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Optical structures including liquid bumpsRelated Patent Categories: Metal Fusion Bonding, ProcessOptical structures including liquid bumps description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070152020, Optical structures including liquid bumps. Brief Patent Description - Full Patent Description - Patent Application Claims
RELATED APPLICATIONS [0001] The present application is a divisional of and claims priority from U.S. patent application Ser. No. 11/213,414 filed on Aug. 26, 2005 which claims priority from U.S. patent application Ser. No. 10/008,466, filed Nov. 9, 2001, which claims priority from U.S. Provisional Application No. 60/246,899 filed Nov. 10, 2000, and from U.S. Provisional Application No. 60/314,240 filed Aug. 22, 2001, the disclosures of which are hereby incorporated by reference herein in their entireties. BACKGROUND OF THE INVENTION [0002] Solder is used as an adhesive to attach optical fibers to a circuit board. Efforts to model the motion of an optical fiber during the wetting and solidification of the adhesive solder droplet are discussed in a reference by Adam Powell et al. entitled "Mechanism Of Motion Of An Optical Fiber Aligned By A Solder Droplet", Mat.Res.Soc.Symp.Proc., Vol. 531, 1998. The extent of motion is determined by several competing forces, during three stages of solder joint formation. First, capillary forces of the liquid phase control the fiber position. Second, during solidification, the presence of the liquid-solid-vapor triple line as well as a reduced liquid solder volume leads to a change in the net capillary force on the optical fiber. Finally, the solidification front itself impinges on the fiber. Publicly-available finite element models are used to calculate the time-dependent position of the solidification front and shape of the free surface. [0003] Unfortunately, during the melting and solidification of the solder, significant motion of the fiber is observed to occur, decreasing the transmission efficiency. Because the capillary force on the fiber scales as its diameter and its stiffness as its diameter cubed, a very thin fiber is likely to be significantly deflected by the capillary force. Furthermore, as the solid joint solidifies, its volume changes, and with it the shape of the liquid surface and the magnitude of the capillary force on the fiber. Finally, as the solidified solder makes contact with the fiber, the shrinkage during cooling pulls the fiber further out of alignment. The disclosure of the Adam Powell reference is hereby incorporated herein in its entirety by reference. SUMMARY OF THE INVENTION [0004] According to aspects of the present invention, a component can be positioned on a substrate by providing a liquid material on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material can then be changed to move the component from the first position relative to the substrate to a second position relative to the substrate. [0005] According to additional aspects of the present invention, an initial volume of a liquid can be provided on a wettable area of the substrate adjacent the component such that the component has a first position relative to the substrate. The volume of the liquid on the wettable area of the substrate adjacent the component can be changed to move the component from the first position relative to the substrate to a second position relative to the substrate. In addition, the component can then be secured in the second position relative to the substrate. [0006] According to further aspects of the present invention, a liquid material can be provided on a substrate adjacent a component wherein the liquid material is confined to a wettable area of the substrate such that the component is in a first position relative to the substrate. The liquid material can then be differentially heated to move the component from the first position to a second position relative to the substrate. [0007] Still further aspects of the present invention can provide manipulation of a light path between two optical components. For example, a liquid material can be provided on a wettable area of a substrate so that the liquid material forms a bump on the wettable area. A height of the liquid bump can be changed between a first height and a second height so that the liquid bump interrupts the light path at the first height of the liquid bump and so that the light path is not interrupted at the second height of the liquid bump. [0008] Additional aspects of the present invention can provide optical structures. For example, first and second elongate liquid bumps can be provided on a substrate wherein the first and second elongate liquid bumps are parallel, and an optical fiber can be provided in contact with and between the first and second elongate liquid bumps. Alternatively, first and second optical components can define an optical path therebetween, and a liquid bump between the first and second optical components can be adapted to selectively interrupt and allow the optical path between the first and second optical components. BRIEF DESCRIPTION OF THE DRAWINGS [0009] FIGS. 1A-C are plan and cross-sectional views illustrating vertical displacement of components by changing liquid volumes according to embodiments of the present invention. [0010] FIGS. 2A-C are plan and cross-sectional views illustrating lateral displacement of components by changing liquid volumes according to embodiments of the present invention. [0011] FIGS. 3 and 4A-D are perspective and cross-sectional views illustrating displacements of fibers using elongate liquid bumps according to embodiments of the present invention. [0012] FIG. 5 is a perspective view of adding liquid to a liquid bump according to embodiments of the present invention. [0013] FIGS. 6A-E are plan and cross-sectional views illustrating sumps and reservoirs according to embodiments of the present invention. [0014] FIG. 7 is a plan view illustrating alternate examples of reservoirs according to embodiments of the present invention. [0015] FIGS. 8-11 are cross-sectional views illustrating displacement of components using liquid bumps according to embodiments of the present invention. [0016] FIGS. 12A-E and 13A-E are plan and cross-sectional views illustrating movement of liquid on a constrained symmetric surface using a temperature differential across the liquid according to embodiments of the present invention. [0017] FIGS. 14A-C are plan and cross-sectional views illustrating movement of liquid on an asymmetric surface by changing a temperature of a uniformly heated liquid according to embodiments of the present invention. [0018] FIGS. 15A-C are plan and cross-sectional views illustrating movement of liquid on an asymmetric surface using a temperature differential across the liquid according to embodiments of the present invention. [0019] FIG. 16 is a graph illustrating internal pressure of a liquid as a function of liquid bump height. [0020] FIGS. 17A-C are plan and cross-sectional views illustrating movement of solder to switch light according to embodiments of the present invention. Continue reading about Optical structures including liquid bumps... Full patent description for Optical structures including liquid bumps Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Optical structures including liquid bumps patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Optical structures including liquid bumps or other areas of interest. ### Previous Patent Application: Method for depositing solder material on an electronic component part Next Patent Application: Solder compositions; method of soldering, and a laminated transparency having bus bars Industry Class: Metal fusion bonding ### FreshPatents.com Support Thank you for viewing the Optical structures including liquid bumps patent info. IP-related news and info Results in 0.12845 seconds Other interesting Feshpatents.com categories: Daimler Chrysler , DirecTV , Exxonmobil Chemical Company , Goodyear , Intel , Kyocera Wireless , 174 |
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