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  Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive filmUSPTO Application #: 20070246165Title: Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film Abstract: A method of producing a semiconductor package enabling a sheet-like adhesive film to be used as it is and thereby reducing loss and enabling mounting without the piece of adhesive film sticking out from the semiconductor chip, comprising forming cutting-off notches in an adhesive film provided on a support film from the adhesive film side down to the surface of the support film or a depth D in the middle and cutting the adhesive film to pieces of predetermined size, then stretching the support film to separate the cut individual piece of the adhesive film, attaching semiconductor chip to the cut individual piece of the adhesive film, and mounting the semiconductor chip on a substrate by the piece of adhesive film, and an apparatus for producing a semiconductor package and adhesive film for use with that method. (end of abstract) Agent: Rader Fishman & Grauer PLLC - Washington, DC, US Inventor: Osamu Yamagata USPTO Applicaton #: 20070246165 - Class: 156505000 (USPTO) The Patent Description & Claims data below is from USPTO Patent Application 20070246165. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a method of producing a semiconductor package, an apparatus for producing a semiconductor package, and an adhesive film, more particularly relates to a method of producing a semiconductor package called "system-in-package (SiP)" and an apparatus for producing a semiconductor package and an adhesive film used for the same. [0003] 2. Description of the Related Art [0004] Demand for reducing the size, thickness, and weight of digital video cameras, digital mobile phones, notebook computers, and other portable electronic devices has been growing increasingly stronger. To meet with this, VSLIs and other semiconductor packages have been reduced 70% in size in the past three years. On the other hand, how to raise the mounting density of components on mounting boards (printed circuit boards) has been the subject of much R&D for electronic circuit devices comprising such semiconductor packages mounted on printed circuit boards. [0005] For example, semiconductor packages have been shifting from the DIP (dual in-line package) and other surface mounted types to flip-chip mounted types providing the pad electrodes of semiconductor chips with bumps made of solder, gold, etc. and connecting the chips to the circuit boards through the bumps in a state where the surfaces provided with bumps face the boards (face down). [0006] Further, types forming multilayer interconnects also known as reinterconnect layers on the semiconductor chips and the complicated types known as "system-in-packages (SiP)" packaged by burying coils or other passive devices or other semiconductor chips between insulating layers insulating the reinterconnect layers formed on the semiconductor chips are being developed. [0007] As the method of producing a semiconductor package burying other semiconductor chip between the insulating layers insulating the reinterconnect layers formed on semiconductor chip, the method of die bonding other semiconductor chip (hereinafter sometimes simply referred to as "semiconductor chip") on semiconductor chip serving as a substrate (hereinafter sometimes simply referred to as "substrate") and forming insulating layers comprised of resin layers containing the reinterconnect layers covering the same is widely known. [0008] In this method of producing a semiconductor package, as the method of die bonding the semiconductor chip on the substrate, the method of grinding down the wafer from the back side when the semiconductor chip is supplied in the wafer state before dicing, laminating a die-attach film (adhesive film) in the wafer state, dicing the wafer to obtain the individual semiconductor chips, and mounting the obtained semiconductor chip to the substrate face up or face down is widely used. [0009] On the other hand, when the semiconductor chips are supplied in a state already separated into individual units, usually they are supplied on 4 inch diameter chip trays and are mounted face up or face down on the substrates of the SiPs by die bonding. Here, there are restrictions derived from the multiple layers in the wafer state and the resin forming the SiPs etc., so the semiconductor chips of the SiP have to be reduced in thickness to about 50 .mu.m. The individually separated semiconductor chips are reduced in thickness by the following procedure. That is, a package use monitor wafer is attached to the center of a protective tape for use in grinding down the semiconductor chips, the individually separated semiconductor chips are arranged around it, and the chips are ground down while monitoring the thickness of the monitor wafer. [0010] The ground down thin semiconductor chip is then reattached to transfer sheet etc. for mounting on the substrate and supplied to a die