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Overmolded optical packageRelated Patent Categories: Semiconductor Device Manufacturing: Process, Making Device Or Circuit Responsive To Nonelectrical Signal, Responsive To Electromagnetic Radiation, Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged SemiconductorOvermolded optical package description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070166866, Overmolded optical package. Brief Patent Description - Full Patent Description - Patent Application Claims
RELATED APPLICATIONS [0001] This application is a divisional of U.S. application Ser. No. 10/667,605, filed Sep. 23, 2003, the disclosure of which is incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to an optical semiconductor package, and more particularly, to an optical package which is manufactured by the overmolding process. [0004] 2. Description of the Related Art [0005] Referring to FIG. 1, it depicts a typically optical package 10 in prior art. The optical package 10 comprises a carrier or a substrate 12 and a chip 20 mounded on the substrate 12. The substrate 12 has a sidewall 16 which surrounds the substrate 12. A transparent lid 32 is mounted on the sidewall 16 by an adhesive 34 so as to form a hermetic cavity 30 and transmit the light interacting with the chip 20. The chip 20 has optical elements 22, such as optical sensors or imaging sensors, and is disposed in the cavity 30. The chip 20 is electrically connected to a plurality of bonding pads 18 of the substrate 12 by a plurality of bonding wires 26. The bonding pads 18 on the upper surface of the substrate 12 are electrically connected to the solder pads 14 on the bottom surface thereof through traces or vias 19. Because of the requirements of the manufacturing process, the substrate 12 is typically made of caramel, i.e., the substrate 12 is a kind of ceramic substrate. Furthermore, the bonding pads 18 and the solder pads 14 are disposed on the upper surface and the bottom surface of the substrate 12, respectively, so the substrate 12 is a multilayer structure. [0006] However, the multilayer ceramic substrate 12 has long delivery lead times and is substantially expensive. The bonding wires 26 are connected to the bonding pads 18 and the chip 20 which are recessed in the cavity 30, so the cavity 30 or the space surrounded by the sidewall 16 has to be large enough that the wire bond tool (not shown) can gain access to the bonding pads 18 and the chip 20. Therefore, the cost of the substrate 12 is further increased. The ceramic substrate 12 is supplied typically as single units or small arrays and hence is assembled in single units or small arrays, rather than large matrix arrays, so the assembly cost of the package 10 is further increased. [0007] Accordingly, there exists a need for an optical package which can use a planar substrate and be mass-produced to reduce the manufacturing cost of the optical package. SUMMARY OF THE INVENTION [0008] It is an object of the present invention to provide an optical package with a planar substrate for mass-producing and reducing the manufacturing cost. [0009] In order to achieve the above object, the present invention provides an optical semiconductor package comprising a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires. [0010] Accordingly, the substrate of the optical semiconductor package does not have to be provided with a cavity for receiving the chip, so the substrate can be substantially planar and be an organic laminate or ceramic substrate such that the cost of the substrate is substantially reduced. Furthermore, according to the manufacturing processes of the present invention, the substrate in matrix array can be utilized for mass production and the cost of the optical semiconductor package can be further reduced. BRIEF DESCRIPTION OF THE DRAWINGS [0011] Other objects, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawing. [0012] FIG. 1 is a schematic cross-sectional view of an optical package in the prior art. [0013] FIG. 2 is a schematic cross-sectional view of an optical package according to an embodiment of the present invention. [0014] FIG. 3 is a schematic cross-sectional view of an optical package according to another embodiment of the present invention. [0015] FIG. 4 is a schematic cross-sectional view of an optical package according to a further embodiment of the present invention. [0016] FIG. 5 is a schematic cross-sectional view of an optical package according to a still further embodiment of the present invention. [0017] FIG. 6 is a schematic cross-sectional view of an optical package according to yet another embodiment of the present invention. DESCRIPTION OF THE PREFERRED EMBODIMENT [0018] Referring to FIG. 2, it depicts an optical package 100 according to an embodiment of the present invention. The optical semiconductor package 100 comprises a carrier or substrate 112 which is substantially planar and a chip 120 mounted on the substrate 112. The substrate 112 can be either an organic laminate or a ceramic substrate. The chip 120 has optical elements 122, such as optical sensors or imaging sensors, and is electrically connected to a plurality of bonding pads 118 of the substrate 112 by a plurality of bonding wires 126. The substrate 112 is further provided with solder balls 114 electrically connected to the bonding pads 118 for being electrically connected to an external printing circuit board (not shown). [0019] A supporter 140 is disposed on the substrate 112 and is provided with a shoulder 144 for supporting and holding a window 142. Then, an encapsulant 130 is formed by overmolding or insert molding process and the window 142 is kept in place. The window 142 is typically positioned above the optical elements 122 of the chip 120 for receiving or transmitting the light interacting with the optical elements 122. The encapsulant 130 is transparent plastic, such as acrylate, nylon, polycarbonate, and the like. The supporter 140 can be made of thermal conductive material for serving as a heat sink. Alternatively, the supporter 140 can be made of any plastic, such as PPS, Polycarbonate, LCP and the like, for reducing the cost. Continue reading about Overmolded optical package... Full patent description for Overmolded optical package Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Overmolded optical package patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Overmolded optical package or other areas of interest. ### Previous Patent Application: Mirror package and method of manufacturing the mirror package Next Patent Application: Integrated circuit package system with image sensor system Industry Class: Semiconductor device manufacturing: process ### FreshPatents.com Support Thank you for viewing the Overmolded optical package patent info. 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