| Modular heel assembly for high heel shoes -> Monitor Keywords |
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Modular heel assembly for high heel shoesRelated Patent Categories: Boots, Shoes, And Leggings, Heels, DetachableModular heel assembly for high heel shoes description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060196082, Modular heel assembly for high heel shoes. Brief Patent Description - Full Patent Description - Patent Application Claims
RELATED PATENT APPLICATIONS [0001] This patent application is related to, and claims the benefit under 35 U.S.C. .sctn. 119(e) of, U.S. provisional patent application Ser. No. 60/651,492, converted from U.S. patent application Ser. No. 11/068,233 filed 1 Mar. 2005, and U.S. provisional patent application Serial No. 60/714,051 filed 2 Sep. 2005, which are incorporated herein by reference in their entirety. FIELD OF THE INVENTION [0002] The present invention relates to modular heel assemblies for high heel shoes and to high heel shoes. More particularly, the invention relates, for example, to a removable modular heel assembly that fits against a high heel shoe that may, for example, be adapted to accept the assembly, and which may be further designed to increase the surface area of the heel and enhance stability for the wearer. BACKGROUND OF THE INVENTION [0003] Many versions of high heel shoes, for example stiletto heels, have small surface areas where the heel portion of the high heel shoe contacts the ground. This results in significant disadvantages for the wearer. For example, fatigue and discomfort in the ankle and foot often occur from the extra effort required to stabilize the wearer's ankle and foot in a high heel shoe with a small surface area. [0004] In addition, traversing anything other than smooth, level surfaces presents perils for the wearers of high heel shoes with a small heel surface area. Subway grates, sidewalk cracks and cobblestone walkways are just some of the surfaces that these high heel wearers can not traverse easily, or perhaps safely, if at all. Often, these rough surfaces damage the heel of the shoe, and the wearer may suffer a fall or risk injury. [0005] To avoid the foregoing disadvantages of wearing high heel shoes with small heel areas, a wearer often carries a second pair of shoes with a different heel style, such as a sneaker, changing shoes before walking on rough terrain. This is inconvenient, however, because the extra pair of shoes may be heavy and use space that could hold other items, and because changing shoes causes unnecessary delay, expense, or inconvenience. [0006] Hence, there remains a need in the art for a removable apparatus that will attach to small heel area-high heel shoes to widen the heel area and thus improve the stability of these fashion staples. SUMMARY OF THE INVENTION [0007] An object of the present invention provides for a removable modular heel assembly for high heel shoes that increases the stability of the shoes. Another object of the invention provides for a high heel shoe adapted such that a modular heel assembly may be attached. [0008] One embodiment of the invention provides for a removable modular attachment for a shoe for increasing the surface area of the heel contacting the ground, including an apparatus affixed to or configured within the high heel shoe, and a heel modular attachment molded to fit into the fixed heel apparatus. [0009] In one aspect of the invention, the modular attachment comprises a spring-loaded hook, and the fixed heel apparatus is a receptacle for the spring-loaded hook. In another aspect of the invention, the modular attachment includes screw threads or reverse screw threads, and the fixed heel apparatus comprises reverse screw threads or screw threads, respectively, that accept the modular attachment. These threads may be configured as a single helical coil, interrupted turns of a coil, threads having interruptions, blunted ends, twisted ends, or any of a number of known thread configurations or combinations thereof. In another aspect of the invention, the modular attachment comprises a snap-on attachment, and the fixed heel apparatus comprises grooves to accept the snap-on attachment. In yet another aspect of the invention, the modular attachment is a wedge that slides into place, having an insert portion in the front of the wedge, and at least one attachment means in the back of the wedge, in which the fixed heel has been configured with openings oriented to receive the modular attachment insert portions and the attachment means. In a particular aspect of this embodiment, the attachment means include protrusions and a pressure-activated clip that holds the modular heel unit in place against the fixed heel of the shoe. [0010] In another embodiment of the present invention, a modular attachment may be provided, for example, without a corresponding configuration within the shoe or shoe heel. For example, an attachment may be provided that includes a spring-loaded hook for attachment to a shoe heel. In another aspect of the invention, the modular attachment may include a screw thread or reverse screw thread for application to a shoe heal and may also include a means for applying a corresponding thread to an existing shoe heel, such as by self-tapping threads or removably attached threaded insert on the outside of the heel. In another aspect of the invention, the modular attachment comprises a snap-on attachment to snap on to a shoe heel, sole or another portion of a shoe of a given configuration. In yet another aspect of the invention, the modular attachment is a wedge that slides into place onto a shoe heel, wedging the original heel into the modular attachment. In another embodiment, a modular attachment may include a pressure-activated clip that is adapted to assist the modular heel unit in remaining in place about the shoe heel. Another embodiment of a modular attachment may include one or more set screws for fixedly pushing against a portion of the shoe or heel. The shoe may further include or be modified to include a receptacle for that set screw. [0011] Another embodiment of the present invention provides for a high heel shoe into which an attachment means has been manufactured such that the shoe may accept a removable modular attachment for the shoe, such that when the modular attachment is in place, it increases the area of the shoe where the heel contacts the ground. BRIEF DESCRIPTION OF THE DRAWINGS [0012] A more complete appreciation of the present invention and many of its attendant advantages may be more readily understood by reference to the following drawings. These drawings are provided for demonstration of particular embodiments or aspects of the present invention and are not to limit the invention. [0013] FIG. 1 depicts a bottom view of the area under a high heel (stiletto) shoe that makes contact with the surface below it. [0014] FIG. 2 depicts a bottom view of an embodiment of the invention in which the sole of the high heel shoe is equipped to receive a modular attachment to increase the surface area of the heel. [0015] FIGS. 3A and 3B show a side perspective view of an embodiment of the present invention in which a stability plate extending from the toe portion of the shoe sole is provided to accept a wedge modular heel attachment. FIG. 3A depicts a side view of a shoe and a separate side perspective view of an embodiment of a modular heel attachment; FIG. 3B shows a side view of a modular heel attachment attached to the shoe. [0016] FIGS. 4A, 4B, 4C and 4D depict an embodiment of the invention in which a modular heel attachment fits over a fixed heel and includes a spring-loaded mechanism that attaches to a receptacle on a high heel shoe. FIG. 4A is a side view of a shoe with a modular heel attachment; FIG. 4B is a bottom view showing the increased surface heel area of the bottom of the heel with modular heel attachment of FIG. 4A; FIG. 4C depicts a side perspective view of a modular heel attachment; and FIG. 4D is an exploded view of an embodiment of a spring-loaded mechanism. [0017] FIG. 5 is a cross sectional perspective view of a bottom portion of an embodiment of the present invention for a shoe adapted to receive a protruding portion of a modular attachment. [0018] FIG. 6 is a bottom perspective exploded view of an embodiment of the present invention with a shoe adapted to receive a wedge-style modular heel and modular heel components. [0019] FIG. 7 is a top perspective exploded view of an embodiment of the present invention having a shoe adapted to receive a wedge-style modular heel and modular heel components. Continue reading about Modular heel assembly for high heel shoes... Full patent description for Modular heel assembly for high heel shoes Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Modular heel assembly for high heel shoes patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Modular heel assembly for high heel shoes or other areas of interest. ### Previous Patent Application: Pumping device of shoes Next Patent Application: Snowboard boot with liner harness Industry Class: Boots, shoes, and leggings ### FreshPatents.com Support Thank you for viewing the Modular heel assembly for high heel shoes patent info. 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