| Method of manufacturing wiring board, and liquid ejection head having wiring board -> Monitor Keywords |
|
|
  Method of manufacturing wiring board, and liquid ejection head having wiring boardRelated Patent Categories: Electrolysis: Processes, Compositions Used Therein, And Methods Of Preparing The Compositions, Electrolytic Coating (process, Composition And Method Of Preparing Composition), Forming Nonelectrolytic Coating Before Depositing Predominantly Single Metal Or Alloy Electrolytic CoatingThe Patent Description & Claims data below is from USPTO Patent Application 20070023293. Brief Patent Description - Full Patent Description - Patent Application Claims
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a method of manufacturing a wiring board, and a liquid ejection head having the wiring board, and more particularly to manufacturing technology for a wiring board in which plating wires are formed in grooves formed by resin molding. [0003] 2. Description of the Related Art [0004] Circuit wiring technology for performing high-density installation has been developed for electronic devices, in order to achieve size and weight reductions, and high functionality, in such devices. [0005] For example, a two-shot molding method and a one-shot molding method are known for manufacturing circuit components having conductive circuit wires formed on a substrate made of synthetic resin. [0006] In the two-shot molding method, firstly, primary molding is carried out using a resin containing a plating catalyst, whereupon surface roughening (etching) is performed on the primary molding object. Alternatively, the primary molding object is formed of a resin that contains no plating catalyst, and surface roughened, then has a plating catalyst deposited on the roughened surface. Thereupon, secondary molding is carried out so as to partially cover the primary molding object with a resin that contains no plating catalyst. Electroless plating or electrolytic plating is then carried out on the exposed surfaces of the primary molding object, thereby depositing metal onto the circuit forming sections corresponding to the exposed parts of the primary molding object. In this way, in the two-shot molding method, the molding is carried out twice. [0007] In the one-shot molding method, circuit forming sections are molded in a prescribed shape from synthetic resin, and surface roughening and plating catalyst deposition are then carried out over the whole surface of the molding object. Thereupon, electroless plating is performed over the whole surface of the molding object, the parts other than the circuit forming sections are masked, and the plating in the areas other than the masked areas is removed, whereupon electrolytic plating is performed on the circuit forming sections, thereby depositing metal on the circuit forming sections. [0008] However, the two-shot molding method involves a large amount of waste, since it uses the plating catalyst for the whole of the primary molding object, and furthermore, the manufacturing process becomes complex, since it requires two molding steps: primary molding and secondary molding. [0009] The one-shot molding method requires a complicated manufacturing process, and also creates wasted material. What is more, if surface roughening is carried out by using strongly acidic chemicals, such as chromic acids, in addition to problems relating to environmental suitability, there is also a drawback in that if the plating in the regions outside the mask is removed by sandblasting with micro-particles, or the like, then scratches are liable to occur due to the scattering of the micro-particles, and non-uniformities arise. [0010] In view of this, Japanese Patent Application Publication No. 2002-270995 discloses a method of manufacturing a circuit component in which a molded component is formed by molding synthetic resin into a prescribed external shape, preparation processing (surface roughening) is performed by wet blasting on the circuit forming surface of the molded component, a plating catalyst is deposited on the circuit forming surface that has undergone preparation processing, and the plating catalyst is then activated. Subsequently, electroless plating is performed at locations that are to form conducting sections, and electrolytic plating is then carried on the electroless plating sections, thereby forming conducting sections on the circuit forming surface. [0011] Furthermore, Japanese Patent Application Publication No. 2005-50992 discloses a wiring board in which non-conductive metal-containing resin layers containing dispersed metal micro-particles, are formed selectively on a wiring board which is formed by transfer of a visible image by an electrophotographic method, whereupon a conductive metal layer is formed on top of the metal-containing resin layer, by means of electroless plating and/or electrolytic plating, and a thermally curable resin layer is then formed between the respective metal-containing resin layers on the substrate. [0012] However, in the method disclosed in Japanese Patent Application Publication No. 2002-270995, desired conducting layers are formed after surface roughening by wet blasting and selective catalytic activation (patterning) by UV or heat treatment; however, the selective catalytic activation by UV irradiation or heat treatment is substantially a patterning step, and hence there is no substantial reduction in the number of plating steps. Furthermore, there is also a problem in that it is difficult to carry out patterning by UV irradiation or heat treatment, on the surface of the resin molding that has been formed freely to a desired shape. [0013] Moreover, the wiring board disclosed in Japanese Patent Application Publication No. 2005-50992 involves the selective formation of conducting layers by electrophotography. Since the patterning of the conducting layers is carried out by electrophotography, then it is impossible to achieve a resolution exceeding the resolution of the electrophotographic process. Furthermore, it is difficult to carry out patterning by electrophotography on the surface of a resin molding that has been formed freely to a desired shape. SUMMARY OF THE INVENTION [0014] The present invention has been contrived in view of the foregoing circumstances, an object thereof being to provide a method of manufacturing a wiring board, and a liquid ejection head comprising this wiring board, whereby the plating process is shortened, the adhesion of the plating is improved, and conducting layers can be formed on a surface having a freely designed shape. [0015] In order to attain the aforementioned object, the present invention is directed to a method of manufacturing a wiring board, comprising the steps of: forming a flow channel by covering a groove formed in a resin substrate by means of a covering member; and filling a liquid containing conductive metal into the flow channel, and depositing the conductive metal onto wall faces of the flow channel. [0016] According to the present invention, close adhesion of conductive metal to the flow channel (groove) is improved, and furthermore, the manufacturing process can be simplified. [0017] Preferably, the resin substrate is formed by resin molding by filling a resin material into a mold and curing the resin material. [0018] According to this aspect of the present invention, high-density wiring becomes possible, and the freedom of the substrate shape and the wiring shape is increased. [0019] Preferably, the liquid containing conductive metal is a material which, when making contact with an electroless plating liquid, induces electroless precipitation of the metal that is to be deposited; and the method further comprises the step of forming an electroless plating layer by using the metal having been deposited on the flow channel as an origin. [0020] According to this aspect of the present invention, it is possible to reduce the wiring resistance and to form wires which are able to flow high current. Furthermore, the material inducing electroless precipitation of the metal that is to be plated by making contact with an electroless plating liquid is, for example, an active plating catalyst material, such as palladium (Pd). [0021] Preferably, the method further comprises the step of forming an electrolytic plating layer by using the electroless plating layer as a seed layer. [0022] According to this aspect of the present invention, in situations involving a very small signal system and limited wiring area, it is possible significantly to reduce the steps in the conducting layer formation process by using the wiring process up to the electroless plating step. Continue reading... Full patent description for Method of manufacturing wiring board, and liquid ejection head having wiring board Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Method of manufacturing wiring board, and liquid ejection head having wiring board patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Method of manufacturing wiring board, and liquid ejection head having wiring board or other areas of interest. ### Previous Patent Application: Small object moving on printed circuit board Next Patent Application: Microreactors and methods for generating hydrogen peroxide Industry Class: Electrolysis: processes, compositions used therein, and methods of preparing the compositions ### FreshPatents.com Support Thank you for viewing the Method of manufacturing wiring board, and liquid ejection head having wiring board patent info. IP-related news and info Results in 0.17764 seconds Other interesting Feshpatents.com categories: Novartis , Pfizer , Philips , Polaroid , Procter & Gamble , |
||
