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Methods and apparatus for providing fluid to a semiconductor device processing apparatusMethods and apparatus for providing fluid to a semiconductor device processing apparatus description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20060207671, Methods and apparatus for providing fluid to a semiconductor device processing apparatus. Brief Patent Description - Full Patent Description - Patent Application Claims
[0001] The present application is a continuation of U.S. patent application Ser. No. 11/048,106, filed Jan. 28, 2005, which claims priority from U.S. Provisional Patent Application Ser. No. 60/540,540, filed Jan. 30, 2004. Both of these patent applications are incorporated by reference herein in their entirety. FIELD OF THE INVENTION [0002] The present invention relates generally to semiconductor device manufacturing, and more particularly to methods and apparatus for providing fluid to a semiconductor device processing apparatus. BACKGROUND OF THE INVENTION [0003] While manufacturing a semiconductor device, a substrate may be processed by a semiconductor device processing apparatus, such as a polishing device. A polishing device may dispense a fluid, such as a chemical (e.g., a slurry) or water (e.g., deionized (DI) water), to the substrate being processed. To supply chemicals and/or DI water to a polishing device, a plurality of valves that form a valve system may be employed. Generally, a plurality of separate valves are coupled together to form the valve system. The use of separate valves, however, is costly and non-compact. Such a valve system typically cannot be included in a polishing device. Accordingly, improved methods and apparatus are desired for providing fluid to a semiconductor device processing apparatus. SUMMARY OF THE INVENTION [0004] In a first aspect of the invention, a valve assembly is provided. The valve assembly is adapted to provide fluid to a semiconductor device processing apparatus and includes a valve assembly output adapted to output at least one of DI water and a chemical. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to circulate the chemical to a chemical return; and (3) a second output adapted to output the chemical to the valve assembly output. The valve assembly also includes a second valve positioned downstream from the first valve. The second valve includes (1) an input adapted to receive deionized (DI) water; and (2) an output adapted to output DI water to the valve assembly output. A check valve is coupled between the second output of the first valve and the output of the second valve. The first valve, second valve and check valve are included in a single manifold. [0005] In a second aspect of the invention, a fluid dispensing system is provided. The fluid dispensing system is adapted to provide fluid to a semiconductor device processing apparatus and includes a plurality of the above described valve assemblies within a single manifold. [0006] In a third aspect of the invention, a semiconductor device processing apparatus is provided that includes a polishing device and a valve assembly coupled to the polishing device. The valve assembly is adapted to provide fluid to the polishing device and includes a valve assembly output adapted to output at least one of DI water and a chemical to the polishing device. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to circulate the chemical to a chemical return; and (3) a second output adapted to output the chemical to the valve assembly output. The valve assembly also includes a second valve positioned downstream from the first valve. The second valve includes (1) an input adapted to receive deionized (DI) water; and (2) an output adapted to output DI water to the valve assembly output. A check valve is coupled between the second output of the first valve and the output of the second valve. The first valve, second valve and check valve are included in a single manifold. Numerous other aspects are provided, as are methods in accordance with these other aspects of the invention. [0007] Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings. BRIEF DESCRIPTION OF THE FIGURES [0008] FIG. 1 illustrates an exemplary fluid dispensing system in accordance with an embodiment of the present invention. [0009] FIG. 2 is a cross-sectional schematic representation of a valve assembly included in the fluid dispensing system in accordance with an embodiment of the present invention. [0010] FIG. 3 is a schematic representation of a second exemplary fluid dispensing system in accordance with an embodiment of the present invention. [0011] FIG. 4 is a block diagram of a third exemplary fluid dispensing system, which is an alternative embodiment of the second exemplary fluid dispensing system. DETAILED DESCRIPTION [0012] The present invention relates to reducing the space occupied by (e.g., footprint) and cost of a fluid dispensing system for providing or dispensing fluid to a semiconductor device processing apparatus. Further, the volume of dead legs included in the fluid dispensing system is greatly reduced when compared to conventional fluid dispensing systems. [0013] FIG. 1 illustrates an exemplary fluid dispensing system in accordance with an embodiment of the present invention. With reference to FIG. 1, the fluid dispensing system 101 is coupled to a chemical source 103, such as a slurry supply. The fluid dispensing system 101 receives a chemical (e.g., slurry) output from the chemical source 103. Similarly, the fluid dispensing system 101 is coupled