| Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same -> Monitor Keywords |
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Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making sameRelated Patent Categories: Metal Fusion Bonding, ProcessMulti-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060124700, Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same. Brief Patent Description - Full Patent Description - Patent Application Claims
[0001] This application is a divisional of U.S. patent application Ser. No. 10/607,738, filed on Jun. 26, 2003, which is incorporated herein by reference. TECHNICAL FIELD [0002] Disclosed embodiments relate to a multi-layer thermal interface material for an integrated heat spreader. BACKGROUND INFORMATION [0003] An integrated circuit (IC) die is often fabricated into a processor, a digital signal processor (DSP), and other devices for various tasks. The increasing power consumption of such dice results in tighter thermal budgets for a thermal solution design when the die is employed in the field. Accordingly, a thermal interface is often needed to allow the die to reject heat more efficiently. [0004] The most common thermal interface can employ a heat sink such as a heat spreader that is coupled to the backside of a die. One of the issues encountered when using an integrated heat spreader (IHS) is getting a balance between sufficient adhesion to the die, and a high enough heat flow to meet the cooling requirements of the die. To deal with this issue, several bonding materials have been tried with varying results. If the adhesion is insufficient, the IHS may spall off from the thermal interface material (TIM) and result in a yield issue or a field failure. One technicality encountered is achieving an acceptable IHS standoff from the die and the board to which the board is mounted. BRIEF DESCRIPTION OF THE DRAWINGS [0005] In order to understand the manner in which embodiments are obtained, a more particular description of various embodiments of the invention briefly described above will be rendered by reference to the appended drawings. These drawings depict embodiments that are not drawn to scale and are not to be considered to be limiting of its scope. Some embodiments will be described and explained with additional specificity and detail through the use of the accompanying drawings in which: [0006] FIG. 1A is a side cross-section of a heat transfer subsystem according to an embodiment; [0007] FIG. 1B depicts the heat transfer composite in FIG. 1A after farther processing; [0008] FIG. 2A is a side cross-section of a heat transfer subsystem according to an embodiment; [0009] FIG. 2B depicts the heat transfer composite in FIG. 2A after further processing; [0010] FIG. 3A is a side cross-section of a heat transfer subsystem according to an embodiment; [0011] FIG. 3B depicts the heat transfer composite in FIG. 3A after further processing; [0012] FIG. 4 is a bottom cross-section of a heat transfer composite according to an embodiment; [0013] FIG. 5A is a side cross-section of a heat transfer subsystem according to an embodiment; [0014] FIG. 5B depicts the heat transfer composite in FIG. 5A after further processing; [0015] FIG. 6A is a side cross-section of a heat transfer subsystem according to an embodiment; [0016] FIG. 6B depicts the heat transfer composite in FIG. 6A after further processing; [0017] FIG. 7A is a side cross-section of a heat transfer subsystem according to an embodiment; [0018] FIG. 7B depicts the heat transfer composite in FIG. 7A after further processing; [0019] FIG. 8A is a side cross-section of a heat transfer subsystem according to an embodiment; [0020] FIG. 8B depicts the heat transfer composite in FIG. 8A after further processing; [0021] FIG. 9 is a schematic of a process embodiment; Continue reading about Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same... Full patent description for Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same or other areas of interest. ### Previous Patent Application: Micro-c-4 semiconductor die and method for depositing connection sites thereon Next Patent Application: Phase change resistance spot welding tip Industry Class: Metal fusion bonding ### FreshPatents.com Support Thank you for viewing the Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same patent info. IP-related news and info Results in 0.20628 seconds Other interesting Feshpatents.com categories: Qualcomm , Schering-Plough , Schlumberger , Seagate , Siemens , Texas Instruments , 174 |
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