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08/16/07 - USPTO Class 525 |  79 views | #20070191542 | Prev - Next | About this Page  525 rss/xml feed  monitor keywords

Modifier for resin and resin composition using the same and formed article

USPTO Application #: 20070191542
Title: Modifier for resin and resin composition using the same and formed article
Abstract: A modifier for resin has an average particle size of 20 μm or more, wherein particles having an average particle size of 10 μm or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 μm or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes. Also a resin composition comprises 1 to 40% by mass of the modifier for resin and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin, and a molded article is produced by molding the same. (end of abstract)



Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C. - Alexandria, VA, US
Inventors: Tsuneki Wakita, Keiji Nakamura, Hideaki Makino, Masahiro Osuka, Yohei Miwa, Yasutaka Doi
USPTO Applicaton #: 20070191542 - Class: 525070000 (USPTO)

Related Patent Categories: Synthetic Resins Or Natural Rubbers -- Part Of The Class 520 Series, Natural Rubber Compositions Having Nonreactive Materials (dnrm) Other Than: Carbon, Silicon Dioxide, Glass Titanium Dioxide, Water, Hydrocarbon, Halohydrocarbon, Ethylenically Unsaturated Reactant Admixed With A Preformed Reaction Product Derived From: (a) At Least One Polycarboxylic Acid, Ester, Or Anhydride; (b) At Least One Polyhydroxy Compound; And (c) At Least One Fatty Acid Glycerol Ester, Or A Fatty Acid Or Salt Derived From A Naturally Occurring Glyceride, Tall Oil, Or A Tall Oil Fatty Acid, At Least One Solid Polymer Derived From Ethylenic Reactants Only, Mixing Of Solid Graft Or Graft-type Copolymer Derived From Ethylenic Reactants Only With Other Solid Polymer Derived From Ethylenic Reactants Only; Or Treating Said Mixture With Chemical Treating Agent; Or Processes Of Forming Or Reacting; Or The Resultant Product Of Any Of The Above Operations

Modifier for resin and resin composition using the same and formed article description/claims


The Patent Description & Claims data below is from USPTO Patent Application 20070191542, Modifier for resin and resin composition using the same and formed article.

Brief Patent Description - Full Patent Description - Patent Application Claims
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TECHNICAL FIELD

[0001] The present invention relates to a modifier for resin, which exhibits excellent dispersibility to a curable resin or a thermoplastic resin.

BACKGROUND ART

[0002] Resin products are produced according to purposes such as electric and electronic products, automobiles and building materials. To exhibit performances required according to the purposes, one or several kinds of resins and additives are added to the molded articles. These resins often require high toughness and a modifier for resin is added so as to impart impact strength required to end uses of the resin products.

[0003] Usually, this modifier for resin is supplied in the form of a powder. Therefore, dispersion of the modifier into a matrix resin becomes very important element and, when poor dispersion occurs, sufficient modification effect is not obtained and inclusion composed of extraordinary substance of the modifier is formed in appearance. Dispersion of the modifier for resin is particularly important element in electric and electronic components, solder pastes and coating materials. Particularly, it is necessary condition for a modifier for semiconductor sealing material to cause no poor dispersion due to the thinning and fine patterning of a package with recent high degree of functioning and high degree of integration of a semiconductor device.

[0004] As a method of imparting the strength to a semiconductor sealing material, a method of adding a rubber such as MBS resin to an epoxy resin has been proposed (see, for example, Patent Documents 1 and 2).

[0005] Patent Document 1: Japanese Unexamined Patent Application, First Publication No. 2000-7890

[0006] Patent Document 2: Japanese Unexamined Patent Application, First Publication No. S62-22825

DISCLOSURE OF THE INVENTION

Problems to be Solved by the Invention

[0007] However, the modifier for resin is not insufficient in dispersibility in a molding method in which processing is conducted under low shear. For example, when the modifier is added to a sealing epoxy resin, poor dispersion occurs and the resin itself may be cracked or fractured by thermal stress produced during a soldering treatment.

[0008] The present invention has been made so as to provide a modifier for resin, which exhibits excellent dispersibility when added to a thermoplastic resin or a curable resin, and also can impart impact resistance, matting properties or thickening properties.

[0009] The gist of the present invention lies in a modifier for resin having an average particle size of 20 .mu.m or more, wherein particles having an average particle size of 10 .mu.m or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 .mu.m or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes.

[0010] Also the gist of the present invention lies in a resin composition comprising 1 to 40% by mass of the modifier for resin and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin.

[0011] Also the gist of the present invention lies in a molded article which is produced by molding the same.

EFFECTS OF THE INVENTION

[0012] The modifier for resin of the present invention is excellent in dispersibility when added to a thermoplastic resin or a curable resin and is excellent in appearance in the product, and also can impart sufficient impact strength.

[0013] Also a resin composition prepared by mixing the modifier for resin of the present invention with a thermoplastic resin or a curable resin can be applied to IC sealing agents, solder pastes and molded articles.

[0014] Furthermore, when the modifier for resin of the present invention is mixed with a curable resin composition, gloss is not increased even by friction and a matted coating film with excellent adhesion of a recoated coating film can be formed. Also the modifier for resin of the present invention exhibits excellent thickening properties to a nonaqueous coating material.

BEST MODE FOR CARRYING OUT THE INVENTION

[0015] Although the structure of the modifier for resin of the present invention is not specifically limited, a graft copolymer is preferably used. The graft copolymer is not specifically limited as far as it has a so-called core-shell type structure formed by using a rubbery polymer as a trunk polymer and grafting the rubbery polymer with a graft polymerizable vinyl-based monomer.

[0016] The rubbery polymer is not specifically limited and there can be used those, which are commonly used, such as diene-based rubber, acrylic rubber, silicone-based rubber or silicone-acrylic composite rubber. Among these, an acrylic rubber is preferably used because a modifier for resin having high dispersibility is obtained.

[0017] The diene-based rubber can be obtained by polymerizing 1,3-butadiene and, if necessary, at least one vinyl-based monomer copolymerizable with 1,3-butadiene. Examples of the vinyl-based monomer include aromatic vinyl such as styrene or .alpha.-methylstyrene; alkyl methacrylate ester such as methyl methacrylate or ethyl methacrylate; alkyl acrylate ester such as ethyl acrylate or n-butyl acrylate; unsaturated nitrile such as acrylonitrile or methacrylonitrile; vinyl ether such as methyl vinyl ether or butyl vinyl ether; vinyl halide such as vinyl chloride or vinyl bromide; vinylidene halide such as vinylidene chloride or vinylidene bromide; and vinyl-based monomer having a glycidyl group, such as glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether or ethylene glycol glycidyl ether.

[0018] Furthermore, it is possible to use in combination with crosslinkable monomers, for example, aromatic polyfunctional vinyl compound such as divinylbenzene or divinyltoluene; polyhydric alcohol such as ethylene glycol dimethacrylate or 1,3-butanediol diacrylate; trimethacrylate; triacrylate; allyl carboxylate ester such as allyl acrylate or allyl methacrylate; and di- and triallyl compounds such as diallyl phthalate, diallyl sebacate and triallyltriazine.

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Soft thermoplastic elastomer having improved wear resistance
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