bonder. Here, for example when using an insulating paste in a die bonder for bonding face up, a scrubbing operation becomes necessary to make the paste a uniform thickness. However, thin semiconductor chip lacks strength and is liable to break, so cannot be scrubbed. Therefore, thin semiconductor chip cannot be bonded by paste. Accordingly, thin semiconductor chip is bonded using a uniform thickness die-attach film. [0011] A die-attach film, as shown in the schematic view of FIG. 1, is usually supplied in the form of a roll R1. This has a width W1 far greater than the width of the semiconductor chip, so at the time of actual use, as shown in the schematic view of FIG. 2, it is cut corresponding to the width W2 of the semiconductor chip to obtain the roll R2. As shown in the schematic view of FIG. 3, the film is fed out and cut from the roll R2 by a cutter 100 into the size of the semiconductor chip. The semiconductor chip 102 is then bonded to the thus obtained predetermined sized piece of die-attach film 101 using a collet 103. The thus obtained semiconductor chip with the piece of die-attach film bonded to it is transported by a suction collet to the substrate and mounted on the substrate. [0012] In the above method however, it is necessary to prepare a roll cut to the width of the chip. When handling several types of semiconductor chips of different sizes, the loss ends up becoming greater. Further, precise bonding to the semiconductor chip after cutting is difficult. The piece of die-attach film easily sticks out from the semiconductor chip. When actually sticking out, the part where the piece of die-attach film stick out lacks photosensitivity and via holes cannot be formed, so interconnect defects are liable to occur. [0013] Summarizing the problems to be solved by the invention, when mounting an individually separated thin semiconductor chip on a substrate, the loss of the die-attach film (adhesive film) is great and the piece of die-attach film sticks out from the semiconductor chip to easily cause an interconnect defect. SUMMARY OF THE INVENTION [0014] An object of the present invention is to provide a method of producing a semiconductor package enabling a sheet-like adhesive film to be used as it is and thereby reducing loss and enabling mounting without the piece of the adhesive film sticking out from the semiconductor chip and an apparatus for producing a semiconductor package and an adhesive film for use with that method. [0015] According to a first aspect of the present invention, there is provided a method of producing a semiconductor package mounting a semiconductor chip on a substrate by an adhesive film, comprising the steps of forming cutting-off notches in the adhesive film provided on a support film from the adhesive film side down to a surface or a midway depth of the support film to cut-off the adhesive film into predetermined sized pieces; stretching the support film to separate the adhesive film into the cut individual pieces; attaching a semiconductor chip to the cut individual piece of the adhesive film; and mounting the semiconductor chip on the substrate by the piece of adhesive film. [0016] According to a second aspect of the present invention, there is provided an apparatus for producing a semiconductor package mounting a semiconductor chip on a substrate by an adhesive film, comprising a support which supports a support film on which an adhesive film having cutting-off notches into a plurality of pieces having a predetermined size is provided; a pushup tool having a rounded tip which pushes up the support film from the back side of the surface on which the adhesive film is provided so as to stretch the support film and separate the adhesive film into the cut individual pieces; a suction unit which picks up the semiconductor chip by suction and attaches the semiconductor chip to the individual cut piece of adhesive film and which picks up by suction the semiconductor chip on which the piece of adhesive film is attached and mounts the semiconductor chip on the substrate. [0017] According to a third aspect of the present invention, there is provided an adhesive film for bonding a semiconductor chip to a substrate, provided on a support film, and having cutting-off notches from the adhesive film side down to a surface or a midway depth of the support film, for cutting-off the adhesive film into a plurality of pieces having a predetermined size. BRIEF DESCRIPTION OF THE DRAWINGS [0018] These and other objects and features of the present invention will become clearer from the following description of the preferred embodiments given with reference to the attached drawings, wherein: [0019] FIG. 1 is a schematic view of the configuration of a die-attach film of the related art; [0020] FIG. 2 is a schematic view of the configuration of a die-attach film of the related art; [0021] FIG. 3 is a schematic view of the steps of production of semiconductor packages according to the related art; Continue reading... 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