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01/25/07 | 50 views | #20070020799 | Prev - Next | USPTO Class 438 | About this Page  438 rss/xml feed  monitor keywords

Method of manufacturing a variable resistance structure and method of manufacturing a phase-change memory device using the same

USPTO Application #: 20070020799
Title: Method of manufacturing a variable resistance structure and method of manufacturing a phase-change memory device using the same
Abstract: In methods of manufacturing a variable resistance structure and a phase-change memory device, after forming a first insulation layer on a substrate having a contact region, a contact hole exposing the contact region is formed through the first insulation layer. After forming a first conductive layer on the first insulation layer to fill up the contact hole, a first protection layer pattern is formed on the first conductive layer. The first conductive layer is partially etched to form a contact and to form a pad on the contact. A second protection layer is formed on the first protection layer pattern, and then an opening exposing the pad is formed through the second protection layer and the first protection layer pattern. After formation of a first electrode, a phase-change material layer pattern and a second electrode are formed on the first electrode and the second protection layer. (end of abstract)
Agent: Marger Johnson & Mccollom, P.C. - Portland, OR, US
Inventors: Suk-Hun CHOI, Chang-Ki HONG, Yoon-Ho SON, Jang-Eun HEO
USPTO Applicaton #: 20070020799 - Class: 438103000 (USPTO)
Related Patent Categories: Semiconductor Device Manufacturing: Process, Having Selenium Or Tellurium Elemental Semiconductor Component, Direct Application Of Electrical Current
The Patent Description & Claims data below is from USPTO Patent Application 20070020799.
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