| Methods and apparatus for polishing an edge of a substrate -> Monitor Keywords |
|
|
  Methods and apparatus for polishing an edge of a substrateUSPTO Application #: 20070238393Title: Methods and apparatus for polishing an edge of a substrate Abstract: Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided. (end of abstract)
Agent: Dugan & Dugan, PC - Tarrytown, NY, US Inventors: Ho Seon Shin, Gary C. Ettinger, Donald J.K. Olgado, Erik C. Wasinger, Sen-Hou Ko, Charles I. Dodds, Yufei Chen, Wei-Yung Hsu USPTO Applicaton #: 20070238393 - Class: 451005000 (USPTO) Related Patent Categories: Abrading, Precision Device Or Process - Or With Condition Responsive Control, Computer Controlled The Patent Description & Claims data below is from USPTO Patent Application 20070238393. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This patent application claims priority from U.S. Provisional Patent Application Ser. No. 60/787,438, filed Mar. 30, 2006 and entitled "METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE" (Attorney Docket No. 10560/L/PPC/CMP/CKIM), which is hereby incorporated by reference herein in its entirety. [0002] Further, the present application is related to the following commonly-assigned, co-pending U.S. patent applications, each of which is hereby incorporated herein by reference in its entirety for all purposes: [0003] U.S. patent application Ser. No. 11/298,555 filed on Dec. 9, 2005 and entitled "METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE" Attorney Docket No. 10414); and [0004] U.S. patent application Ser. No. 11/299,295 filed on Dec. 9, 2005 and entitled "METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE" (Attorney Docket No. 10121). FIELD OF THE INVENTION [0005] The present invention relates generally to substrate processing, and more particularly to methods and apparatus for polishing an edge of a substrate. BACKGROUND [0006] Conventional systems, which contact a substrate edge with an abrasive film to clean the edge, may not thoroughly polish or clean the edge. For example, the abrasive film may not sufficiently contact both bevels of the edge during cleaning. Additionally, the abrasive film may become worn from use, and therefore, lose its ability to sufficiently clean the substrate and require frequent replacement, which may affect semiconductor device manufacturing throughput. Accordingly improved methods and apparatus for cleaning an edge of a substrate are desired. SUMMARY OF THE INVENTION [0007] In a first aspect of the invention, a method of polishing an edge of a substrate is provided. The method includes (1) rotating a substrate against a polishing film so as to remove material from the edge of the substrate and (2) detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. Embodiments of the method further include (3) determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; (4) ascertaining a difference between the determined amount of material removed and a preset polish level; and (5) determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. [0008] In a second aspect of the invention, an alternative method of polishing an edge of a substrate is provided. The method includes (1) rotating a substrate against a polishing film so as to remove material from the edge of the substrate and (2) detecting an amount of force exerted in pressing the polishing film against the substrate. Embodiments of the method include (3) determining an amount of material removed from the edge of the substrate based on the detected force exerted in pressing the polishing film against the rotating substrate; (4) ascertaining a difference between the determined amount of material removed and a preset polish level; and (5) determining a level of force to be applied to the polishing film adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level and adjusting the force to the determined level. [0009] In a third aspect of the invention, a system adapted to polish an edge of a substrate comprising is provided. The system includes (1) a substrate rotation driver adapted to rotate the edge of a substrate against a polishing film and (2) a first sensor coupled to the rotation driver adapted to detect one of an energy and torque exerted by the substrate rotation driver as it rotates the substrate against the polishing film. Embodiments of the system further include (3) a controller coupled to the first sensor and to the substrate rotation driver adapted to receive from the first sensor a signal indicative of the detected energy or torque exerted by the substrate rotation driver and adapted to transmit control signals to the substrate rotation driver based on the detected energy or torque exerted. [0010] In a fourth aspect of the invention, an apparatus adapted to apply a preset pressure to a polishing film in contact with an edge of a substrate is provided. The apparatus includes (1) an actuator adapted to apply a preset pressure to the polishing film and (2) a controller coupled to the actuator and adapted to receive a signal indicative of a condition of the edge of the substrate, and to adjust a pressure applied by the actuator to the polishing film so as to maintain the preset pressure based on the received signal. [0011] Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings. BRIEF DESCRIPTION OF THE FIGURES [0012] FIG. 1 is a schematic illustration of a cross-section of a portion of a substrate. [0013] FIG. 2 is a schematic illustration depicting an example embodiment of an edge cleaning apparatus according to the present invention. [0014] FIGS. 3A and 3B are close-up front and side cross-sectional schematic views, respectively, of a portion of the edge cleaning apparatus of FIG. 2. [0015] FIG. 4 is a perspective view depicting an example embodiment of an edge cleaning apparatus according to the present invention. [0016] FIG. 5 is a perspective view depicting another example embodiment of an edge cleaning apparatus according to the present invention. [0017] FIG. 6 is a perspective view of a portion of the example embodiment depicted in FIG. 5. [0018] FIGS. 7A and 7B are close-up perspective views of different embodiments of replaceable cassettes for use with embodiments of the present invention. [0019] FIGS. 8A through 8C are close-up perspective views of different embodiments of pads for use with embodiments of the present invention. Continue reading... Full patent description for Methods and apparatus for polishing an edge of a substrate Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Methods and apparatus for polishing an edge of a substrate patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Methods and apparatus for polishing an edge of a substrate or other areas of interest. ### Previous Patent Application: Service tee cutting apparatus and abandonment method Next Patent Application: Method and system for endpoint detection Industry Class: Abrading ### FreshPatents.com Support Thank you for viewing the Methods and apparatus for polishing an edge of a substrate patent info. IP-related news and info Results in 0.62598 seconds Other interesting Feshpatents.com categories: Software: Finance , AI , Databases , Development , Document , Navigation , Error |
||