to a supply of water (e.g., deionized (DI) water) 105 and receives DI water output from the supply of water 105. The fluid dispensing system 101 also is coupled to a chemical return 107 and a DI water return 109. When the fluid dispensing system 101 is not using the chemical received from the chemical source 103 and/or the DI water received from the supply of DI water 105, the fluid dispensing system 101 may circulate the chemical and/or the DI water by outputting the chemical and/or DI water to the chemical return 107 and/or the DI water return 109, respectively. [0014] In one embodiment, the fluid dispensing system 101 is coupled to and included in a semiconductor device processing apparatus 111, such as a polishing device for performing chemical mechanical polishing. In other embodiments, the fluid dispensing system 101 may be external to the semiconductor device processing apparatus 111. Assuming that the semiconductor device processing apparatus 111 is a polishing device, the semiconductor polishing device 111 may include and/or be coupled to a scrubbing device 113 for removing polishing chemicals and particulates from the surface of a substrate being processed by the polishing device 111. An output of the fluid dispensing system 101 is coupled to the scrubber device 113 and provides the chemical and/or DI water to the scrubber device 113 during substrate processing. [0015] FIG. 2 is a cross-sectional schematic representation of a valve assembly 201 included in the fluid dispensing system 101 in accordance with an embodiment of the present invention. The valve assembly 201 is adapted to receive fluid and output (e.g., provide) fluid to the semiconductor device processing apparatus 111. With reference to FIG. 2, the valve assembly 201 includes a first valve 203 coupled to a second valve 205. The first valve 203 is adapted to (1) receive a chemical from the chemical source or supply 103 and circulate the chemical to the chemical return 107; or (2) output the chemical to the semiconductor device processing apparatus 111. More specifically, the first valve 203 includes a first input 207 adapted to couple to the chemical source 103 and receive the chemical from the chemical source 103. The first valve 203 includes a first output 209 (e.g., a chemical-return output) adapted to couple to the chemical return 107 and circulate the chemical by outputting the chemical to the chemical return 107. The size (e.g., diameter) of the first output 209 may be smaller than the size of the first input 207 to provide increased back pressure. Further, the first valve 203 includes a second output 211 adapted to output the chemical toward an output 213 of the valve assembly 201. Therefore, in the embodiment shown, the first valve 203 is a three-way valve with one input and two outputs. Valves of different configurations and/or types may be employed as the first valve 203. [0016] The first valve 203 includes a manual override switch 215 (e.g., a tap) adapted to prevent the first valve 203 from outputting the chemical from the second output 211. Therefore, actuating (e.g., turning on) the manual override switch 215 may prevent (e.g., lock out) one or more components of the semiconductor device processing apparatus 111 to which the valve assembly 201 is coupled from receiving the chemical until the manual override switch 215 is turned off. In one embodiment, the default setting of the manual override switch 215 is on, which prevents one or more components of the semiconductor device processing apparatus 111 from receiving the chemical. In other embodiments, the default setting of the manual override switch 215 may be off. It should be noted that the first valve 203 of the valve assembly 201 incorporates the functionality of two valves (e.g., a manual valve and three-way valve) into a single valve, thereby minimizing the space required by the valve assembly 201. [0017] The valve assembly 201 includes a second valve 205 coupled to the first valve 203 via a check valve 217. The check valve 217 is adapted to permit a one-way flow of fluid in the valve assembly 201 (as described below). The second valve 205 is positioned downstream from the first valve 203. More specifically, the second output 211 of the first valve 203 is coupled to an output 219 of the second valve 205 via the check valve 217. [0018] The second valve 205 is adapted to receive and output DI water. More specifically, the second valve 205 includes an input 221 adapted to couple to the DI water supply 105 and receive DI water from the DI water supply 105 of the fluid dispensing system 101. The output 219 of the second valve 205 is coupled to the output 213 of the valve assembly 201 and adapted to output DI water thereto. In one embodiment, the second valve 205 is a two-way valve. However, different configurations and/or types of valves may be employed as the second valve 205. [0019] As shown in FIG. 2, the output 213 of the valve assembly 201 is coupled to the first valve 203 (e.g., via the second output 211 of the first valve 203) and to the second valve 205 (e.g., via the output 219 of the second valve 205). The output 213 of the valve assembly 201 is adapted to output (e.g., dispense) the chemical, which is received from the first valve 203, and/or DI water, which is received from the second valve 205, from the valve assembly 201 to the semiconductor device processing apparatus 111. Continue reading about Methods and apparatus for providing fluid to a semiconductor device processing apparatus... 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