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Multi-portion socket and related apparatusesRelated Patent Categories: Electrical Connectors, Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc., With Provision To Conduct Electricity From Panel Circuit To Another Panel Circuit, Micro Panel Circuit Arrangement, E.g., Icm, Dip, Chip, Wafer, Etc., Dual Inline Package (dip), LeadlessMulti-portion socket and related apparatuses description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20050287837, Multi-portion socket and related apparatuses. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to, but is not limited to, electronic devices, and in particular, to the field of electronic connections. [0003] 2. Description of Related Art [0004] In the current state of integrated circuit technology, electronic devices such as a central processing unit (CPU), volatile memory, system on chip (SOC), and the like, are typically assembled into electronic packages. These electronic packages will commonly have a mating surface that is populated with conductive contacts or pads that are electrical contact points or interfaces for various signal, ground and power paths. The electronic packages and in some cases, the electronic devices themselves, are usually directly or indirectly mounted onto an underlying carrier or circuit board, such as, for example, a printed circuit board (PCB), a printed circuit card (PCC), a motherboard, and the like, via a surface mounted socket. The circuit boards, in turn, will electrically couple these mounted electronic packages or electronic devices to other components via conductive interconnects that are typically embedded in and/or are on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS [0005] Embodiments of the present invention will be described referencing the accompanying drawings in which like references denote similar elements, and in which: [0006] FIG. 1 illustrates an exploded view of a circuit board assembly that includes a circuit board substrate and a first and a second socket elements, the first socket element being attached to an external substrate in accordance with some embodiments; [0007] FIG. 2 illustrates the assembly of FIG. 1 when the second socket element has been coupled to the first socket element to form a complete socket in accordance with some embodiments; [0008] FIG. 3 illustrates the first and second socket elements of FIG. 2, in further detail, in accordance with some embodiments; [0009] FIG. 4A illustrates a side view of the assembly of FIGS. 1 and 2 after the assembly is assembled in accordance with some embodiments; [0010] FIG. 4B illustrates a side view of an electronic component, socket and circuit board substrate in accordance with some embodiments; [0011] FIG. 4C illustrates a side view of an electronic component, socket and circuit board substrate in accordance with some embodiments; [0012] FIG. 4D illustrates a side view of an electronic component, socket and circuit board substrate in accordance with some embodiments; [0013] FIG. 4E illustrates a side view of an electronic component, socket and circuit board substrate in accordance with some embodiments; [0014] FIGS. 5A to 5D illustrate various views of a circuit board assembly in accordance with some embodiments; [0015] FIGS. 6A to 6D illustrate various views of a circuit board assembly in accordance with some embodiments; [0016] FIGS. 7A to 7C are block diagrams of signals being exchanged between two electronic components through an external substrate and circuit board signal paths in accordance with some embodiments; and [0017] FIG. 8 is a block diagram of an example system, in accordance with some embodiments. DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS [0018] In the following description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments of the present invention. However, it will be apparent to one skilled in the art that these specific details are not required in order to practice the disclosed embodiments of the present invention. In other instances, well-known electrical structures and circuits are shown in block diagram form in order not to obscure the disclosed embodiments of the present invention. [0019] The following description includes terms such as on, onto, over, top, underlying and the like, that are used for descriptive purposes only and are not to be construed as limiting. That is, these terms are terms that are relative only to a point of reference and are not meant to be interpreted as limitations but are instead, included in the following description to facilitate understanding of the various aspects of the invention. [0020] According to various embodiments of the invention, a circuit board is provided that includes a multi-portioned receiver for receiving an electronic component, the multi-portioned receiver being coupled to an external substrate. For these embodiments, the external substrate may include a dielectric with a lower electrical loss tangent value than a dielectric that comprises the circuit board substrate. An electronic component, according to these embodiments, may be, for example, an electronic package that includes one or more electronic devices, heat dissipation components and one or more substrates. An electronic component may also be an electronic device without a package such as a die or a chip, a chipset, or any other electronic component having multiple conductive contacts or pads. An electronic device may be a central processing unit, system on chip (SOC), graphical co-processor, a digital signal processor, volatile memory, input/output device, chipset input/output hub, memory controller or other electronic devices. In various embodiments, the receiver, such as a socket, may be mounted on the circuit board, or may be embedded within the circuit board itself. The receiver may be comprised of at least two detachable portions, at least one of the portions being coupled to the external substrate. [0021] FIG. 1 depicts an exploded view of a circuit board assembly that includes an electronic component and a receiver having two portions or elements, one of which is coupled to an external substrate, in accordance with various embodiments. For the embodiments, the receiver is a socket 100 that includes two detachable socket portions, a first socket element 102 and a second socket element 104. The second socket element 104 may be electrically coupled to an external substrate 106, while the first socket element 102 may be electrically coupled to a circuit board substrate 112. The socket 100 may receive an electronic component 108 that includes, in this case, a package substrate 109, an electronic device (not shown) such as a CPU, and a heat spreader 110. Continue reading about Multi-portion socket and related apparatuses... Full patent description for Multi-portion socket and related apparatuses Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Multi-portion socket and related apparatuses patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Multi-portion socket and related apparatuses or other areas of interest. ### Previous Patent Application: Method of connecting a contact with a solder and an electronic device using the method Next Patent Application: Circuit board retainer Industry Class: Electrical connectors ### FreshPatents.com Support Thank you for viewing the Multi-portion socket and related apparatuses patent info. IP-related news and info Results in 0.48364 seconds Other interesting Feshpatents.com categories: Computers: Graphics , I/O , Processors , Dyn. Storage , Static Storage , Printers 174 |
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