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Michael GaynesRecent sampling of patent applications for Michael Gaynes listed and published in the public domain by the USPTO (USPTO Patent Application #,Title):
20070236890 - Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages
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The patent applicatons displayed about Michael Gaynes's patent applications are for a recent sample of publicly published patent applications. FreshPatents.com is not associated or affiliated in any way with the author/inventor or the United States Patent/Trademark Office but is providing this non-comprehensive sample listing for educational and research purposes using public data published from the United States Patent/Trademark Office public datafeed. This information is also available for free on the USPTO.gov website. If Michael Gaynes filed recent patent applications under another name, spelling or location then those applications could be listed on an alternate page.
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