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  Method of fabricating organic light emitting displayUSPTO Application #: 20060068520Title: Method of fabricating organic light emitting display Abstract: A method of fabricating a donor substrate for a laser induced thermal imaging (LITI) process. A base substrate is prepared. A light-to-heat conversion layer is formed on the base substrate. A buffer layer is formed on the light-to-heat conversion layer. The surface roughness of the buffer layer is increased by treating the surface of the buffer layer. A transfer layer is formed on the surface-treated buffer layer. By using the donor substrate, a patterning process can be performed better during the fabrication of the OLED. (end of abstract) Agent: Robert E. Bushnell - Washington, DC, US Inventors: Myung-Won Song, Seong-Taek Lee, Byung-Doo Chin, Tae-Min Kang, Jae-Ho Lee, Mu-Hyun Kim USPTO Applicaton #: 20060068520 - Class: 438099000 (USPTO) Related Patent Categories: Semiconductor Device Manufacturing: Process, Having Organic Semiconductive Component The Patent Description & Claims data below is from USPTO Patent Application 20060068520. Brief Patent Description - Full Patent Description - Patent Application Claims
CLAIM OF PRIORITY [0001] This application claims priority to and the benefit of Korean Patent Application No. 2004-68757, filed Aug. 30, 2004, the disclosure of which is incorporated herein by reference in its entirety. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a method of fabricating an organic light emitting display (OLED) and, more particularly, to a method of fabricating an OLED using a donor substrate having a surface-treated buffer layer. [0004] 2. Description of the Related Art [0005] Among flat panel displays (FPDs), an organic light emitting display (OLED) is quite appropriate for a medium that displays moving images irrespective of its sizes because the OLED has a fast response speed of 1 millisecond or less and a wide viewing angle, consumes low power, and is an emissive display. Also, the OLED can be fabricated at low temperature and in a simple process based on a conventional semiconductor manufacturing technology. For these reasons, the OLED has attracted much attention as the next-generation flat panel display (FPD). [0006] The OLED can largely be classified into a polymer type using a wet process and a small-molecule type using a deposition process, according to the types of material and process used for an organic light emitting device. If an emission layer (EML) is formed of a small-molecule material, it is deposited in vacuum using a shadow mask. If the EML is formed of a polymer material, it is formed by an inkjet printing method. However, it is difficult to perform the vacuum deposition process using the shadow mask on a large-sized substrate. Also, since the inkjet printing method is a wet process, an underlying layer should be formed of only limited kinds of materials, and a bank structure should definitely be formed on a substrate. [0007] As a substitute for the above-described methods of patterning the EML, a laser-induced thermal imaging (LITI) process has recently been developed. [0008] During the LITI process, a pattern is formed by transferring a pattern forming material to a target substrate using laser beams irradiated from a light source. Such an LITI process requires a donor substrate on which a transfer layer is formed, a light source, and an acceptor substrate. [0009] The donor substrate includes a base substrate, a light-to-heat conversion layer, and a transfer layer. During a transfer process using the donor substrate, laser beams are irradiated on a predetermined region of the base substrate and then converted into heat by the light-to-heat conversion layer. The heat transforms adhesion properties between the transfer layer and the light-to-heat conversion layer so that the transfer layer is transferred to the acceptor substrate. [0010] Accordingly, the performance of the donor substrate depends on adhesion properties between the donor substrate and the transfer layer, and a poor adhesion between the transfer layer and the light-to-heat conversion layer may cause failures during the process of transferring the transfer layer to the acceptor substrate. SUMMARY OF THE INVENTION [0011] It is therefore an object of the present invention to solve aforementioned problems associated with conventional displays. [0012] It is also an object of the present invention to provide a method of fabricating an organic light emitting display (OLED) using a donor substrate, in which adhesion properties between the donor substrate and the transfer layer are enhanced and a patterning process can be performed better during the fabrication of the OLED by interposing a buffer layer between a transfer layer and a light-to-heat conversion layer and then surface-treating the buffer layer. [0013] It is still an object of the present invention to provide an improved method of transferring a pattern forming material to a target substrate. [0014] According to an aspect of the present invention, a method of fabricating a donor substrate for a laser induced thermal imaging (LITI) process includes: preparing a base substrate of a donor substrate; forming a light-to-heat conversion layer on the base substrate; forming a buffer layer on the light-to-heat conversion layer; increasing the surface roughness of the buffer layer by treating the surface of the buffer layer; and forming a transfer layer on the surface-treated buffer layer. [0015] According to an aspect of the present invention, a method of transferring a pattern forming material to a target substrate includes: preparing a donor substrate by a process comprising preparing a base substrate, forming a light-to-heat conversion layer on the base substrate, forming a buffer layer on the light-to-heat conversion layer, increasing surface roughness of the buffer layer, and forming a transfer layer on the surface-treated buffer layer; irradiating laser beams on a predetermined region of the donor substrate, the laser beams converted into heat by the light-to-heat conversion layer to transform adhesion properties between the transfer layer and the light-to-heat conversion layer; and transferring the transfer layer to the target substrate. [0016] According to still an aspect of the present invention, a method of transferring a pattern forming material to a target substrate includes: preparing a donor substrate, the donor substrate constructed with a transfer layer, a light-to-heat conversion layer, and a surface-treated buffer layer interposed between the transfer layer and the light-to-heat conversion layer; irradiating laser beams on a predetermined region of the donor substrate, the laser beams converted into heat by the light-to-heat conversion layer to transform adhesion properties between the transfer layer and the light-to-heat conversion layer; and transferring the transfer layer to the target substrate. [0017] The surface treatment of the buffer layer may be performed using oxygen ions or radical-based gases. BRIEF DESCRIPTION OF THE DRAWINGS [0018] A more complete appreciation of the present invention, and many of the above and other features and advantages of the present invention, will be readily apparent as the same becomes better understood by reference to the following detailed description when considered in conjunction with the accompanying drawings in which like reference symbols indicate the same or similar components, wherein: [0019] FIGS. 1A and 1B are cross-sectional views illustrating a method of fabricating a donor substrate for a laser induced thermal imaging (LITI) process according to an exemplary embodiment of the present invention; [0020] FIG. 2A is a photograph of the surface after forming a buffer layer; Continue reading... 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