| Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography -> Monitor Keywords |
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  Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithographyUSPTO Application #: 20070020814Title: Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography Abstract: Methods of forming semiconductor packages include immersing a semiconductor device assembly in a liquid photopolymerizable resin including a plurality of discrete particles dispersed therethrough, and selectively at least partially curing portions of the resin adjacent at least one semiconductor die of the semiconductor device assembly. In some embodiments, the semiconductor device assembly may be immersed in a second liquid photopolymerizable resin having at least one physical property differing from the first liquid photopolymerizable resin, and the second liquid photopolymerizable resin may be selectively at least partially cured. Furthermore, the semiconductor die may have an active surface including an array of optically interactive semiconductor devices, and portions of the liquid photopolymerizable resin surrounding a periphery of the array may be selectively at least partially cured to form a substantially opaque support structure. (end of abstract) Agent: Trask Britt - Salt Lake City, UT, US Inventors: David R. Hembree, Warren M. Farnworth USPTO Applicaton #: 20070020814 - Class: 438124000 (USPTO) Related Patent Categories: Semiconductor Device Manufacturing: Process, Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor, Metallic Housing Or Support, And Encapsulating The Patent Description & Claims data below is from USPTO Patent Application 20070020814. Brief Patent Description - Full Patent Description - Patent Application Claims Continue reading... Full patent description for Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography or other areas of interest. ### Previous Patent Application: Device and method for package warp compensation in an integrated heat spreader Next Patent Application: Process for exposing solder bumps on an underfill coated semiconductor Industry Class: Semiconductor device manufacturing: process ### FreshPatents.com Support Thank you for viewing the Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography patent info. IP-related news and info Results in 2.40349 seconds Other interesting Feshpatents.com categories: Accenture , Agouron Pharmaceuticals , Amgen , AT&T , Bausch & Lomb , Callaway Golf |
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