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MoserIPLaw Group / Applied Materials, Inc. patentsThe following is a sampling of recent MoserIPLaw Group / Applied Materials, Inc. patent applications (USPTO Patent Application #, Patent Title) sorted by month.
April 2008 - MoserIPLaw Group / Applied Materials, Inc. patents
20080087381 - Matching network characterization using variable impedance analysis
March 2008 - MoserIPLaw Group / Applied Materials, Inc. patents
20080066684 - Wafer processing hardware for epitaxial deposition with reduced backside deposition and defects
20080069951 - Wafer processing hardware for epitaxial deposition with reduced auto-doping and backside defects
20080070127 - Photomask having self-masking layer and methods of etching same
20080070128 - Method of etching extreme ultraviolet light (euv) photomasks
November 2007 - MoserIPLaw Group / Applied Materials, Inc. patents
20070272359 - Apparatus for removing a halogen-containing residue
20070254489 - Method for removing a halogen-containing residue
October 2007 - MoserIPLaw Group / Applied Materials, Inc. patents
20070249172 - Method for removing masking materials with reduced low-k dielectric material damage
August 2007 - MoserIPLaw Group / Applied Materials, Inc. patents
20070181063 - Method for plasma ignition
July 2007 - MoserIPLaw Group / Applied Materials, Inc. patents
20070153263 - Method and apparatus for performing limited area spectral analysis
May 2007 - MoserIPLaw Group / Applied Materials, Inc. patents
20070113980 - Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor
20070108042 - Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor
20070111538 - Method of fabricating a silicon nitride stack
20070111546 - Method for fabricating controlled stress silicon nitride films
April 2007 - MoserIPLaw Group / Applied Materials, Inc. patents
20070089836 - Semiconductor process chamber
20070093012 - Method for fabricating a gate dielectric of a field effect transistor
20070087575 - Method for fabricating silicon nitride spacer structures
20070079761 - Heat transfer assembly
20070077767 - Method of plasma etching of high-k dielectric materials
February 2007 - MoserIPLaw Group / Applied Materials, Inc. patents
20070026547 - Cluster tool and method for process integration in manufacture of a gate structure of a field effect transistor
20070026665 - Method of fabricating a dual damascene interconnect structure
January 2007 - MoserIPLaw Group / Applied Materials, Inc. patents
20070017896 - Method for controlling a process for fabricating integrated devices
20070017897 - Multi-frequency plasma enhanced process chamber having a toroidal plasma source
20070020944 - Selective etch process of a sacrificial light absorbing material (slam) over a dielectric material
20070006971 - Plasma generation and control using a dual frequency rf source
20070000611 - Plasma control using dual cathode frequency mixing
December 2006 - MoserIPLaw Group / Applied Materials, Inc. patents
20060289384 - Method and apparatus for performing hydrogen optical emission endpoint detection for photoresist strip and residue removal
20060286818 - Method for silicon based dielectric chemical vapor deposition
November 2006 - MoserIPLaw Group / Applied Materials, Inc. patents
20060266735 - Plasma generation and control using dual frequency rf signals
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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with MoserIPLaw Group / Applied Materials, Inc. in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for MoserIPLaw Group / Applied Materials, Inc. with additional patents listed. Browse our Agent directory for other possible listings.
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