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09/07/06 - USPTO Class 428 | 15 views | #20060198992 | Prev - Next | About this Page

Method of fabricating polishing pad having detection window thereon

Title: Method of fabricating polishing pad having detection window thereon

Related Patent Categories: Stock Material Or Miscellaneous Articles, Structurally Defined Web Or Sheet (e.g., Overall Dimension, Etc.), Nonplanar Uniform Thickness Material

Brief Patent Description - Full Patent Description - Patent Claims

The Patent Description & Claims data below is from USPTO Patent Application 20060198992, Method of fabricating polishing pad having detection window thereon.

1. A polishing pad, comprising: a transparent part having an uneven side surface, wherein the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape; and a high molecular weight layer encircling the transparent part.

2. The polishing pad of claim 1, wherein a material of the transparent part is a thermosetting plastic.

3. The polishing pad of claim 1, wherein a material of the transparent part is selected from the following group consisting of a fully transparent high molecular weight material and a semi-transparent high molecular weight material.

4. The polishing pad of claim 1, wherein a material of the transparent part is selected from the following group consisting of acrylic resin (PMMA), polyurethane (PU), polyvinyl chloride (PVC), epoxy resin and unsaturated polyester (UP).

5. The polishing pad of claim 1, wherein the transparent part has a central portion thicker than a peripheral portion.

6. The polishing pad of claim 1, wherein the transparent part has a shape selected from the following group consisting of round, elliptical and tetragonal.

7. The polishing pad of claim 1, wherein the high molecular weight layer is a polyurethane foam layer.

8. The polishing pad of claim 1, wherein the high molecular weight layer has an attrition rate equivalent to that of the transparent part.

9. The polishing pad of claim 1 further comprising a thermal adhesive disposed between the transparent part and the high molecular weight layer.

10. A polishing pad, comprising: a transparent part having an uneven side surface, wherein the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape; a first high molecular weight layer encircling a lower portion of the transparent part; and a second high molecular weight layer disposed on the first high molecular weight layer and enclosing an upper portion of the transparent part.

11. The polishing pad of claim 10, wherein a material of the transparent part is a thermosetting plastic.

12. The polishing pad of claim 10, wherein a material of the transparent part is selected from the following group consisting of a fully transparent high molecular weight material and a semi-transparent high molecular weight material.

13. The polishing pad of claim 10, wherein a material of the transparent part is selected from the following group consisting of acrylic resin (PMMA), polyurethane (PU), polyvinyl chloride (PVC), epoxy resin and unsaturated polyester (UP).

14. The polishing pad of claim 10, wherein the transparent part has a central portion thicker than a peripheral portion.

15. The polishing pad of claim 10, wherein the transparent part has a shape selected from the following group consisting of round, elliptical and tetragonal.

16. The polishing pad of claim 10, wherein the first high molecular weight layer is a polyurethane foam layer.

17. The polishing pad of claim 10, wherein the first high molecular weight layer has an attrition rate equivalent to that of the transparent part.

18. The polishing pad of claim 10, wherein a material of the second high molecular weight layer is selected from the following group consisting of polyurethane (PU), silicon rubber, polybutyl rubber (PBR), polyvinyl chloride (PVC) latex and polyacrylic acid series (PMMA) latex.

19. The polishing pad of claim 10, wherein the first high molecular weight layer has a hardness larger than that of the second high molecular weight layer.

20. The polishing pad of claim 10 further comprising a thermal adhesive disposed between the transparent part and the first high molecular weight layer.

21. The polishing pad of claim 10 further comprising a thermal adhesive disposed between the transparent part and the second high molecular weight layer.

22. A polishing pad, comprising: a transparent part having a side surface; a high molecular weight layer encircling the transparent part; and a thermal adhesive disposed between the high molecular weight layer and the side surface of the transparent part.

23. The polishing pad of claim 22, wherein a material of the transparent part is a thermosetting plastic.

24. The polishing pad of claim 22, wherein a material of the transparent part is selected from the following group consisting of a fully transparent high molecular weight material and a semi-transparent high molecular weight material.

25. The polishing pad of claim 22, wherein a material of the transparent part is selected from the following group consisting of acrylic resin (PMMA), polyurethane (PU), polyvinyl chloride (PVC), epoxy resin and unsaturated polyester (UP).

26. The polishing pad of claim 22, wherein the transparent part has a central portion thicker than a peripheral portion.

27. The polishing pad of claim 22, wherein the transparent part has a shape selected from the following group consisting of round, elliptical and tetragonal.

28. The polishing pad of claim 22, wherein the high molecular weight layer is a polyurethane foam layer.

29. The polishing pad of claim 22, wherein the high molecular weight layer has an attrition rate equivalent to that of the transparent part.

30. The polishing pad of claim 22, wherein the side surface of the transparent part is an uneven surface.

31. The polishing pad of claim 22, wherein the side surface of the transparent part is configured to have a shape selected from the following group consisting of a serrated shape, a wavy shape and a toothed shape.

Brief Patent Description - Full Patent Description - Patent Claims

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Stock material or miscellaneous articles

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