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Micromechanical getter anchorMicromechanical getter anchor description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070177246, Micromechanical getter anchor. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] The following patents and/or commonly assigned patent applications are hereby incorporated by reference. TABLE-US-00001 Patent No. Filing Date Issue Date Title 5,061,049 Sep. 13, 1990 Oct. 29, 1991 Spatial Light Modulator and Method 5,583,688 Dec. 21, 1993 Dec. 10, 1996 Multi-Level Digital Micromirror Device FIELD OF THE INVENTION [0002] This invention relates to the field of micro-electromechanical systems (MEMS), more particularly to methods of attaching getters in packages containing lubrication for the MEMS device. BACKGROUND OF THE INVENTION [0003] Micromechanical devices are small structures typically fabricated on a semiconductor wafer using techniques such as optical lithography, doping, metal spattering, oxide deposition, and plasma etching which have been developed for the fabrication of integrated circuits. [0004] Micromirror devices, such as the Digital Micromirror Device.TM. (DMD.TM.) produced by Texas Instruments, are a type of micromirror device. Other types of micromechanical devices include accelerometers, pressure and flow sensors, gears and motors. While some micromechanical devices, such as pressure sensors, flow sensors, and micromirrors have found commercial success, other types have not yet been commercially viable. [0005] MEMS devices typically have moving mechanical components that rub against each other. Lubricants are required to prevent the small components from wearing out prematurely and to reduce stiction where the components touch. One effective lubricant is perfluordecanoic acid, or PFDA. PFDA forms a monolayer over the components leaving a surface that is non-reactive. PFDA is often applied over the entire interior surface of a package, including the MEMS device. Unfortunately, once PFDA is applied to the package interior, it is very difficult to attach other components, such as moisture and gas getters, to the package. What is needed is a system and method for providing positive retention of getters to the package interior that does not rely on adhesion between the getter and the package. SUMMARY OF THE INVENTION [0006] Objects and advantages will be obvious, and will in part appear hereinafter and will be accomplished by the present invention which provides a method and system for a micromechanical getter anchor. One embodiment of the claimed invention provides an anchor to hold getter materials in place within a micromechanical device package substrate, said anchor comprising: a first cavity face; and a second cavity face. The first and second cavity faces define an anchor cavity and are arranged to mechanically retain a getter away from a region holding the micromechanical device. [0007] Another embodiment of the disclosed invention provides an anchor to hold a getter in place within a micromechanical package. The anchor comprises: a package substrate; and a member attached to the package substrate, the member shaped to provide mechanical retention of the getter material formed over said member. [0008] Another embodiment of the disclosed invention provides a micromechanical device package comprising: a package substrate; a package lid enclosing a package cavity; a micromechanical device in the package cavity; and a getter anchor in the package cavity. [0009] Another embodiment of the disclosed invention provides a method of packaging a micromechanical device. The method comprises: providing a package substrate having a getter anchor; attaching a micromechanical device to the package substrate; attaching a getter material to the getter anchor; and attaching a package lid to the package substrate. [0010] Another embodiment of the disclosed invention provides a method of forming a package having an anchor. The method comprises: forming a first package substrate layer; forming a second package substrate layer, the second layer having a void; forming a third package substrate layer; laminating the first, second, and third layers such that the void forms an anchor cavity suitable for holding a getter. A further embodiment further comprises: forming a fourth package substrate layer having a void. The second and fourth layers are adjacent when laminated such that a cavity anchor with a narrow top and a relatively wide bottom is formed by the voids in the second and fourth layers. [0011] Another embodiment of the disclosed invention provides a method of packaging a micromechanical device. The method comprises: providing a package substrate, attaching a micromechanical device to the package substrate; attaching bond wires between the micromechanical device and the package substrate; attaching a getter material to the bond wires; and attaching a package lid to the package substrate. BRIEF DESCRIPTION OF THE DRAWINGS [0012] for a more complete understanding of the present invention, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which: [0013] FIG. 1 is a cross section side view of a micromechanical package of the prior art showing the location of a getter within the package. [0014] FIG. 2 is a perspective view of a portion of a micromirror package substrate showing an anchor mechanism according to one embodiment of the present invention. [0015] FIG. 3 is a perspective view of the portion of a micromirror package substrate of FIG. 2 showing a getter applied to, and held by, the anchor of FIG. 2. [0016] FIG. 4 is a perspective view of a portion of a micromirror package substrate showing and adhesive applied to, and held by, a getter anchor, and a pre-formed getter being applied to the adhesive. [0017] FIG. 5 is a side view of a portion of a package substrate showing an alternate anchor member configuration. [0018] FIG. 6 is a side view of a portion of a package substrate showing an alternate anchor member configuration. [0019] FIG. 7 is a cross section side view of a micromechanical device package showing the bond wires used in the prior art. Continue reading about Micromechanical getter anchor... Full patent description for Micromechanical getter anchor Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Micromechanical getter anchor patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. 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