Microfabricated temperature sensor

Abstract: A microfabricated temperature sensor. The sensor comprises a polymer-based substrate and a resistance temperature device (RTD) disposed on the substrate. The RTD comprises a thin-film metal. (end of abstract)

Agent: Greer, Burns & Crain - Chicago, IL, US
Inventors: Chang Liu, Jack Chen, Jonathan Engel
USPTO Applicaton #: #20080089383 - Class: 374044000 (USPTO)
Related Patent Categories: Thermal Measuring And Testing, Determination Of Inherent Thermal Property (e.g., Heat Flow Coefficient), Thermal Conductivity

Microfabricated temperature sensor description/claims

The Patent Description & Claims data below is from USPTO Patent Application 20080089383, Microfabricated temperature sensor.

Full Patent Description - Patent Application Claims

PRIORITY CLAIM

[0001] The present application is a division of U.S. patent application Ser. No. 10/861,096, filed Jun. 4, 2004, which claims the benefit of U.S. Provisional Application Ser. No. 60/476,672, filed Jun. 6, 2003, under 35 U.S.C. .sctn.119.

FIELD OF THE INVENTION

[0003] The invention concerns sensors. The invention relates generally to the field of microscale sensors.

BACKGROUND OF THE INVENTION

[0004] Humans and other animals are able to perceive and process environmental conditions using various sensory attributes. For example, animal skin and hair act to provide tactile and flow sensing for perception in land and/or water environments. Man-made devices rely on sensors constructed on many different physical principles, for example heat and resistance, to obtain similar information. Animal sensory systems have attributes that are more elegant and efficient than known sensors.

SUMMARY OF THE INVENTION

[0005] Embodiments of the present invention provide, among other things, a microfabricated temperature sensor. The sensor comprises a polymer-based substrate and a resistance temperature device (RTD) disposed on the substrate. The RTD comprises a thin-film metal.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] FIG. 1 shows an exemplary tactile sensor node incorporated into a sensor chip, according to a preferred embodiment of the present invention;

[0007] FIG. 2 shows a flexed sensor chip, according to a preferred embodiment of the present invention;

[0008] FIGS. 3A and 3B show a cross section of a hardness sensor, and the hardness sensor in contact with an object, respectively, according to a preferred embodiment of the present invention;

[0009] FIG. 4 shows a differential response between the membrane hardness sensor and a reference sensor versus object hardness, with a linear fit line;

[0010] FIG. 5 shows a preferred embodiment of a thermal conductivity sensor, according to an embodiment of the present invention;

[0011] FIG. 6 shows a relationship between thermal conductivity and a time constant, in which step power input to a gold heater of a thermal conductivity sensor generates a signal at a nickel temperature sensor, with a time constant that varies with contact object thermal conductivity;

[0012] FIG. 7 shows a response of a skin mapping sensor to skin curvature, according to an embodiment of the present invention;

[0013] FIGS. 8A-8E show an exemplary process for manufacturing a sensor chip having sensors, according to a preferred embodiment of the present invention;

[0014] FIG. 9 shows a membrane hardness sensor with a nichrome string gauge, and a reference bulk sensor, respectively;

[0015] FIG. 10 shows an exemplary flow sensory node, according to another embodiment of the present invention;

[0016] FIG. 11 shows a silicon based artificial haircell, according to an embodiment of the present invention;

[0017] FIG. 12 shows a preferred artificial haircell (AHC), according to a preferred embodiment of the present invention;

[0018] FIGS. 13A and 13B show steps in a preferred process for manufacturing the AHC of FIG. 12, according to a preferred embodiment of the present invention;

[0019] FIG. 14 illustrates a post release Ni plating set up, in which an external magnetic field is used to raise the AHC of FIG. 12, according to a preferred embodiment of the present invention;

[0020] FIGS. 15A and 15B show a plastically deformed Au hinge without and with electroplating, respectively;

Full Patent Description - Patent Application Claims
Click on the above for other options relating to this Microfabricated temperature sensor patent application.
###

How KEYWORD MONITOR works... a FREE service from FreshPatents
1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored.
3. Each week you receive an email with patent applications related to your keywords.
Start now! - Receive info on patent apps like Microfabricated temperature sensor or other areas of interest.
###

Previous Patent Application:
Planar beam dump
Next Patent Application:
Apparatus for discriminating liquid reducing agent
Industry Class:
Thermal measuring and testing

###

Design/code © 2010 FreshContext LLC/Freshpatents.com. Website Terms and Conditions - Also read: About this Page
Patent data source: patents published by the United States Patent and Trademark Office (USPTO)
Information published here is for research/educational purposes only (and in conjunction with our Keyword Monitor) and is not meant to be used in place of the full USPTO patent document/images or a comprehensive patent archive search. Complete official applications are on file at the USPTO and often contain additional data/images (Freshpatents is currently text-only). FreshPatents.com is not affiliated with or endorsed by the USPTO or firms/individuals or products/designs/ideas related to listed patents.

FreshPatents.com Support
Thank you for viewing the Microfabricated temperature sensor patent info.
AAPL - Apple, BA - Boeing, CALP, DTV - Direct TV, EBAY, FRX, GOOG - Google, HEPH, IBM, JBL - Jabil, KO - Coca Cola, LXRX, MOT - Motorla IP-related news and info

Results in 0.21001 seconds

Other interesting Feshpatents.com categories:
Medical: Surgery , Surgery(2) , Surgery(3) , Drug , Drug(2) , Prosthesis , Dentistry 174

PATENT INFO

About this Page

noimage