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Optoelectronic semiconductor component with high light-emitting efficiencyRelated Patent Categories: Radiant Energy, Photocells; Circuits And Apparatus, Signal IsolatorOptoelectronic semiconductor component with high light-emitting efficiency description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060289812, Optoelectronic semiconductor component with high light-emitting efficiency. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to an optoelectronic semiconductor component with high light-emitting efficiency, and more particularly, to an optoelectronic semiconductor component with a light-emitting diode chip and a semiconductor protective chip wherein the respective distances between the chips and a light exit opening are different so as to increase light-emitting efficiency. [0003] 2. Description of the Prior Art [0004] Recently, new application fields of high-illumination light emitting diodes (LEDs) have been developed. Different from a common incandescent light, a cold illumination LED has the advantages of low power consumption, long device lifetime, no idle time, and quick response speed. In addition, since LEDs also have the advantages of small size, vibration resistance, suitability for mass production, and easy fabrication as a tiny device or an array device, they have been widely applied in display apparatuses and indicating lamps of information, communication, and consumer electronics products. LEDs are not only utilized in outdoor traffic signal lamps or various outdoor displays, but also are very important components in the automotive industry. Furthermore, LEDs also work well in portable products, such as cell phones and backlights of personal data assistants. The LED has become a necessary component in the very popular liquid crystal display because it is the best choice for the light source of the backlight module. [0005] Please refer to FIG. 1, FIG. 2, FIG. 3, and FIG. 4. FIG. 1 is a schematic diagram of an optoelectronic semiconductor component 10 in the prior art. FIG. 2 is a front view of the optoelectronic semiconductor component 10 in the prior art. FIG. 3 is a diagram of the optoelectronic semiconductor component 10 fabricated on a circuit board 12 in the prior art. FIG. 4 is a diagram of internal components of the optoelectronic semiconductor component 10 in the prior art. The optoelectronic semiconductor component 10 can be a side-light light emitting diode. The optoelectronic semiconductor component 10 includes a housing 14 including a light exit opening 16, and two frames 18 installed outside the housing 14. Each frame 18 can be an L-shaped frame. Each external electrical contact P1 positioned on a frame 18 is located between the bottom of the frame 18 and the circuit board 12 for receiving external electricity from the circuit board 12. Each frame 18 can be connected to the circuit board 12 by a surface mounting technique. [0006] The optoelectronic semiconductor component 10 further includes a first chip carrier 20, and a second chip carrier 21 installed inside the housing 14. The first chip carrier 20 and the second chip carrier 21 are connected to the two frames 18 respectively. That is, the frames 18 can be extended structures from the first chip carrier 20 and the second chip carrier 21 through the holes on the housing 14. The optoelectronic semiconductor component 10 further includes a first semiconductor chip 22 installed on the first chip carrier 20 for emitting light. The first semiconductor chip 22 can be a light-emitting diode chip. The optoelectronic semiconductor component 10 further includes a second semiconductor chip 24 installed on the first chip carrier 20. The second semiconductor chip 24 can be a semiconductor protective chip for preventing the first semiconductor chip 22 from receiving excessive current, such as a zener diode chip for adjusting working voltage and regulating voltage supplied. The optoelectronic semiconductor component 10 further includes wires 26a, 26b, 26c for electrically connecting the first semiconductor chip 22, the second semiconductor chip 24, the first chip carrier 20, and the second chip carrier 21. The optoelectronic semiconductor component 10 further includes an optical window 28 formed inside the housing 14 and filled with material of changing optical character of light emitted from the first semiconductor chip 22, such as epoxy resin or silica gel. The optical window 28 can include fluorescent material, astigmatic material, or pigment. The optical window 28 is filled with fluid colloid of a transparent material inside the housing 14 and covering the first semiconductor chip 22, the second semiconductor chip 24, and the wires 26a, 26b, 26c. The fluid colloid can be solidified so as to protect and fix the first semiconductor chip 22, the second semiconductor chip 24, and the wires 26a, 26b, 26c. [0007] One disadvantage of this arrangement is that the light emitted from the first semiconductor chip 22 through the optical window 28 to the light exit opening 16 will be sheltered by the second semiconductor chip 24 because the first semiconductor chip 22 and the second semiconductor chip 24 are positioned on the same plane. The light cannot be effectively emitted outside the light exit opening 16 through the optical window 28 by reflection between the internal surface of the housing 14. This reduces the light-emitting uniformity and light-emitting efficiency of the optoelectronic semiconductor component 10. SUMMARY OF THE INVENTION [0008] It is therefore a primary objective of the claimed invention to provide an optoelectronic semiconductor component with high light-emitting efficiency for solving the above-mentioned problem. [0009] According to the claimed invention, an optoelectronic semiconductor component includes a housing including a light exit opening, a first semiconductor chip installed inside the housing for emitting light, and a second semiconductor chip located at a position inside the housing. A distance between the second semiconductor chip and the light exit opening is greater than a distance between the first semiconductor chip and the light exit opening. [0010] These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings. BRIEF DESCRIPTION OF THE DRAWINGS [0011] FIG. 1 is a schematic diagram of an optoelectronic semiconductor component in the prior art. [0012] FIG. 2 is a front view of the optoelectronic semiconductor component in the prior art. [0013] FIG. 3 is a diagram of the optoelectronic semiconductor component fabricated on a circuit board in the prior art. [0014] FIG. 4 is a diagram of internal components of the optoelectronic semiconductor component in the prior art. [0015] FIG. 5 is a schematic diagram of an optoelectronic semiconductor component according to the present invention. [0016] FIG. 6 is a front view of the optoelectronic semiconductor component according to the present invention. [0017] FIG. 7 is a diagram of the optoelectronic semiconductor component fabricated on a circuit board according to the present invention. [0018] FIG. 8 is a cutaway view of the optoelectronic semiconductor component according to the present invention. [0019] FIG. 9 is a diagram of internal components of the optoelectronic semiconductor component according to the present invention. [0020] FIG. 10 is a cutaway view of an optoelectronic semiconductor component of another embodiment according to the present invention. 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