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07/19/07 | 41 views | #20070167110 | Prev - Next | USPTO Class 451 | About this Page  451 rss/xml feed  monitor keywords

Multi-zone carrier head for chemical mechanical polishing and cmp method thereof

USPTO Application #: 20070167110
Title: Multi-zone carrier head for chemical mechanical polishing and cmp method thereof
Abstract: A multi-zone carrier head includes a housing; a retaining ring secured to a lower edge of the housing; a backing plate having a plurality of non-concentric pressure zones defined by a plurality of isolated apertures on the backing plate; wherein the backing plate has a wafer side and a non-wafer side, the wafer side facing a backside of a wafer during a CMP operation; and a plurality of pneumatic bladder for independently controlling pressure exerted in the respective non-concentric pressure zones on the backside of the wafer during the CMP operation. (end of abstract)
USPTO Applicaton #: 20070167110 - Class: 451005000 (USPTO)
Related Patent Categories: Abrading, Precision Device Or Process - Or With Condition Responsive Control, Computer Controlled

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