintained. [0013] It is another objective of the present invention to provide a microphone package structure whose electromagnetic shelter is more effective. The effectiveness of the electromagnetic shelter around the sound processing unit can be improved by smearing conductive paste on the substrate trench inside the microphone. [0014] According to the aforementioned objectives of the present invention, a microphone package structure with a trench is provided. In one embodiment of the present invention, the substrate connection is attached with one trench formed in the lower part of the upper cap downward. This trench could be a circular trench, a rectangular trench or a trench of another shape. The trench shape depends on the shape of the substrate. These trenches could also be plural trenches. For example, if the lower surface of the upper cap is divided into discrete sections, a trench could be formed in each of these discrete sections resulting in a plurality of trenches. Through this method, the connective area between the substrate and the upper cap would be increased, the connection boosted, and the pressure from upper cap caused by the conductive paste smeared on the surface of the trenches would prevent short circuits between the bounding pads of the substrate. [0015] According to the objective of the present invention, a package structure which can increase the effectiveness of the electromagnetic shelter of the microphone is provided. In one embodiment of the present invention, it is necessary to smear a layer of conductive paste on the trench surface next to the substrate before the connection and between the substrate and upper cap, which forms the package structure of microphone. As a result, there would be a circular electromagnetic shelter effect in the sound processing unit which is set on the substrate after the connection between the substrate and upper cap. [0016] The microphone package structure of the present invention could not only eliminate the disabilities of the electronic units using earlier technology, which commonly has conductive paste overflowing, but also provide a package structure for the electronic unit with a more effective electromagnetic shelter. BRIEF DESCRIPTION OF THE DRAWINGS [0017] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings, [0018] FIG. 1 illustrates a stereo assembly drawing of a related microphone package structure (the connective area of the substrate is at the same height as the bounding pad); [0019] FIG. 2 illustrates a profile of the related microphone package structure (the connective area of the substrate is the same altitude as the bounding pad); [0020] FIG. 3 illustrates a stereo assembly drawing of the microphone package structure of the preferred embodiment of the present invention (the connective area of the substrate is an outward inclined plane); Continue reading about Package structure of a microphone... Full patent description for Package structure of a microphone Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Package structure of a microphone patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Package structure of a microphone or other areas of interest. ### Previous Patent Application: Semiconductor device, reticle used in fabricating method for the same and fabrication method thereof Next Patent Application: Semiconductor device Industry Class: Active solid-state devices (e.g., transistors, solid-state diodes) ### FreshPatents.com Support Thank you for viewing the Package structure of a microphone patent info. IP-related news and info Results in 0.11735 seconds Other interesting Feshpatents.com categories: Daimler Chrysler , DirecTV , Exxonmobil Chemical Company , Goodyear , Intel , Kyocera Wireless , 174 |
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